SCHEMBL372647

SCHEMBL372647

C=C(C)C(=O)N(C(C)=O)C(C)=O

nearest known ligand 0.40

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.40
ALDH1A1 P00352 1/20 0.35
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8362093 0.94 TDP1 (0.40) TDP1ALDH1A1HSD17B10
SCHEMBL309028 0.87 TDP1 (0.44) TDP1ALDH1A1HSD17B10
SCHEMBL28715657 0.79 LMNA (0.39)
SCHEMBL8642402 0.79 TDP1 (0.38) TDP1ALDH1A1
SCHEMBL8433764 0.79 TDP1 (0.38) TDP1ALDH1A1
SCHEMBL10527794 0.78 ALDH1A1 (0.31) ALDH1A1
SCHEMBL7637758 0.77 TDP1 (0.50) TDP1ALDH1A1
SCHEMBL18381052 0.75 ALDH1A1 (0.35) ALDH1A1
SCHEMBL3740401 0.73 TDP1 (0.37) TDP1ALDH1A1HSD17B10
SCHEMBL27452746 0.73 TSHR (0.40)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12365815-B2 Polishing liquid, polishing liquid set, polishing method, and defect suppression method RESONAC CORPORATION (JP) 2025-07-22 US disclosed
EP-2960314-B1 POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE FUJIMI INC (JP) 2024-06-26 EP disclosed
EP-3159915-B1 METHOD FOR POLISHING SILICON WAFER, POLISHING COMPOSITION, AND POLISHING COMPOSITION SET FUJIMI INC (JP) 2023-12-06 EP disclosed
CN-110462797-B Polishing composition 福吉米株式会社 2023-09-22 CN disclosed
US-20230295466-A1 POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, AND DEFECT SUPPRESSION METHOD RESONAC CORPORATION (JP) 2023-09-21 US disclosed
US-11649377-B2 Polishing liquid, polishing liquid set and polishing method RESONAC CORPORATION (JP) 2023-05-16 US disclosed
EP-3133638-B1 COMPOSITION FOR POLISHING SILICON WAFERS FUJIMI INC (JP) 2021-10-27 EP disclosed
CN-106463386-B Method for polishing silicon wafer, polishing composition, and polishing composition set 福吉米株式会社 2020-12-01 CN disclosed
EP-2957613-B1 POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE FUJIMI INC (JP) 2020-11-18 EP disclosed
US-20200283659-A1 POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, ANDDEFECT SUPPRESSION METHOD RESONAC CORPORATION (JP) 2020-09-10 US disclosed
EP-1956642-A1 POLISHING AGENT FOR SILICON OXIDE, LIQUID ADDITIVE, AND METHOD OF POLISHING Hitachi Chemical Co., Ltd. (JP) 2008-08-13 EP disclosed
US-20070175104-A1 Polishing slurry for silicon oxide, additive liquid and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2007-08-02 US disclosed
US-20060148667-A1 Cmp polishing compound and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2006-07-06 US disclosed
US-6932964-B1 Copolymer of a tert-butyl acrylate and/or an N-tert-butylacrylamide, at least acrylic mono- and/or dicarboxylic acid, and at least one ethoxylated acrylic compound; high propellant gas compatibility and no \"flaking\" effect; hair sprays BASF AKTIENGESELLSCHAFT (DE) 2005-08-23 US disclosed
US-6469135-B2 EVAPORATING THE VOLATILE CONSTITUENTS FROM AQUEOUS DISPERSIONS OF FILM-FORMING POLYMERS IN THE PRESENCE OF SALTS OF OLIGOMERIC ARYLSULFONIC ACID-FORMALDEHYDE CONDENSATES AS DRYING ASSISTANTS; ANIONIC SURFACTANT BASF AKTIENGESELLSCHAFT (DE) 2002-10-22 US disclosed
US-20020062006-A1 Preparing polymer powders BASF AKITENGESELLSHAFT (DE) 2002-05-23 US disclosed
CN-1226200-A Manufacture of laminated film and printed wiring board HITACHI CHEMICAL CO LTD (JP) 1999-08-18 CN disclosed
EP-0294648-B1 NOVEL COPOLYMER AND WATER- AND OIL-REPELLENT COMPRISING THE SAME DAIKIN INDUSTRIES, LIMITED (JP) 1993-01-07 EP disclosed
US-5055538-A (Meth)Acrylate copolymers with a perfluoroalkylmonomer, stearyl acrylate or methacrylate; antislipping agents; stable dry cleaning and washing agents DAIKIN INDUSTRIES LTD. (JP) 1991-10-08 US disclosed
EP-0294648-A2 Novel copolymer and water- and oil-repellent comprising the same DAIKIN INDUSTRIES, LIMITED (JP) 1988-12-14 EP disclosed