SCHEMBL24865844

SCHEMBL24865844

O=C1C=CC(=O)N1C1=CC=CC=CC1

nearest known ligand 0.36

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 11/20 0.36
FAAH O00519 3/20 0.36
HSP90AA1 P07900 1/20 0.33
CCR6 P51684 1/20 0.33
TLR9 Q9NR96 1/20 0.32
GSK3A P49840 1/20 0.32
GSK3B P49841 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13509373 0.91 MGLL (0.38) MGLLFAAHHSP90AA1CCR6TLR9
SCHEMBL15743602 0.73 MGLL (0.36) MGLLFAAHHSP90AA1CCR6TLR9
SCHEMBL12994154 0.71 MGLL (0.34) MGLLFAAHTLR9
SCHEMBL371393 0.67 MGLL (0.35) MGLLFAAHHSP90AA1CCR6
SCHEMBL28015655 0.64 MAPT (0.32)
SCHEMBL2289204 0.63
SCHEMBL19832623 0.63
SCHEMBL25700710 0.62
SCHEMBL17894038 0.61
SCHEMBL24378167 0.61 LMNA (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023281692-A1 RESIN COMPOSITION, RESIN FILM, MULTILAYERED PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE 昭和電工マテリアルズ株式会社 2023-01-12 WO disclosed