SCHEMBL3675111

SCHEMBL3675111

CCO[Si](OCC)(OCC)C(C)[Si](C)(C)O[Si](C)(C)C(C)[Si](OCC)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4354632 0.91
SCHEMBL1819389 0.87
SCHEMBL7103186 0.84
SCHEMBL138891 0.81 LMNA (0.35)
SCHEMBL7103439 0.80
SCHEMBL331509 0.79 LMNA (0.30)
SCHEMBL21403444 0.79 LMNA (0.30)
SCHEMBL7617694 0.78 LMNA (0.33)
SCHEMBL19547824 0.78
SCHEMBL7101672 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250157825-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2025-05-15 US claimed
US-20240258111-A1 Surface Treatment Compositions and Methods FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2024-08-01 US claimed
US-20240093058-A1 POLYSILAZANE HARD COATING COMPOSITIONS MERCK PATENT GMBH (DE) 2024-03-21 US claimed
EP-4274866-A1 POLYSILAZANE HARD COATING COMPOSITIONS Merck Patent GmbH (DE) 2023-11-15 EP claimed
US-11447642-B2 Methods of using surface treatment compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2022-09-20 US claimed
WO-2022148757-A1 POLYSILAZANE HARD COATING COMPOSITIONS MERCK PATENT GMBH (DE) 2022-07-14 WO claimed
US-11174394-B2 Surface treatment compositions and articles containing same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2021-11-16 US claimed
EP-3830196-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM Electronic Materials U.S.A, Inc. (US) 2021-06-09 EP claimed
US-20210122925-A1 METHODS OF USING SURFACE TREATMENT COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2021-04-29 US claimed
EP-3735325-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM Electronic Materials U.S.A, Inc. (US) 2020-11-11 EP claimed
WO-2020028214-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2020-02-06 WO claimed
US-20200035494-A1 Surface Treatment Compositions and Methods FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2020-01-30 US claimed
US-20190211210-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2019-07-11 US claimed
WO-2019135901-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2019-07-11 WO claimed
US-8703866-B2 Room temperature curable organopolysiloxane composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-04-22 US claimed
US-20250157825-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2025-05-15 US disclosed
US-20250011628-A1 RELEASE COMPOSITION, ARTICLES PREPARED FROM THE RELEASE COMPOSITION, AND RELATED METHODS 3M INNOVATIVE PROPERTIES COMPANY 2025-01-09 US disclosed
US-20100130658-A1 ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-05-27 US disclosed
EP-2130873-A1 Room temperature curable organopolysiloxane composition Shin-Etsu Chemical Co., Ltd. (JP) 2009-12-09 EP disclosed
US-20090286916-A1 ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-11-19 US disclosed