Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ZDHHC20 | Q5W0Z9 | 4/20 | 0.72 |
| ▸ | ZDHHC2 | Q9UIJ5 | 2/20 | 0.72 |
| ▸ | CA12 | O43570 | 3/20 | 0.45 |
| ▸ | CA1 | P00915 | 3/20 | 0.45 |
| ▸ | CA9 | Q16790 | 3/20 | 0.45 |
| ▸ | CA2 | P00918 | 1/20 | 0.45 |
| ▸ | FAAH | O00519 | 1/20 | 0.43 |
| ▸ | THRA | P10827 | 5/20 | 0.42 |
| ▸ | THRB | P10828 | 5/20 | 0.42 |
| ▸ | MEN1 | O00255 | 1/20 | 0.42 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.42 |
| ▸ | MGLL | Q99685 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 2/20 | 0.39 |
| ▸ | HPGD | P15428 | 1/20 | 0.39 |
| ▸ | MMP1 | P03956 | 1/20 | 0.39 |
| ▸ | MMP2 | P08253 | 1/20 | 0.39 |
| ▸ | MMP3 | P08254 | 1/20 | 0.39 |
| ▸ | MMP8 | P22894 | 1/20 | 0.39 |
| ▸ | DNM1 | Q05193 | 2/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL252541 | 1.00 | ZDHHC20 (0.72) | ZDHHC20ZDHHC2CA12CA1CA9 | |
| SCHEMBL372568 | 1.00 | ZDHHC20 (0.72) | ZDHHC20ZDHHC2CA12CA1CA9 | |
| SCHEMBL7161000 | 1.00 | ZDHHC20 (0.72) | ZDHHC20ZDHHC2CA12CA1CA9 | |
| SCHEMBL3466858 | 1.00 | ZDHHC20 (0.72) | ZDHHC20ZDHHC2CA12CA1CA9 | |
| SCHEMBL137967 | 1.00 | ZDHHC20 (0.72) | ZDHHC20ZDHHC2CA12CA1CA9 | |
| SCHEMBL372601 | 1.00 | ZDHHC20 (0.72) | ZDHHC20ZDHHC2CA12CA1CA9 | |
| SCHEMBL4081083 | 1.00 | ZDHHC20 (0.72) | ZDHHC20ZDHHC2CA12CA1CA9 | |
| SCHEMBL3389914 | 1.00 | ZDHHC20 (0.72) | ZDHHC20ZDHHC2CA12CA1CA9 | |
| SCHEMBL3467199 | 0.98 | ZDHHC20 (0.70) | ZDHHC20ZDHHC2CA12CA1CA9 | |
| SCHEMBL6116639 | 0.98 | ZDHHC20 (0.70) | ZDHHC20ZDHHC2CA12CA1CA9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2018071462-A1 | ARTICLES COMPRISING AN OIL CAPTURE POLYMER | THE PROCTER & GAMBLE COMPANY (US) | 2018-04-19 | — | — | WO | claimed |
| US-12365815-B2 | Polishing liquid, polishing liquid set, polishing method, and defect suppression method | RESONAC CORPORATION (JP) | 2025-07-22 | — | — | US | disclosed |
| EP-2960314-B1 | POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE | FUJIMI INC (JP) | 2024-06-26 | — | — | EP | disclosed |
| CN-112662103-B | Solution casting type substrate film for dicing tape and dicing tape | 麦克赛尔株式会社 | 2024-04-30 | — | — | CN | disclosed |
| EP-3159915-B1 | METHOD FOR POLISHING SILICON WAFER, POLISHING COMPOSITION, AND POLISHING COMPOSITION SET | FUJIMI INC (JP) | 2023-12-06 | — | — | EP | disclosed |
| CN-110462797-B | Polishing composition | 福吉米株式会社 | 2023-09-22 | — | — | CN | disclosed |
| US-20230295466-A1 | POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, AND DEFECT SUPPRESSION METHOD | RESONAC CORPORATION (JP) | 2023-09-21 | — | — | US | disclosed |
| US-11649377-B2 | Polishing liquid, polishing liquid set and polishing method | RESONAC CORPORATION (JP) | 2023-05-16 | — | — | US | disclosed |
| EP-3133638-B1 | COMPOSITION FOR POLISHING SILICON WAFERS | FUJIMI INC (JP) | 2021-10-27 | — | — | EP | disclosed |
| CN-112662103-A | Solution casting type base material film for dicing tape and dicing tape | 麦克赛尔控股株式会社 | 2021-04-16 | — | — | CN | disclosed |
| US-20110028073-A1 | CMP POLISHING SLURRY AND POLISHING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2011-02-03 | — | — | US | disclosed |
| US-7838482-B2 | CMP polishing compound and polishing method | HITACHI CHEMICAL CO. LTD. (JP) | 2010-11-23 | — | — | US | disclosed |
| US-7837800-B2 | CMP polishing slurry and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2010-11-23 | — | — | US | disclosed |
| US-20090047786-A1 | CMP Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method | RESONAC CORPORATION (JP) | 2009-02-19 | — | — | US | disclosed |
| US-20080214093-A1 | CMP polishing slurry and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2008-09-04 | — | — | US | disclosed |
| EP-1956642-A1 | POLISHING AGENT FOR SILICON OXIDE, LIQUID ADDITIVE, AND METHOD OF POLISHING | Hitachi Chemical Co., Ltd. (JP) | 2008-08-13 | — | — | EP | disclosed |
| US-20070175104-A1 | Polishing slurry for silicon oxide, additive liquid and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2007-08-02 | — | — | US | disclosed |
| US-20060289826-A1 | Hazardous substance decomposer and process for producing the same | RESONAC CORPORATION (JP) | 2006-12-28 | — | — | US | disclosed |
| US-20060148667-A1 | Cmp polishing compound and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2006-07-06 | — | — | US | disclosed |
| US-3970606-A | N-vinyl lactam interpolymers useful as thickening agents | GAF CORPORATION (US) | 1976-07-20 | — | — | US | disclosed |