SCHEMBL371301

SCHEMBL371301

C=CC(C#N)OC(=O)C(=C)C

nearest known ligand 0.38

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.38
TSHR P16473 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
1-Cyanoallyl Acetate SCHEMBL347682 0.83
1-Cyanoallyl Acetate SCHEMBL28614624 0.80 TSHR (0.34) TSHR
SCHEMBL11500858 0.80 ALDH1A1 (0.42) ALDH1A1TSHR
SCHEMBL11044129 0.79
SCHEMBL1960557 0.77
SCHEMBL13756081 0.77 ALDH1A1 (0.42) ALDH1A1TSHR
SCHEMBL196173 0.75 TSHR (0.35) ALDH1A1TSHR
SCHEMBL11637243 0.75 TSHR (0.35) ALDH1A1TSHR
SCHEMBL1963001 0.75
SCHEMBL15364016 0.75 ALDH1A1 (0.41) ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 356 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6572971-B2 Two-component adhesive composition, which comprises: (a) a resin pack comprising an epoxy resin and silane coupling agent; (b) curative pack comprising an aliphatic amine and a polyamine. ASHLAND CHEMICAL 2003-06-03 US claimed
US-20020164485-A1 Structural modified epoxy adhesive compositions ASHLAND LICENSING AND INTELLECTUAL PROPERTY LLC 2002-11-07 US claimed
US-5246994-A Polymer, peroxide and fatty amide blend as vibration isolators with weather resistance and slide-friction resistance TOKAI RUBBER INDUSTRIES, LTD. (JP) 1993-09-21 US claimed
US-4990570-A Blend of unsaturated nitrile, conjuated diene, zinc salt of methacrylic acid, silicic acid, and organic peroxide NIPPON ZEON CO., LTD. (JP) 1991-02-05 US claimed
US-4983678-A HYDROGENATED DIENE-NITRILE RUBBER, ETHYLENE-PROPYLENE-DIENE TERPOLYMER, ZINC METHACRYLATE, ORGANIC PEROXIDE NIPPON ZEON CO., LTD. (JP) 1991-01-08 US claimed
EP-0317263-A2 Optical material JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1989-05-24 EP claimed
JP-3137117-A None JP disclosed
WO-2024135515-A1 BINDER FOR SECONDARY BATTERY ELECTRODES, USE OF SAME, AND METHOD FOR PRODUCING BINDER FOR SECONDARY BATTERY ELECTRODES 東亞合成株式会社 2024-06-27 WO disclosed
CN-118016891-A Binder composition for secondary battery 广东省皓智科技有限公司 2024-05-10 CN disclosed
CN-114342124-B Binder composition for secondary battery 广东省皓智科技有限公司 2024-04-09 CN disclosed
EP-3827030-B1 HYDROGENATION OF NITRILE RUBBER ARLANXEO DEUTSCHLAND GMBH (DE) 2024-03-27 EP disclosed
WO-2024024773-A1 METHOD FOR PRODUCING CROSSLINKED POLYMER OR SALT THEREOF 東亞合成株式会社 2024-02-01 WO disclosed
WO-2024024772-A1 BINDER FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY ELECTRODES 東亞合成株式会社 2024-02-01 WO disclosed
US-4990570-A Blend of unsaturated nitrile, conjuated diene, zinc salt of methacrylic acid, silicic acid, and organic peroxide NIPPON ZEON CO., LTD. (JP) 1991-02-05 US disclosed
US-4983678-A HYDROGENATED DIENE-NITRILE RUBBER, ETHYLENE-PROPYLENE-DIENE TERPOLYMER, ZINC METHACRYLATE, ORGANIC PEROXIDE NIPPON ZEON CO., LTD. (JP) 1991-01-08 US disclosed
EP-0317263-A2 Optical material JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1989-05-24 EP disclosed
US-4591626-A TRANSPARENT OPTICAL MATERIALS HITACHI CHEMICAL COMPANY, LTD. (JP) 1986-05-27 US disclosed
US-4526219-A Process of forming foundry cores and molds utilizing binder curable by free radical polymerization ASHLAND OIL, INC. (US) 1985-07-02 US disclosed
EP-0141610-A2 Optical elements comprising polymers of (meth)acrylate esters Hitachi Chemical Co., Ltd. (JP) 1985-05-15 EP disclosed
US-3897295-A Ionizing radiation method for forming acrylic pressure sensitive adhesives and coated substrates PPG INDUSTRIES INC 1975-07-29 US disclosed