SCHEMBL367607

SCHEMBL367607

NC(=O)c1ccc(C(=O)N2CCCCCCCCCC2)cc1

nearest known ligand 0.80

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 9/20 0.80
ALDH1A1 P00352 4/20 0.80
CA12 O43570 2/20 0.64
CA1 P00915 2/20 0.64
CA2 P00918 2/20 0.64
CA7 P43166 2/20 0.64
CA9 Q16790 2/20 0.64
CA14 Q9ULX7 2/20 0.64
MEN1 O00255 1/20 0.61
TSHR P16473 1/20 0.61
KMT2A Q03164 1/20 0.61
MAOA P21397 1/20 0.60
MAPK1 P28482 1/20 0.59
MLYCD O95822 2/20 0.58
USP2 O75604 1/20 0.58
MAPT P10636 1/20 0.57
LMNA P02545 1/20 0.57
MBTD1 Q05BQ5 3/20 0.56
L3MBTL3 Q96JM7 3/20 0.56
L3MBTL1 Q9Y468 2/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL170330 1.00 HPGD (0.80) HPGDALDH1A1CA12CA1CA2
SCHEMBL367947 1.00 HPGD (0.80) HPGDALDH1A1CA12CA1CA2
SCHEMBL1194042 1.00 HPGD (0.80) HPGDALDH1A1CA12CA1CA2
SCHEMBL367513 1.00 HPGD (0.80) HPGDALDH1A1CA12CA1CA2
SCHEMBL1160398 1.00 HPGD (0.80) HPGDALDH1A1CA12CA1CA2
Terephthalamide SCHEMBL1160108 1.00 HPGD (0.80) HPGDALDH1A1CA12CA1CA2
Terephthalamide SCHEMBL13724808 1.00 HPGD (0.80) HPGDALDH1A1CA12CA1CA2
SCHEMBL11857269 1.00 HPGD (0.80) HPGDALDH1A1CA12CA1CA2
SCHEMBL4560822 1.00 HPGD (0.80) HPGDALDH1A1CA12CA1CA2
SCHEMBL1159865 1.00 HPGD (0.80) HPGDALDH1A1CA12CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 651 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115819899-A Styrene composition with fiber point effect and preparation method thereof 金发科技股份有限公司 2023-03-21 CN claimed
CN-110229515-B High-heat-resistance polyamide composition and preparation method thereof 江苏晋伦塑料科技有限公司 2021-12-10 CN claimed
CN-113416413-A Glass fiber reinforced nylon 10T flame-retardant composite material and preparation method and application thereof 洪湖市一泰科技有限公司 2021-09-21 CN claimed
CN-111269565-A Injection molding metal surface and injection molding process 深圳市博耀新材料有限公司 2020-06-12 CN claimed
EP-3635039-A1 POLYAMIDE MATERIAL Ecole Polytechnique Fédérale de Lausanne (EPFL) (CH) 2020-04-15 EP claimed
CN-106928696-B Polyamide resin composition and molded article produced therefrom 乐天尖端材料株式会社 2020-02-28 CN claimed
CN-109071941-A Polyamide moulding composition and thus manufactured moulded work EMS专利股份公司 2018-12-21 CN claimed
EP-2297236-B1 FLAME RESISTANT SEMIAROMATIC POLYAMIDE RESIN COMPOSITION INCLUDING ZINC STANNATE, AND ARTICLES THEREFROM DU PONT (US) 2018-11-21 EP claimed
WO-2018206815-A1 POLYAMIDE MATERIAL ÉCOLE POLYTECHNIQUE FÉDÉRALE DE LAUSANNE (EPFL) (CH) 2018-11-15 WO claimed
EP-3401355-A1 POLYAMIDE MATERIAL Ecole Polytechnique Fédérale de Lausanne (EPFL) (CH) 2018-11-14 EP claimed
WO-2007106380-A2 APPARATUS HAVING IMPROVED WEAR-RESISTANT PROPERTIES E. I. DU PONT DE NEMOURS AND COMPANY (US) 2007-09-20 WO claimed
WO-2007106379-A1 PROCESS FOR THE PREPARATION OF MINERAL FILLED POLYAMIDE AND POLYESTER COMPOSITIONS EXHIBITING INCREASED MELT FLOW AND ARTICLES FORMED THEREFROM E. I. DU PONT DE NEMOURS AND COMPANY (US) 2007-09-20 WO claimed
US-20070213434-A1 Process for the preparation of mineral filled polyamide and polyester compositions exhibiting increased melt flow and articles formed therefrom E. I. DU PONT DE NEMOURS AND COMPANY 2007-09-13 US claimed
US-20070209922-A1 Apparatus having improved wear-resistant properties E. I. DU PONT DE NEMOURS AND COMPANY 2007-09-13 US claimed
US-20070155877-A1 Polyamide resin composition E. I. DU PONT DE NEMOURS AND COMPANY 2007-07-05 US claimed
WO-2007061965-A1 CARBON FIBER REINFORCED POLYAMIDE RESIN COMPOSITION E. I. DU PONT DE NEMOURS AND COMPANY (US) 2007-05-31 WO claimed
US-20070021558-A1 Polyamide resin composition SHINOHARA KENICHI 2007-01-25 US claimed
US-20060293427-A1 Thermally conductive polyamide-based components used in light emitting diode reflector applications E. I. DU PONT DE NEMOURS AND COMPANY 2006-12-28 US claimed
WO-2006135840-A1 THERMALLY CONDUCTIVE POLYAMIDE-BASED COMPONENTS USED IN LIGHT EMITTING DIODE REFLECTOR APPLICATIONS E. I. DU PONT DE NEMOURS AND COMPANY (US) 2006-12-21 WO claimed
WO-2006124659-A1 POLYAMIDE RESIN COMPOSITION E. I. DU PONT DE NEMOURS AND COMPANY (US) 2006-11-23 WO claimed