⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17493638 | 0.88 | — | — | |
| SCHEMBL11408907 | 0.84 | ALDH1A1 (0.44) | — | |
| SCHEMBL26196 | 0.77 | — | — | |
| SCHEMBL458646 | 0.77 | — | — | |
| SCHEMBL4867685 | 0.74 | ALDH1A1 (0.34) | — | |
| SCHEMBL7526813 | 0.72 | — | — | |
| SCHEMBL27628067 | 0.72 | — | — | |
| SCHEMBL14778173 | 0.72 | CA1 (0.36) | — | |
| SCHEMBL27187 | 0.72 | — | — | |
| SCHEMBL27320016 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112368326-B | Film for glass bonding, pigment dispersion liquid, light-transmitting laminate, and mobile device | 爱思开迈克沃有限公司 | 2023-09-12 | — | — | CN | disclosed |
| CN-112272614-B | Film for glass bonding, composition for glass bonding film, and laminated glass comprising same | SKC株式会社 | 2023-05-12 | — | — | CN | disclosed |
| CN-112272615-B | Film for glass bonding, method for producing same, and mobile device comprising same | SKC株式会社 | 2023-03-31 | — | — | CN | disclosed |
| CN-112533759-B | Film for glass bonding, composition for glass bonding film, and laminated glass comprising same | SKC株式会社 | 2023-03-24 | — | — | CN | disclosed |
| CN-113226739-B | Film for glass bonding, method for producing same, bonded glass including same, and mobile device including same | SKC株式会社 | 2022-04-19 | — | — | CN | disclosed |
| CN-113226739-A | Film for glass bonding, method for producing same, bonded glass including same, and mobile device including same | SKC株式会社 | 2021-08-06 | — | — | CN | disclosed |
| CN-112533759-A | Film for glass bonding, composition for glass bonding film, and laminated glass comprising same | SKC株式会社 | 2021-03-19 | — | — | CN | disclosed |
| CN-112368326-A | Film for glass bonding, laminated glass including the same, and mobile device including the same | SKC株式会社 | 2021-02-12 | — | — | CN | disclosed |
| CN-112272614-A | Film for glass bonding, composition for glass bonding film, and laminated glass comprising same | SKC株式会社 | 2021-01-26 | — | — | CN | disclosed |
| CN-112272615-A | Film for glass bonding, method for producing same, and mobile device comprising same | SKC株式会社 | 2021-01-26 | — | — | CN | disclosed |
| EP-1889879-A1 | FLAME RETARDANT RESIN TREATED ARTICLE | FUJI ELECTRIC HOLDINGS CO., LTD. (JP) | 2008-02-20 | — | — | EP | disclosed |
| CN-101124298-A | Reactive flame retardant and flame-retardant resin processed article | FUJI ELECTRIC HOLDINGS (JP) | 2008-02-13 | — | — | CN | disclosed |
| CN-1312201-C | Resin molded article for electric component and method for producing same | FUJI ELECTRIC HOLDINGS (JP) | 2007-04-25 | — | — | CN | disclosed |
| EP-1555283-B1 | RESIN MOLDED PRODUCT FOR ELECTRIC PARTS AND MANUFACTURING METHOD THEREOF | FUJI ELECTRIC HOLDINGS (JP) | 2007-02-28 | — | — | EP | disclosed |
| WO-2007019828-A2 | METHOD FOR PRODUCING POLYVINYL ACETALS | PAPENFUHS BERND (DE) | 2007-02-22 | — | — | WO | disclosed |
| EP-1659148-A1 | REACTIVE FLAME RETARDANT AND FLAME-RETARDANT PROCESSED RESIN OBTAINED WITH THE SAME | FUJI ELECTRIC HOLDINGS CO., LTD. (JP) | 2006-05-24 | — | — | EP | disclosed |
| EP-1640411-A1 | REACTIVE FLAME RETARDANTS AND FLAME-RETARDED RESIN PRODUCTS | FUJI ELECTRIC HOLDINGS CO., LTD. (JP) | 2006-03-29 | — | — | EP | disclosed |
| US-20060052537-A1 | Resin molded article for electric part and production process of the same | FUJI ELECTRIC HOLDINGS CO., LTD. (JP) | 2006-03-09 | — | — | US | disclosed |
| CN-1703448-A | Resin molded article for electric component and method for producing same | FUJI ELECTRIC HOLDINGS (JP) | 2005-11-30 | — | — | CN | disclosed |
| EP-1555283-A1 | RESIN MOLDED PRODUCT FOR ELECTRIC PARTS AND MANUFACTURING METHOD THEREOF | FUJI ELECTRIC HOLDINGS CO., LTD. (JP) | 2005-07-20 | — | — | EP | disclosed |