SCHEMBL372601

SCHEMBL372601

C=CC(=O)N(CCCCCCC)CCCCCCC

nearest known ligand 0.72

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ZDHHC20 Q5W0Z9 4/20 0.72
ZDHHC2 Q9UIJ5 2/20 0.72
CA12 O43570 3/20 0.45
CA1 P00915 3/20 0.45
CA9 Q16790 3/20 0.45
CA2 P00918 1/20 0.45
FAAH O00519 1/20 0.43
THRA P10827 5/20 0.42
THRB P10828 5/20 0.42
MEN1 O00255 1/20 0.42
KMT2A Q03164 1/20 0.42
MGLL Q99685 1/20 0.41
TSHR P16473 2/20 0.39
HPGD P15428 1/20 0.39
MMP1 P03956 1/20 0.39
MMP2 P08253 1/20 0.39
MMP3 P08254 1/20 0.39
MMP8 P22894 1/20 0.39
DNM1 Q05193 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL252541 1.00 ZDHHC20 (0.72) ZDHHC20ZDHHC2CA12CA1CA9
SCHEMBL372568 1.00 ZDHHC20 (0.72) ZDHHC20ZDHHC2CA12CA1CA9
SCHEMBL7161000 1.00 ZDHHC20 (0.72) ZDHHC20ZDHHC2CA12CA1CA9
SCHEMBL3466858 1.00 ZDHHC20 (0.72) ZDHHC20ZDHHC2CA12CA1CA9
SCHEMBL372802 1.00 ZDHHC20 (0.72) ZDHHC20ZDHHC2CA12CA1CA9
SCHEMBL137967 1.00 ZDHHC20 (0.72) ZDHHC20ZDHHC2CA12CA1CA9
SCHEMBL4081083 1.00 ZDHHC20 (0.72) ZDHHC20ZDHHC2CA12CA1CA9
SCHEMBL3389914 1.00 ZDHHC20 (0.72) ZDHHC20ZDHHC2CA12CA1CA9
SCHEMBL3467199 0.98 ZDHHC20 (0.70) ZDHHC20ZDHHC2CA12CA1CA9
SCHEMBL6116639 0.98 ZDHHC20 (0.70) ZDHHC20ZDHHC2CA12CA1CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12365815-B2 Polishing liquid, polishing liquid set, polishing method, and defect suppression method RESONAC CORPORATION (JP) 2025-07-22 US disclosed
EP-2960314-B1 POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE FUJIMI INC (JP) 2024-06-26 EP disclosed
EP-3159915-B1 METHOD FOR POLISHING SILICON WAFER, POLISHING COMPOSITION, AND POLISHING COMPOSITION SET FUJIMI INC (JP) 2023-12-06 EP disclosed
CN-110462797-B Polishing composition 福吉米株式会社 2023-09-22 CN disclosed
CN-110998800-B Polishing liquid, polishing liquid set and polishing method 株式会社力森诺科 2023-09-22 CN disclosed
US-20230295466-A1 POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, AND DEFECT SUPPRESSION METHOD RESONAC CORPORATION (JP) 2023-09-21 US disclosed
US-11649377-B2 Polishing liquid, polishing liquid set and polishing method RESONAC CORPORATION (JP) 2023-05-16 US disclosed
EP-3133638-B1 COMPOSITION FOR POLISHING SILICON WAFERS FUJIMI INC (JP) 2021-10-27 EP disclosed
CN-106463386-B Method for polishing silicon wafer, polishing composition, and polishing composition set 福吉米株式会社 2020-12-01 CN disclosed
EP-2957613-B1 POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE FUJIMI INC (JP) 2020-11-18 EP disclosed
US-20080214093-A1 CMP polishing slurry and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2008-09-04 US disclosed
EP-1956642-A1 POLISHING AGENT FOR SILICON OXIDE, LIQUID ADDITIVE, AND METHOD OF POLISHING Hitachi Chemical Co., Ltd. (JP) 2008-08-13 EP disclosed
CN-100377310-C CMP polishing compound and polishing method HITACHI CHEMICAL CO LTD (JP) 2008-03-26 CN disclosed
CN-100373556-C Polishing agent and polishing method HITACHI CHEMICAL CO LTD (JP) 2008-03-05 CN disclosed
US-20070175104-A1 Polishing slurry for silicon oxide, additive liquid and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2007-08-02 US disclosed
US-20060289826-A1 Hazardous substance decomposer and process for producing the same RESONAC CORPORATION (JP) 2006-12-28 US disclosed
US-20060148667-A1 Cmp polishing compound and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2006-07-06 US disclosed
CN-1795543-A Polishing agent and polishing method HITACHI CHEMICAL CO LTD (JP) 2006-06-28 CN disclosed
CN-1745460-A CMP polishing slurry and polishing method HITACHI CHEMICAL CO LTD (JP) 2006-03-08 CN disclosed
US-4414374-A IMPROVED GREEN STRENGTH THE FIRESTONE TIRE & RUBBER COMPANY (US) 1983-11-08 US disclosed