SCHEMBL3754701

SCHEMBL3754701

CC(C)(C)c1ccc(C=Cc2cc(-c3ccc(C(C)(C)C)cc3)n(-c3ccccc3)n2)cc1

nearest known ligand 0.44

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ NPC1 O15118 1/20 0.44
▸ RAB9A P51151 1/20 0.44
▸ PDPK1 O15530 2/20 0.42
▸ APP P05067 1/20 0.42
▸ CAMK2A Q9UQM7 1/20 0.42
▸ PTGS1 P23219 2/20 0.42
▸ FABP3 P05413 1/20 0.41
▸ ALOX5 P09917 3/20 0.40
▸ LMNA P02545 1/20 0.40
▸ RPA1 P27694 1/20 0.39
▸ L3MBTL1 Q9Y468 1/20 0.38
▸ CNR1 P21554 1/20 0.38
▸ CNR2 P34972 1/20 0.38
▸ PTGS2 P35354 1/20 0.37
▸ TRPV1 Q8NER1 2/20 0.37
▸ MEN1 O00255 1/20 0.37
▸ KMT2A Q03164 1/20 0.37
▸ MALT1 Q9UDY8 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3752745 0.83 NPC1 (0.54) NPC1RAB9AAPPCAMK2APTGS1
SCHEMBL3762553 0.82 NPC1 (0.43) NPC1RAB9APDPK1ALOX5PTGS2
SCHEMBL22026654 0.82 RPA1 (0.52) NPC1RAB9AAPPCAMK2APTGS1
SCHEMBL11163187 0.82 RAB9A (0.53) NPC1RAB9AAPPCAMK2APTGS1
SCHEMBL11163183 0.82 RAB9A (0.53) NPC1RAB9AAPPCAMK2APTGS1
SCHEMBL22026653 0.82 RPA1 (0.52) NPC1RAB9AAPPCAMK2APTGS1
Quinoline SCHEMBL27722669 0.81 FABP3 (0.40) NPC1RAB9APDPK1PTGS1FABP3
SCHEMBL2686225 0.79 ALDH1A1 (0.52) NPC1RAB9AAPPCAMK2APTGS1
SCHEMBL2686228 0.79 ALDH1A1 (0.52) NPC1RAB9AAPPCAMK2APTGS1
SCHEMBL27882786 0.78 NPC1 (0.73) NPC1RAB9APDPK1PTGS1FABP3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8361697-B2 Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern and process for producing printed circuit board, lead frame, semiconductor package and concavoconvex board ASAHI KASEI E-MATERIALS CORPORATION (JP) 2013-01-29 — — US disclosed
US-20100297559-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN AND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD, LEAD FRAME, SEMICONDUCTOR PACKAGE AND CONCAVOCONVEX BOARD ASAHI KASEI E-MATERIALS CORPORATION (JP) 2010-11-25 — — US disclosed
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