SCHEMBL3684573

SCHEMBL3684573

OCC1(CO)C=CC(c2ccccc2)=CC1

nearest known ligand 0.34

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.34
KDM1A O60341 1/20 0.33
NOTUM Q6P988 2/20 0.33
PDCD1 Q15116 1/20 0.31
CD274 Q9NZQ7 1/20 0.31
BACE1 P56817 1/20 0.30
ESR1 P03372 1/20 0.30
ESR2 Q92731 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11597242 0.90 SLC6A2 (0.35) LMNAKDM1A
SCHEMBL31424582 0.84 SLC6A2 (0.38)
SCHEMBL20337296 0.84
SCHEMBL9007112 0.84 KDM1A (0.33) KDM1A
SCHEMBL2783528 0.84
SCHEMBL28305153 0.84
SCHEMBL28984993 0.82 MMP2 (0.36)
SCHEMBL7398950 0.82 LMNA (0.33) LMNAKDM1ANOTUM
SCHEMBL31549868 0.81 MMP2 (0.34) KDM1A
SCHEMBL38659758 0.81 KDM1A (0.34) LMNAKDM1ANOTUM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024181484-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND SEMICONDUCTOR DEVICE 住友ベークライト株式会社 2024-09-06 WO disclosed
CN-110003616-B Epoxy resin composition and cured product thereof 日铁化学材料株式会社 2024-01-09 CN disclosed
WO-2023182136-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE 住友ベークライト株式会社 2023-09-28 WO disclosed
CN-116675605-A Synthesis method of 4,4' -biphthalate compound 哈尔滨工业大学 2023-09-01 CN disclosed
CN-114436767-B Method for preparing alcohol compound based on zinc acetate catalytic carbonyl reduction 延安大学 2023-05-26 CN disclosed
CN-114436767-A Method for preparing alcohol compound based on carbonyl reduction catalyzed by zinc acetate 延安大学 2022-05-06 CN disclosed
WO-2021241581-A1 PHOTOSENSITIVE RESIN COMPOSITION 住友ベークライト株式会社 2021-12-02 WO disclosed
US-11136435-B2 Method for producing polyimide film, polyimide film, polyamic acid solution, and photosensitive composition ENEOS CORPORATION (JP) 2021-10-05 US disclosed
CN-107207694-B Urethane (meth) acrylate resin, curable resin composition, cured product thereof, and plastic lens DIC株式会社 2020-08-07 CN disclosed
CN-110922717-A Epoxy resin composition, prepreg, laminate, and printed wiring board 日铁化学材料株式会社 2020-03-27 CN disclosed
EP-2214035-A1 PLASTIC LENS HOYA CORPORATION (JP) 2010-08-04 EP disclosed
US-20090311536-A1 Plastic Lens HOYA CORPORATION (JP) 2009-12-17 US disclosed
US-6855748-B1 UV-curable compositions HUNTSMAN ADVANCED MATERIALS AMERICAS, INC. (US) 2005-02-15 US disclosed
EP-0705857-B1 A process for producing polymers of alpha,omega-unsaturated conjugated compounds AVENTIS RES & TECH GMBH & CO (DE) 2000-01-19 EP disclosed
US-5763539-A Process for producing polymers of α,ω-unsaturated conjugated compounds HOECHST AKTIENGESELLSCHAFT (DE) 1998-06-09 US disclosed
EP-0705857-A2 A process for producing polymers of alpha,omega-unsaturated conjugated compounds HOECHST AKTIENGESELLSCHAFT (DE) 1996-04-10 EP disclosed
EP-0549022-A2 Polymeric materials FMC CORPORATION (UK) LIMITED (GB) 1993-06-30 EP disclosed
US-4438178-A COATED WITH EPICHLOROHYDRIN ETHER OR ESTER FIBER INDUSTRIES, INC. (US) 1984-03-20 US disclosed
US-4247658-A POROUS SURFACE LAYER FIBER INDUSTRIES, INC. (US) 1981-01-27 US disclosed
US-4044189-A TEXTILES, RUBBER REINFORCED WITH POLYESTER FIBER INDUSTRIES, INC. (US) 1977-08-23 US disclosed