SCHEMBL3684979

SCHEMBL3684979

C1CC(OCC2CS2)CCC1CC1CCC(OCC2CS2)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1403160 0.88
SCHEMBL4647248 0.77
SCHEMBL3689820 0.77 HTT (0.31)
SCHEMBL21409493 0.76 NPC1 (0.40)
SCHEMBL4646034 0.75
SCHEMBL31093863 0.72
SCHEMBL4741396 0.72
SCHEMBL4645960 0.71
SCHEMBL285113 0.71 TSHR (0.41)
SCHEMBL17772540 0.70 ALDH1A1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250114986-A1 CURABLE COMPOSITION FOR MECHANICAL FOAMING AND METHOD FOR MANUFACTURING FOAM OF THE SAME THREE BOND CO LTD (JP) 2025-04-10 US disclosed
US-20240399747-A1 FLUID EJECTION HEAD, METHOD FOR PRODUCING FLUID EJECTION HEAD, FLUID EJECTION ASSEMBLY, AND FLUID EJECTION DEVICE RICOH COMPANY, LTD. (JP) 2024-12-05 US disclosed
EP-4470780-A1 FLUID EJECTION HEAD, METHOD FOR PRODUCING FLUID EJECTION HEAD, FLUID EJECTION ASSEMBLY, AND FLUID EJECTION DEVICE Ricoh Company, Ltd. (JP) 2024-12-04 EP disclosed
US-20230340330-A1 COMPOSITION FOR COLOR CONVERSION FILM, COLOR CONVERSION FILM, METHOD FOR MANUFACTURING COLOR CONVERSION FILM, BACKLIGHT UNIT, AND LIQUID CRYSTAL DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2023-10-26 US disclosed
US-20220355517-A1 CURABLE COMPOSITION FOR MECHANICAL FOAMING AND METHOD FOR MANUFACTURING FOAM OF THE SAME THREEBOND CO., LTD. (JP) 2022-11-10 US disclosed
CN-115135697-A Process for producing polythioether compound 株式会社大赛璐 2022-09-30 CN disclosed
US-11155669-B2 Curable resin composition, cured product thereof, and bonded body bonded by cured product THREEBOND CO., LTD. (JP) 2021-10-26 US disclosed
EP-3885399-A1 CURABLE COMPOSITION FOR MECHANICAL FOAMING, AND METHOD FOR MANUFACTURING FOAM OF SAME ThreeBond Co., Ltd. (JP) 2021-09-29 EP disclosed
CN-109790265-B Curable resin composition, cured product thereof, and bonded body bonded with the cured product 三键有限公司 2021-08-17 CN disclosed
US-20190211132-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND BONDED BODY BONDED WITH CURED PRODUCT THEREOF THREEBOND CO., LTD. (JP) 2019-07-11 US disclosed
EP-2698393-B1 Resin composition AJINOMOTO KK (JP) 2015-08-19 EP disclosed
US-9018321-B2 Resin composition AJINOMOTO CO., INC. (JP) 2015-04-28 US disclosed
EP-2698393-A1 Resin composition Ajinomoto Co., Inc. (JP) 2014-02-19 EP disclosed
EP-2174969-A1 RESIN COMPOSITION Ajinomoto Co., Inc. (JP) 2010-04-14 EP disclosed
US-20090030158-A1 RESIN COMPOSITION AJINOMOTO CO., INC (JP) 2009-01-29 US disclosed
US-20080206668-A1 NEGATIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-08-28 US disclosed
EP-1962139-A1 Negative resist composition and pattern forming method using the same FUJIFILM Corporation (JP) 2008-08-27 EP disclosed