Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GPR3 | P46089 | 2/20 | 0.50 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.41 |
| ▸ | CA1 | P00915 | 1/20 | 0.38 |
| ▸ | CA2 | P00918 | 1/20 | 0.38 |
| ▸ | CA5A | P35218 | 1/20 | 0.38 |
| ▸ | CA9 | Q16790 | 1/20 | 0.38 |
| ▸ | KCNH2 | Q12809 | 8/20 | 0.36 |
| ▸ | ACHE | P22303 | 5/20 | 0.36 |
| ▸ | HSD11B1 | P28845 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | HTR6 | P50406 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Trifluoromethanesulfonic Acid SCHEMBL31155703 | 1.00 | GPR3 (0.50) | GPR3PTPN1CA1CA2CA5A | |
| Trifluoromethanesulfonic Acid SCHEMBL6118365 | 0.98 | GPR3 (0.48) | GPR3PTPN1CA1CA2CA5A | |
| Trifluoromethanesulfonic Acid SCHEMBL10008137 | 0.98 | GPR3 (0.48) | GPR3PTPN1CA1CA2CA5A | |
| Trifluoromethanesulfonic Acid SCHEMBL3249775 | 0.92 | GPR3 (0.44) | GPR3PTPN1CA1CA2CA5A | |
| Trifluoromethanesulfonic Acid SCHEMBL51183 | 0.91 | GPR3 (0.43) | GPR3PTPN1HSD11B1ALDH1A1TSHR | |
| Trifluoromethanesulfonic Acid SCHEMBL29825847 | 0.91 | GPR3 (0.43) | GPR3PTPN1CA1CA2CA5A | |
| Trifluoromethanesulfonic Acid SCHEMBL3130151 | 0.91 | GPR3 (0.43) | GPR3PTPN1HSD11B1ALDH1A1TSHR | |
| Trifluoromethanesulfonic Acid SCHEMBL4643787 | 0.91 | PTPN1 (0.46) | GPR3PTPN1CA1CA2CA9 | |
| SCHEMBL546819 | 0.90 | GPR3 (0.42) | GPR3PTPN1CA1CA2CA5A | |
| SCHEMBL2437867 | 0.89 | GPR3 (0.40) | GPR3PTPN1CA1CA2CA5A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 10885 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-121873631-B | Spin-on carbon composition, semiconductor preparation method and semiconductor device | Jiageng Innovation Laboratory (CN) | 2026-05-26 | — | — | CN | claimed |
| WO-2026107261-A1 | PURIFICATION OF PHOTORESIST POLYMER BY SURFACE-MODIFIED POROUS POLYETHYLENE MEMBRANE | ENTEGRIS, INC. (US) | 2026-05-21 | — | — | WO | claimed |
| CN-122043861-A | High-refractive-index unsaturated polyester-based composite photoresist and preparation method and application thereof | 绍兴长木新材料科技有限公司 | 2026-05-15 | — | — | CN | claimed |
| CN-115981100-B | Hydrofluoric acid-resistant protective material for lithography and lithography process thereof | 湖南梵鑫新材料股份有限公司 | 2026-05-12 | — | — | CN | claimed |
| US-20260104643-A1 | METHOD OF FORMING PHOTORESIST PATTERN | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2026-04-16 | — | — | US | claimed |
| US-20250383599-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR IMPROVING PATTERN PROFILE AND RESOLUTION | YCCHEM CO LTD (KR) | 2025-12-18 | — | — | US | claimed |
| US-20250377591-A1 | PHOTORESIST COMPOSITION AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | SAMSUNG ELECTRONICS CO LTD (KR) | 2025-12-11 | — | — | US | claimed |
| US-12493243-B2 | Film-forming composition | NISSAN CHEMICAL CORPORATION (JP) | 2025-12-09 | — | — | US | claimed |
| EP-4607277-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR IMPROVING PATTERN PROFILE AND ENHANCING ADHESION | Ycchem Co., Ltd. (KR) | 2025-08-27 | — | — | EP | claimed |
| US-20250199406-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR IMPROVING PATTERN PROFILE AND ENHANCING ADHESION | YCCHEM CO., LTD. (KR) | 2025-06-19 | — | — | US | claimed |
| EP-0501919-A1 | Radiation-sensitive compositions based on polyphenols and acetals | CIBA-GEIGY AG (CH) | 1992-09-02 | — | — | EP | claimed |
| EP-0494383-A1 | Photoresist | SIEMENS AKTIENGESELLSCHAFT (DE) | 1992-07-15 | — | — | EP | claimed |
| WO-1991015810-A1 | RESIST MATERIAL AND PROCESS FOR USE | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1991-10-17 | — | — | WO | claimed |
| US-4968581-A | High resolution photoresist of imide containing polymers | HOECHST CELANESE CORPORATION (US) | 1990-11-06 | — | — | US | claimed |
| US-4912018-A | High resolution photoresist based on imide containing polymers | HOECHST CELANESE CORPORATION (US) | 1990-03-27 | — | — | US | claimed |
| US-4837124-A | High resolution photoresist of imide containing polymers | HOECHST CELANESE CORPORATION (US) | 1989-06-06 | — | — | US | claimed |
| EP-0292821-A2 | Image reversal process for normally positive photoresists | HOECHST AKTIENGESELLSCHAFT (DE) | 1988-11-30 | — | — | EP | claimed |
| US-4775609-A | Image reversal | HOESCHT CELANESE CORPORATION (US) | 1988-10-04 | — | — | US | claimed |
| EP-0234327-A2 | High resolution photoresist of imide containing polymers | HOECHST CELANESE CORPORATION (US) | 1987-09-02 | — | — | EP | claimed |
| US-4108747-A | Curable compositions and method for curing such compositions | GENERAL ELECTRIC COMPANY (US) | 1978-08-22 | — | — | US | claimed |