SCHEMBL3701679

SCHEMBL3701679

CCCCNS(=O)(=O)c1ccc(CC)cc1

nearest known ligand 0.66

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
LMNA P02545 8/20 0.63
HTT P42858 6/20 0.63
SMN1; SMN2 Q16637 4/20 0.63
TSHR P16473 2/20 0.57
CA12 O43570 1/20 0.54
CA1 P00915 1/20 0.54
CA2 P00918 1/20 0.54
CA9 Q16790 1/20 0.54
ALDH1A1 P00352 9/20 0.54
GAA P10253 1/20 0.54
MAPT P10636 1/20 0.54
ALOX12 P18054 1/20 0.54
MEN1 O00255 4/20 0.53
KMT2A Q03164 4/20 0.53
PKM P14618 3/20 0.53
L3MBTL1 Q9Y468 1/20 0.53
UCHL1 P09936 1/20 0.51
MAPK1 P28482 1/20 0.50
KDM4E B2RXH2 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17024394 0.88 SMN1; SMN2 (0.73) LMNAHTTSMN1; SMN2TSHRCA12
SCHEMBL17795416 0.84 LMNA (0.60) LMNAHTTSMN1; SMN2TSHRCA12
SCHEMBL187922 0.84 ALDH1A1 (0.72) LMNAHTTSMN1; SMN2TSHRCA12
SCHEMBL27590195 0.83 ALDH1A1 (0.67) LMNAHTTSMN1; SMN2TSHRCA12
SCHEMBL31404122 0.83 CA12 (0.72) LMNAHTTSMN1; SMN2TSHRCA12
SCHEMBL9796343 0.82 SMN1; SMN2 (0.59) LMNAHTTSMN1; SMN2TSHRCA12
SCHEMBL3277847 0.82 ALDH1A1 (0.77) LMNAHTTSMN1; SMN2TSHRCA12
SCHEMBL4085333 0.82 CA12 (0.80) LMNAHTTSMN1; SMN2TSHRCA12
SCHEMBL13296438 0.82 TSHR (0.63) LMNAHTTSMN1; SMN2TSHRCA12
SCHEMBL8578107 0.82 GAA (0.69) LMNAHTTSMN1; SMN2TSHRCA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210060995-A1 THERMAL TRANSFER RECORDING SHEET CANON KABUSHIKI KAISHA (JP) 2021-03-04 US disclosed
US-20120118616-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE RESIN FILM USING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (JP) 2012-05-17 US disclosed
EP-0475707-B1 Hot-melt ink composition SEIKO EPSON CORP (JP) 1995-03-22 EP disclosed