SCHEMBL376925

SCHEMBL376925

CCCCN(c1nc(Cl)nc(N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)n1)C1CC(C)(C)N(C)C(C)(C)C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL698649 0.97
SCHEMBL15184616 0.94
SCHEMBL3144917 0.93
SCHEMBL13298052 0.90 FLT3 (0.30)
SCHEMBL3809338 0.89
SCHEMBL7026466 0.88 ALDH1A1 (0.33)
SCHEMBL3656077 0.88
SCHEMBL371148 0.88
SCHEMBL676852 0.88 CRHR1 (0.36)
SCHEMBL10405099 0.88

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 262 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110606984-B Light stabilizer and preparation method thereof 宿迁联盛科技股份有限公司 2021-02-19 CN claimed
CN-110606984-A Light stabilizer and preparation method thereof 宿迁联盛科技股份有限公司 2019-12-24 CN claimed
US-8309658-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-11-13 US claimed
US-20120063109-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2012-03-15 US claimed
EP-2246400-A1 Circuit connecting material Hitachi Chemical Co., Ltd. (JP) 2010-11-03 EP claimed
US-6545072-B2 Phenolic antioxidant 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl) isocyanurate and a hindered amine light stabilizer; little discoloration when exposed to relatively high temperatures IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2003-04-08 US claimed
EP-0673782-B1 Recording sheets containing pyrrole, pyrrolidine, pyridine, piperidine, homopiperidine, quinoline, isoquinoline, quinuclidine, indole, and indazole compounds XEROX CORP (US) 2000-06-14 EP claimed
EP-0785231-B1 Propylene resin extruded articles JAPAN POLYCHEM CORP (JP) 1999-12-15 EP claimed
EP-0785231-A1 Propylene resin extruded articles Japan Polychem Corporation (JP) 1997-07-23 EP claimed
EP-0505162-B1 Polyamide blow molded product TORAY INDUSTRIES (JP) 1996-01-24 EP claimed
JP-9194643-A None JP disclosed
WO-2026100296-A1 FLAME-RETARDANT AROMATIC POLYCARBONATE RESIN MASTER BATCH AND METHOD FOR MANUFACTURING SAME 信越化学工業株式会社 2026-05-15 WO disclosed
US-20260125546-A1 RESIN COMPOSITION, RESIN COMPOSITION FOR RECYCLING AGENT, USE IN RECYCLING AGENT, REGRIND LAYER, MULTILAYER STRUCTURE, PACKAGE, FOOD PACKAGE, AND METHODS FOR PRODUCING RECYCLING AGENT AND REGRIND LAYER MITSUBISHI CHEMICAL CORPORATION (JP) 2026-05-07 US disclosed
US-12600848-B2 Resin composition, molded product, laminate, thermoformed container, blow-molded container, film, agricultural film, plant medium, and pipe KURARAY CO., LTD. (JP) 2026-04-14 US disclosed
US-20260008920-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF TEIJIN LIMITED (JP) 2026-01-08 US disclosed
EP-0319480-A2 Process for the methylation of triazine compounds containing 2,2,6,6-tetramethylpiperidine groups CIBA-GEIGY AG (CH) 1989-06-07 EP disclosed
US-4322337-A PHOTOSTABILITY CIBA-GEIGY CORPORATION (US) 1982-03-30 US disclosed
EP-0014683-B1 POLYALKYLPIPERIDINE DERIVATIVES OF S-TRIAZINES, THEIR USE AS STABILIZERS FOR POLYMERS AND POLYMER COMPOSITIONS STABILIZED WITH THESE COMPOUNDS CIBA-GEIGY AG (CH) 1981-12-23 EP disclosed
US-4288593-A PHOTOSTABILIZERS FOR POLYMERS CIBA-GEIGY CORPORATION (US) 1981-09-08 US disclosed
EP-0014683-A1 Polyalkylpiperidine derivatives of s-triazines, their use as stabilizers for polymers and polymer compositions stabilized with these compounds CIBA-GEIGY AG (CH) 1980-08-20 EP disclosed