SCHEMBL3758681

SCHEMBL3758681

CN=C(C)/C=C(\C)NC(C)C

nearest known ligand 0.34

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.34
ALDH1A1 P00352 1/20 0.32
GAA P10253 1/20 0.32
CA12 O43570 1/20 0.30
CA1 P00915 1/20 0.30
CA2 P00918 1/20 0.30
MMP1 P03956 1/20 0.30
MMP2 P08253 1/20 0.30
MMP9 P14780 1/20 0.30
MMP8 P22894 1/20 0.30
CA9 Q16790 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3758685 1.00 TSHR (0.34) TSHRALDH1A1GAACA12CA1
SCHEMBL3758675 1.00 TSHR (0.34) TSHRALDH1A1GAACA12CA1
SCHEMBL18544143 0.79
SCHEMBL379997 0.79
SCHEMBL23825481 0.76
SCHEMBL379775 0.76
SCHEMBL3066042 0.75 TSHR (0.42) TSHRALDH1A1GAACA12CA1
SCHEMBL379871 0.75 TSHR (0.42) TSHRALDH1A1GAACA12CA1
SCHEMBL23825301 0.74
SCHEMBL23825298 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9005705-B2 Method for the production of a substrate having a coating comprising copper, and coated substrate and device prepared by this method FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (DE) 2015-04-14 US disclosed
US-8507038-B2 Substrate having a coating comprising copper and method for the production thereof by means of atomic layer deposition FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (DE) 2013-08-13 US disclosed
US-20130062768-A1 METHOD FOR THE PRODUCTION OF A SUBSTRATE HAVING A COATING COMPRISING COPPER, AND COATED SUBSTRATE AND DEVICE PREPARED BY THIS METHOD TECHNISCHE UNIVERSITAET CHEMNITZ (DE) 2013-03-14 US disclosed
US-20100301478-A1 Substrate Having a Coating Comprising Copper and Method for the Production Thereof by Means of Atomic Layer Deposition TECHNISCHE UNIVERSITAET CHEMNITZ (DE) 2010-12-02 US disclosed