SCHEMBL375928

SCHEMBL375928

CO[Si](O)(CCCS)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17724679 0.90
SCHEMBL16772244 0.90
SCHEMBL16597193 0.84
SCHEMBL16487790 0.83
SCHEMBL15702979 0.79
SCHEMBL375757 0.77
SCHEMBL15679851 0.76 ALDH1A1 (0.32)
SCHEMBL3795986 0.76 LMNA (0.34)
SCHEMBL375771 0.75
SCHEMBL17655668 0.75 ALDH1A1 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7518009-B2 Process for preparing mercaptoorganyl (alkoxysilanes) EVONIK DEGUSSA GMBH (DE) 2009-04-14 US claimed
US-20060252952-A1 Process for preparing mercaptoorganyl (alkoxysilanes) DEGUSSA AG (DE) 2006-11-09 US claimed
CN-108602955-B Photocuring method, compound used in photocuring method, and composition 富士胶片和光纯药株式会社 2021-08-06 CN disclosed
US-10774062-B2 Photocuring method, compound and composition used therein FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) 2020-09-15 US disclosed
EP-3409709-B1 PHOTOCURING METHOD, COMPOUND AND COMPOSITION USED THEREIN FUJIFILM WAKO PURE CHEMICAL CORP (JP) 2020-08-19 EP disclosed
US-20190055210-A1 PHOTOCURING METHOD, COMPOUND AND COMPOSITION USED THEREIN FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) 2019-02-21 US disclosed
EP-3409709-A1 PHOTOCURING METHOD, COMPOUND AND COMPOSITION USED THEREIN FUJIFILM Wako Pure Chemical Corporation (JP) 2018-12-05 EP disclosed
US-9796885-B2 Hand-tearable masking tape with silicone-containing low adhesion backsize 3M INNOVATIVE PROPERTIES COMPANY (US) 2017-10-24 US disclosed
US-20170218234-A1 HAND-TEARABLE MASKING TAPE WITH SILICONE-CONTAINING LOW ADHESION BACKSIZE 3M INNOVATIVE PROPERTIES CO (US) 2017-08-03 US disclosed
US-20170190843-A1 CURABLE END-CAPPED SILSESQUIOXANE POLYMER COMPRISING REACTIVE GROUPS 3M INNOVATIVE PROPERTIES CO (US) 2017-07-06 US disclosed
US-9663684-B2 Hand-tearable masking tape with silicone-containing low adhesion backsize 3M INNOVATIVE PROPERTIES COMPANY (US) 2017-05-30 US disclosed
EP-1634884-A1 Process for preparing mercaptoorganyl alkoxy silanes Degussa GmbH (DE) 2006-03-15 EP disclosed
US-20060052622-A1 Process for the preparation of mercaptoorganyl (alkoxysilanes) EVONIK DEGUSSA GMBH (DE) 2006-03-09 US disclosed
US-20060052621-A1 Process for producing mercaptoorganyl (alkoxysilane) EVONIK DEGUSSA GMBH (DE) 2006-03-09 US disclosed
CN-1108998-C Method for making radiation curable optical glass fiber coating compositions having extended shelf life and said compositions DSM NV (NL) 2003-05-21 CN disclosed
EP-0897375-B1 A METHOD OF MAKING A RADIATION-CURABLE, OPTICAL GLASS FIBER COATING COMPOSITION HAVING EXTENDED SHELF LIFE DSM NV (NL) 2002-12-18 EP disclosed
US-20020013383-A1 Radiation-curable fiber optic materials having reduced moisture content DSM N.V. (NL) 2002-01-31 US disclosed
US-6214899-B1 TRIALKOXYSILANE COUPLING AGENT DSM N.V. (NL) 2001-04-10 US disclosed
EP-0897375-A1 A METHOD OF MAKING A RADIATION-CURABLE, OPTICAL GLASS FIBER COATING COMPOSITION HAVING EXTENDED SHELF LIFE AND SAID COMPOSITION DSM N.V. (NL) 1999-02-24 EP disclosed
WO-1997042130-A1 A METHOD OF MAKING A RADIATION-CURABLE, OPTICAL GLASS FIBER COATING COMPOSITION HAVING EXTENDED SHELF LIFE AND SAID COMPOSITION DSM N.V. (NL) 1997-11-13 WO disclosed