Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GABRA1 | P14867 | 3/20 | 0.48 |
| ▸ | GABRB2 | P47870 | 2/20 | 0.48 |
| ▸ | GABRG2 | P18507 | 2/20 | 0.44 |
| ▸ | GABRB3 | P28472 | 2/20 | 0.44 |
| ▸ | FAAH | O00519 | 2/20 | 0.44 |
| ▸ | LMNA | P02545 | 2/20 | 0.44 |
| ▸ | CA1 | P00915 | 2/20 | 0.44 |
| ▸ | CA2 | P00918 | 2/20 | 0.44 |
| ▸ | TSHR | P16473 | 2/20 | 0.44 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.44 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.44 |
| ▸ | HPGD | P15428 | 1/20 | 0.44 |
| ▸ | GABRB1 | P18505 | 1/20 | 0.44 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.44 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.44 |
| ▸ | HTR2C | P28335 | 1/20 | 0.44 |
| ▸ | GABRA5 | P31644 | 1/20 | 0.44 |
| ▸ | GABRA3 | P34903 | 1/20 | 0.44 |
| ▸ | HTR2B | P41595 | 1/20 | 0.44 |
| ▸ | GABRA2 | P47869 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10154126 | 0.97 | GABRA1 (0.46) | GABRA1GABRB2GABRG2GABRB3FAAH | |
| SCHEMBL10024962 | 0.86 | CYP3A4 (0.46) | GABRA1GABRB2GABRG2GABRB3FAAH | |
| SCHEMBL2154216 | 0.80 | GABRA1 (0.44) | GABRA1GABRB2GABRG2GABRB3FAAH | |
| SCHEMBL2154332 | 0.80 | GABRA1 (0.44) | GABRA1GABRB2GABRG2GABRB3FAAH | |
| SCHEMBL30884226 | 0.80 | GABRA1 (0.44) | GABRA1GABRB2GABRG2GABRB3FAAH | |
| SCHEMBL12216486 | 0.80 | L3MBTL1 (0.38) | GABRA1GABRB2GABRG2GABRB3FAAH | |
| SCHEMBL4838649 | 0.78 | GABRA1 (0.43) | GABRA1GABRB2GABRG2GABRB3FAAH | |
| SCHEMBL4838647 | 0.78 | GABRA1 (0.43) | GABRA1GABRB2GABRG2GABRB3FAAH | |
| SCHEMBL15275536 | 0.77 | GABRA1 (0.41) | GABRA1GABRB2GABRG2GABRB3FAAH | |
| SCHEMBL66162 | 0.76 | GABRA1 (0.63) | GABRA1GABRB2GABRG2GABRB3FAAH |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11767449-B2 | Epoxy resin composition and electronic component device | RESONAC CORPORATION (JP) | 2023-09-26 | — | — | US | disclosed |
| WO-2023120738-A1 | SEALING MATERIAL COMPOSITION AND ELECTRONIC COMPONENT DEVICE | 株式会社レゾナック | 2023-06-29 | — | — | WO | disclosed |
| WO-2023032861-A1 | CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | 株式会社レゾナック | 2023-03-09 | — | — | WO | disclosed |
| WO-2023032860-A1 | CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | 株式会社レゾナック | 2023-03-09 | — | — | WO | disclosed |
| WO-2023032971-A1 | EPOXY RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT DEVICE | 株式会社レゾナック | 2023-03-09 | — | — | WO | disclosed |
| US-11581212-B2 | Prepreg for coreless substrate, coreless substrate and semiconductor package | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2023-02-14 | — | — | US | disclosed |
| US-10865332-B2 | Epoxy resin composition and electronic component device | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2020-12-15 | — | — | US | disclosed |
| US-10662315-B2 | Epoxy resin molding material for sealing and electronic component device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-05-26 | — | — | US | disclosed |
| US-20200140728-A1 | Epoxy Resin Composition and Electronic Component Device | RESONAC CORPORATION (JP) | 2020-05-07 | — | — | US | disclosed |
| US-20170121505-A1 | EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE | RESONAC CORPORATION (JP) | 2017-05-04 | — | — | US | disclosed |
| US-20090062430-A1 | Epoxy Resin Composition for Sealing and Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2009-03-05 | — | — | US | disclosed |
| US-20090012233-A1 | Epoxy Resin Molding Material for Sealing and Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2009-01-08 | — | — | US | disclosed |
| US-20080234409-A1 | nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage | HITACHI CHEMICAL CO., LTD. (JP) | 2008-09-25 | — | — | US | disclosed |
| US-20080039556-A1 | Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2008-02-14 | — | — | US | disclosed |
| US-20060014873-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| US-20050222300-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| WO-2003072628-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |
| WO-2003072655-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |
| EP-0841332-A1 | Method for preparing alpha-methylene-beta-methyl-gamma-butyrolactone and 4-hydroxy-butyric aldehyde as well as 2-hydroxa-3-methylene-4-methyltetrahydrofuran being valuable intermediates | Degussa Aktiengesellschaft (DE) | 1998-05-13 | — | — | EP | disclosed |
| US-3962179-A | NEOPRENE COMPOSITIONS CONTAINING TRIARYLPHOSPHINES | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1976-06-08 | — | — | US | disclosed |