SCHEMBL377579

SCHEMBL377579

CON(OC)c1nc(N)nc(N(C)CO)n1

nearest known ligand 0.36

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL62379 0.84 SLC29A1 (0.30)
SCHEMBL11579222 0.84 MAPT (0.37)
SCHEMBL1920771 0.82 LMNA (0.34) ALDH1A1
SCHEMBL29231394 0.82 MAPT (0.33)
SCHEMBL3732345 0.82
SCHEMBL27649444 0.81 LMNA (0.46) ALDH1A1
SCHEMBL11294618 0.79 MAPT (0.39)
SCHEMBL12656824 0.79 MAPT (0.39)
SCHEMBL27955670 0.78 NPC1 (0.33)
SCHEMBL6018337 0.77 TP53 (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 148 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4664197-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-12-17 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
US-12448485-B2 Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, pattern formation method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-21 US disclosed
US-20250298315-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-09-25 US disclosed
EP-4600741-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-08-13 EP disclosed
US-20250251665-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-08-07 US disclosed
US-20250237952-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-07-24 US disclosed
US-20250068070-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATIVE FILM, SURFACE-PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-02-27 US disclosed
EP-1645909-A2 Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film Shin-Etsu Chemical Co., Ltd. (JP) 2006-04-12 EP disclosed
US-6899991-B2 Photo-curable resin composition, patterning process, and substrate protecting film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-05-31 US disclosed
US-20040142276-A1 Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-07-22 US disclosed
US-6590010-B2 Containing units from 4,4'-(9H-fluoren-9-ylidene) bis((2-propenyl) phenol) SHIN-ETSU CHEMICALS, CO., LTD. (JP) 2003-07-08 US disclosed
US-20030113662-A1 Photo-curable resin composition, patterning process, and substrate protecting film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-06-19 US disclosed
EP-1186624-B1 Organosiloxane polymers and photo-curable resin compositions SHINETSU CHEMICAL CO (JP) 2003-03-05 EP disclosed
US-20020055550-A1 Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coating SHIN-ETSU CHEMICAL CO. LTD. (JP) 2002-05-09 US disclosed
EP-1186624-A1 Organosiloxane polymers and photo-curable resin compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-03-13 EP disclosed
US-4059665-A ACRYLIC COPOLYMER, POLYALKYLENE GLYCOL ROHM AND HAAS COMPANY (US) 1977-11-22 US disclosed
US-3982410-A Apparatus for the continuous treatment of an advancing web COTTON INCORPORATED (US) 1976-09-28 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 ALDH1A1 3281/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.