Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NQO1 | P15559 | 1/20 | 0.44 |
| ▸ | TSHR | P16473 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.37 |
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 2/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.35 |
| ▸ | HPGD | P15428 | 1/20 | 0.35 |
| ▸ | LTA4H | P09960 | 2/20 | 0.34 |
| ▸ | KAT6A | Q92794 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 2/20 | 0.33 |
| ▸ | NPC1 | O15118 | 2/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.33 |
| ▸ | BRD4 | O60885 | 1/20 | 0.33 |
| ▸ | BRD2 | P25440 | 1/20 | 0.33 |
| ▸ | CREBBP | Q92793 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4570827 | 0.78 | NQO1 (0.50) | NQO1TSHRTDP1TP53CYP3A4 | |
| SCHEMBL6884520 | 0.77 | NQO1 (0.44) | NQO1TSHRTDP1TP53CYP3A4 | |
| SCHEMBL19885259 | 0.76 | NQO1 (0.48) | NQO1TSHRTDP1TP53CYP3A4 | |
| SCHEMBL27688802 | 0.74 | NQO1 (0.46) | NQO1TSHRTDP1TP53CYP3A4 | |
| SCHEMBL5079355 | 0.74 | ESR1 (0.46) | NQO1TSHRTDP1TP53CYP3A4 | |
| SCHEMBL12126699 | 0.74 | MCL1 (0.53) | NQO1TSHRTP53ALDH1A1HPGD | |
| SCHEMBL27943128 | 0.74 | NQO1 (0.46) | NQO1TSHRTDP1TP53CYP3A4 | |
| SCHEMBL18071781 | 0.74 | NQO1 (0.46) | NQO1TSHRTDP1TP53CYP3A4 | |
| SCHEMBL22780338 | 0.74 | ALDH1A1 (0.53) | NQO1TSHRTDP1TP53CYP3A4 | |
| SCHEMBL1401588 | 0.74 | TSHR (0.48) | NQO1TSHRTDP1TP53CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 173 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4679461-A2 | RESIN COMPOSITION AND PRODUCTION METHOD OF THE SAME | AJINOMOTO CO., INC. (JP) | 2026-01-14 | — | — | EP | disclosed |
| EP-4586285-A1 | RESIN COMPOSITION | AJINOMOTO CO., INC. (JP) | 2025-07-16 | — | — | EP | disclosed |
| CN-120192630-A | Resin composition | 味之素株式会社 | 2025-06-24 | — | — | CN | disclosed |
| CN-120192629-A | Resin composition | 味之素株式会社 | 2025-06-24 | — | — | CN | disclosed |
| CN-120134736-A | Resin sheet with metal foil | 味之素株式会社 | 2025-06-13 | — | — | CN | disclosed |
| CN-120134737-A | Resin sheet with metal foil | 味之素株式会社 | 2025-06-13 | — | — | CN | disclosed |
| EP-4567840-A1 | RESIN COMPOSITION | Ajinomoto Co., Inc. (JP) | 2025-06-11 | — | — | EP | disclosed |
| CN-120118471-A | Resin composition | 味之素株式会社 | 2025-06-10 | — | — | CN | disclosed |
| CN-112500622-B | Resin composition | 味之素株式会社 | 2025-05-23 | — | — | CN | disclosed |
| CN-120021354-A | Method for manufacturing circuit board | 味之素株式会社 | 2025-05-20 | — | — | CN | disclosed |
| US-20090143511-A1 | ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-06-04 | — | — | US | disclosed |
| US-20090137717-A1 | ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-05-28 | — | — | US | disclosed |
| US-20090062430-A1 | Epoxy Resin Composition for Sealing and Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2009-03-05 | — | — | US | disclosed |
| US-20090012233-A1 | Epoxy Resin Molding Material for Sealing and Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2009-01-08 | — | — | US | disclosed |
| US-20080234409-A1 | nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage | HITACHI CHEMICAL CO., LTD. (JP) | 2008-09-25 | — | — | US | disclosed |
| US-20080039556-A1 | Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2008-02-14 | — | — | US | disclosed |
| US-20060014873-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| US-20050222300-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| WO-2003072628-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |
| WO-2003072655-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |