Oxalic Acid

Oxalic Acid

SCHEMBL36805

C[N+](C)(C)C.C[N+](C)(C)C.O=C([O-])C(=O)[O-]

nearest known ligand 0.58

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

OPRM1SLC6A4

The experimentally established mechanism targets of Oxalic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CA4 P22748 3/20 0.58
FAHD1 Q6P587 1/20 0.58
CA1 P00915 2/20 0.46
MEN1 O00255 1/20 0.38
LDHA P00338 1/20 0.38
BLM P54132 1/20 0.38
KMT2A Q03164 1/20 0.38
CHRNB2 P17787 1/20 0.36
CHRNA7 P36544 1/20 0.36
CHRNA4 P43681 1/20 0.36
BBOX1 O75936 4/20 0.35
SLC22A16 Q86VW1 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Oxalic Acid SCHEMBL1310796 0.96 CA4 (0.54) CA4FAHD1CA1MEN1LDHA
Oxalic Acid SCHEMBL27877457 0.96 CA4 (0.54) CA4FAHD1CA1MEN1LDHA
Oxalic Acid SCHEMBL3235689 0.96 CA4 (0.54) CA4FAHD1CA1MEN1LDHA
Oxalic Acid SCHEMBL17311835 0.89 CA4 (0.47) CA4FAHD1CA1MEN1LDHA
Tetramethylammonium Ion SCHEMBL104591 0.86 CA1 (0.50) CA4FAHD1CA1CHRNB2CHRNA7
Pyruvate SCHEMBL356399 0.84 CA4 (0.77) CA4FAHD1CA1MEN1LDHA
Oxalic Acid SCHEMBL36806 0.84 CA4 (0.44) CA4FAHD1CA1MEN1LDHA
Tetramethylammonium Ion SCHEMBL28084557 0.84 CA4 (0.44) CA4FAHD1CA1MEN1LDHA
Tetramethylammonium Ion SCHEMBL108420 0.82
Tetramethylammonium Ion SCHEMBL598303 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 436 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250283183-A1 NESTED-CLICKSEQ FOR TARGETED AMPLICON AND PROVIRUS/TRANSGENE JUNCTION SEQUENCING BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM 2025-09-11 US claimed
US-12404296-B2 Poly(A)-ClickSeq click-chemistry for next generation 3-end sequencing without RNA enrichment or fragmentation BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (US) 2025-09-02 US claimed
CN-119775946-A Polyurethane protective film with low film tearing voltage and preparation method thereof 泰兴联创绝缘材料有限公司 2025-04-08 CN claimed
CN-115970601-B Preparation method of water-water microsphere based on strong charge effect 中国药科大学 2024-12-27 CN claimed
CN-119101442-A Coating, preparation method and application thereof 广东金湾高景太阳能科技有限公司 2024-12-10 CN claimed
CN-118910200-A Preparation process of corn oligopeptide with antioxidant activity 湖北健肽生物科技有限公司 2024-11-08 CN claimed
CN-118020767-A Composite glutaraldehyde disinfectant and preparation method and application thereof 瑞先农佐海生物科技(北京)有限公司 2024-05-14 CN claimed
CN-117362465-A Method for extracting okra polysaccharide from okra 河北葵克生物科技有限公司 2024-01-09 CN claimed
US-20230304107-A1 Tiled ClickSeq for Targeted Virus Whole Genome Sequencing BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM 2023-09-28 US claimed
CN-115385433-B Composite silicon removing agent for steel industrial wastewater and preparation and use methods thereof 武汉钢铁有限公司 2023-06-27 CN claimed
US-20060054511-A1 Electrochemical deblocking using a hydrazine derivative CUSTOMARRAY, INC. 2006-03-16 US claimed
EP-1142832-B1 Ionic additives for extreme low dielectric constant chemical formulations APPLIED MATERIALS INC (US) 2004-12-15 EP claimed
US-20040087184-A1 Ionic additives for extreme low dielectric constant chemical formulations APPLIED MATERIALS INC., A DELAWARE CORPORATION 2004-05-06 US claimed
US-6576568-B2 Using organosilicon compound, nonionic surfactant and acid catalyst APPLIED MATERIALS, INC. 2003-06-10 US claimed
US-20030008525-A1 Ionic additives for extreme low dielectric constant chemical formulations APPLIED MATERIALS INC. 2003-01-09 US claimed
US-6462005-B1 AQUEOUS SOLUTION CONTAINING A QUARTERNARY AMMONIUM SALT, A FLUORO COMPOUND AND OPTIONALLY AN ORGANIC SOLVENT; PROTECTING DEPOSITION FILM TO BE REMOVED; NO CORROSION OF CONDUCTIVE LAYER BEING DECONTAMINATED TEXAS INSTRUMENTS INCORPORATED 2002-10-08 US claimed
US-20020042210-A1 Ionic additives for extreme low dielectric constant chemical formulations AIR PRODUCTS AND CHEMICALS, INC. 2002-04-11 US claimed
EP-1142832-A1 Ionic additives for extreme low dielectric constant chemical formulations APPLIED MATERIALS, INC. (US) 2001-10-10 EP claimed
US-5972862-A COMPRISING A FLUORINE-CONTAINING COMPOUND, A WATER-SOLUBLE OR WATER-MISCIBLE ORGANIC SOLVENT, AN ORGANIC ACID, AND A QUATERNARY AMMONIUM SALT MITSUBISHI GAS CHEMICAL (JP) 1999-10-26 US claimed
US-5393386-A Method for preparing aqueous quaternary ammonium hydroxide solution MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1995-02-28 US claimed