SCHEMBL371393

SCHEMBL371393

CC1C=CC=C(N2C(=O)C=CC2=O)C1

nearest known ligand 0.35

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 16/20 0.35
FAAH O00519 6/20 0.35
HSP90AA1 P07900 4/20 0.34
CCR6 P51684 2/20 0.34
TDP1 Q9NUW8 2/20 0.31
ALDH1A1 P00352 1/20 0.31
LMNA P02545 1/20 0.31
CACNA1B Q00975 1/20 0.31
APBA1 Q02410 1/20 0.31
APOBEC3G Q9HC16 1/20 0.31
BCHE P06276 1/20 0.31
PKM P14618 1/20 0.31
MAPK1 P28482 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13509373 0.70 MGLL (0.38) MGLLFAAHHSP90AA1CCR6TDP1
SCHEMBL24865844 0.67 MGLL (0.36) MGLLFAAHHSP90AA1CCR6
SCHEMBL15743602 0.65 MGLL (0.36) MGLLFAAHHSP90AA1CCR6
SCHEMBL6666801 0.64
SCHEMBL29585013 0.63
SCHEMBL12994154 0.63 MGLL (0.34) MGLLFAAH
SCHEMBL7719942 0.62
SCHEMBL8021256 0.61
SCHEMBL21788702 0.61 RAD52 (0.36)
SCHEMBL26863806 0.61

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2428535-A1 THERMOSETTING POLYIMIDE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE Mitsubishi Gas Chemical Company, Inc. (JP) 2012-03-14 EP disclosed