Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TYR | P14679 | 2/20 | 0.44 |
| ▸ | HTT | P42858 | 2/20 | 0.41 |
| ▸ | IDO1 | P14902 | 2/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | MGLL | Q99685 | 1/20 | 0.38 |
| ▸ | LMNA | P02545 | 2/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | GAA | P10253 | 2/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | CYP2C9 | P11712 | 3/20 | 0.37 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.37 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.37 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.36 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.36 |
| ▸ | CACNA1C | Q13936 | 1/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
| ▸ | HPGD | P15428 | 1/20 | 0.35 |
| ▸ | ESR1 | P03372 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21120559 | 0.90 | CYP3A4 (0.57) | TYRHTTCYP3A4TDP1KDM4E | |
| Hydrochloric Acid SCHEMBL10880046 | 0.88 | CYP3A4 (0.55) | TYRHTTIDO1CYP3A4TDP1 | |
| SCHEMBL104124 | 0.80 | TYR (0.58) | TYRHTTIDO1MGLLLMNA | |
| Isopropylbenzene SCHEMBL28916055 | 0.79 | CYP3A4 (0.57) | CYP3A4TDP1LMNAKDM4EALDH1A1 | |
| SCHEMBL2153485 | 0.78 | TYR (0.46) | TYRHTTIDO1MGLLLMNA | |
| SCHEMBL8534159 | 0.78 | ADRB2 (0.54) | CYP3A4TDP1LMNAKDM4EMAPT | |
| SCHEMBL2153439 | 0.78 | TYR (0.41) | TYRHTTIDO1MGLLLMNA | |
| SCHEMBL10714278 | 0.78 | TYR (0.41) | TYRHTTIDO1MGLLLMNA | |
| Water SCHEMBL11726962 | 0.77 | TYR (0.55) | TYRHTTIDO1MGLLLMNA | |
| Water SCHEMBL29278796 | 0.77 | TYR (0.55) | TYRHTTIDO1MGLLLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 129 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120192630-A | Resin composition | 味之素株式会社 | 2025-06-24 | — | — | CN | disclosed |
| CN-120192629-A | Resin composition | 味之素株式会社 | 2025-06-24 | — | — | CN | disclosed |
| CN-120134737-A | Resin sheet with metal foil | 味之素株式会社 | 2025-06-13 | — | — | CN | disclosed |
| CN-120134736-A | Resin sheet with metal foil | 味之素株式会社 | 2025-06-13 | — | — | CN | disclosed |
| CN-120118471-A | Resin composition | 味之素株式会社 | 2025-06-10 | — | — | CN | disclosed |
| CN-112500622-B | Resin composition | 味之素株式会社 | 2025-05-23 | — | — | CN | disclosed |
| CN-120021354-A | Method for manufacturing circuit board | 味之素株式会社 | 2025-05-20 | — | — | CN | disclosed |
| CN-119993845-A | Method for manufacturing circuit board | 味之素株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119978708-A | Resin sheet and method for producing same, method for producing circuit board, and resin composition | 味之素株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-112876845-B | Resin composition | 味之素株式会社 | 2025-05-06 | — | — | CN | disclosed |
| US-20080039556-A1 | Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2008-02-14 | — | — | US | disclosed |
| US-20060014873-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| US-20050222300-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| WO-2003072628-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |
| WO-2003072655-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |
| EP-0531174-B1 | Oligomerization catalyst for alpha-olefins and process for oligomerizing alpha-olefins | MITSUI PETROCHEMICAL IND (JP) | 1995-06-21 | — | — | EP | disclosed |
| US-5414160-A | Use of dimerization catalyst formed in situ from organonickel compound with no nickel-halogen bond, triarylphosphine and/or monoalkyldiarylphosphine, organoaluminum compound, hydrogen; hydroformylation and hydrogenation of dimer to alcohols | MITSUBISHI KASEI CORPORATION (JP) | 1995-05-09 | — | — | US | disclosed |
| US-5286695-A | Oligomerization catalyst for α-olefins and process for oligomerizing α-olefins | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1994-02-15 | — | — | US | disclosed |
| EP-0531174-A2 | Oligomerization catalyst for alpha-olefins and process for oligomerizing alpha-olefins | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1993-03-10 | — | — | EP | disclosed |
| US-4155946-A | CATALYST CONSISTS OF A NICKEL COMPOUND, A TRIALKYL ALUMINUM COMPOUND; PHOSPHOROUS COMPOUND AND A HALOGENATED PHENOL | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1979-05-22 | — | — | US | disclosed |