SCHEMBL3775595

SCHEMBL3775595

CCOC(=O)C1(C)C=CC(C)=CC1

nearest known ligand 0.36

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.36
BRD4 O60885 1/20 0.35
OPRM1 P35372 6/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
HSD11B1 P28845 1/20 0.35
ATM Q13315 1/20 0.34
OPRD1 P41143 3/20 0.34
OPRK1 P41145 3/20 0.34
SLC22A1 O15245 2/20 0.34
SLC6A4 P31645 1/20 0.34
ADRA1A P35348 1/20 0.34
KCNH2 Q12809 1/20 0.34
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
KDM4E B2RXH2 1/20 0.33
MAPT P10636 1/20 0.33
ALOX15 P16050 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5057741 0.85 ESR1 (0.40) MAPT
SCHEMBL28446539 0.84 ESR1 (0.43) MAPT
SCHEMBL1647978 0.82 HSD11B1 (0.36) HSD11B1MEN1KMT2AKDM4E
SCHEMBL29987934 0.82 HSD11B1 (0.30) HSD11B1
SCHEMBL28546781 0.81 HSD11B1 (0.35) HSD11B1
SCHEMBL2470442 0.78 HSD11B1 (0.41) HSD11B1
SCHEMBL28757628 0.77 TSHR (0.41) BRD4OPRM1SMN1; SMN2OPRD1OPRK1
SCHEMBL28896208 0.77 RARB (0.33) MAPT
SCHEMBL29502628 0.77 HSD11B1 (0.37) HSD11B1
SCHEMBL19042880 0.77 HSD11B1 (0.37) HSD11B1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 192 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3419051-B1 CURABLE RESIN COMPOSITION AND FAN OUT TYPE WAFER LEVEL PACKAGE TAIYO HOLDINGS CO LTD (JP) 2026-04-08 EP disclosed
WO-2025124182-A1 MELAMINE-FREE PHOTOSENSITIVE THERMOSETTING DEVELOPABLE TWO-COMPONENT RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED CIRCUIT BOARD 太阳油墨(苏州)有限公司 2025-06-19 WO disclosed
WO-2025124047-A1 PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT COMPRISING CURED PRODUCT 太阳油墨(苏州)有限公司 2025-06-19 WO disclosed
CN-120161675-A Melamine-free photo-thermal curable developer two-component resin composition, dry film thereof, cured product thereof, and printed wiring board 太阳油墨(苏州)有限公司 2025-06-17 CN disclosed
CN-120161672-A Photosensitive thermosetting resin composition, dry film, cured product, and electronic component having the cured product 太阳油墨(苏州)有限公司 2025-06-17 CN disclosed
WO-2025100183-A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT 太陽ホールディングス株式会社 2025-05-15 WO disclosed
CN-119898095-A Laminate, pattern forming method, cured product, and electronic component 太阳控股株式会社 2025-04-29 CN disclosed
WO-2025074949-A1 ULTRAVIOLET-CURABLE COMPOSITION ダウ・東レ株式会社 2025-04-10 WO disclosed
CN-113453416-B Laminate, method for producing printed wiring board, and printed wiring board 互应化学工业株式会社 2025-04-08 CN disclosed
WO-2025066477-A1 ALKALI-DEVELOPABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT HAVING CURED PRODUCT 太阳油墨(苏州)有限公司 2025-04-03 WO disclosed
US-20020103272-A1 Self-curing dental adhesive DENTSPLY DETREY GMBH 2002-08-01 US disclosed
US-6399277-B1 Photopolymerizable thermosetting resin composition VANTICO INC. 2002-06-04 US disclosed
US-20020058726-A1 Dental restorative and method of restoring a tooth DENTSPLAY DETREY GMBH 2002-05-16 US disclosed
EP-0909407-B1 PHOTOPOLYMERIZABLE THERMOSETTING RESIN COMPOSITION CIBA SC HOLDING AG (CH) 2000-08-09 EP disclosed
EP-0948956-A2 Self-curing dental adhesive DENTSPLY DETREY GmbH (DE) 1999-10-13 EP disclosed
US-5712066-A ELECTROGRAPHY, CHANGE IN BIREFRINGENCE, LIQUID CRYSTALS, PHOTOSTABILITY CANON KABUSHIKI KAISHA (JP) 1998-01-27 US disclosed
US-5527650-A FORMING ELECTRIC CHARGES ON RECORDING LAYER; IRRADIATION; WRITING CANON KABUSHIKI KAISHA (JP) 1996-06-18 US disclosed
US-5468738-A Amine siloxane conpounds with metals TOKUYAMA CORPORATION (JP) 1995-11-21 US disclosed
EP-0588601-A1 Fungicide and its use TOKUYAMA CORPORATION (JP) 1994-03-23 EP disclosed
EP-0464784-A2 Image forming method, recording medium, and visible image reproducing method CANON KABUSHIKI KAISHA (JP) 1992-01-08 EP disclosed