SCHEMBL377698

SCHEMBL377698

C=CC(F)OP(=O)(O)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL87741 0.83
SCHEMBL89079 0.83 PGK1 (0.31)
Ammonia Solution, Strong SCHEMBL8940794 0.81 PGK1 (0.30)
SCHEMBL720356 0.81 PGK1 (0.30)
Ammonia Solution, Strong SCHEMBL7056618 0.81 PGK1 (0.30)
Ammonia Solution, Strong SCHEMBL89965 0.81 PGK1 (0.30)
SCHEMBL1170282 0.81 PGK1 (0.30)
SCHEMBL377699 0.77
SCHEMBL2099614 0.77
SCHEMBL15254488 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 131 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3527639-B1 A METHOD FOR BONDING A THERMOPLASTIC MATERIAL BY MICROWAVE-IRRADIATION PROIONIC GMBH (AT) 2021-09-08 EP claimed
US-11084954-B2 Method for curing an adhesive using microwave irradiation PROIONIC GMBH (AT) 2021-08-10 US claimed
CN-107075317-B Conductive adhesive film and dicing die bonding film 古河电气工业株式会社 2020-10-02 CN claimed
US-10745620-B2 Reactive mesogen formulation with conductive additive MERCK PATENT GMBH (DE) 2020-08-18 US claimed
EP-3216837-B1 ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM FURUKAWA ELECTRIC CO LTD (JP) 2020-07-15 EP claimed
US-20190169469-A1 METHOD FOR CURING AN ADHESIVE USING MICROWAVE IRRADIATION PROIONIC GMBH (AT) 2019-06-06 US claimed
US-20180294242-A1 ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM FURUKAWA ELECTRIC CO., LTD. (JP) 2018-10-11 US claimed
US-20180026003-A1 ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM FURUKAWA ELECTRIC CO., LTD. (JP) 2018-01-25 US claimed
US-20170283699-A1 REACTIVE MESOGEN FORMULATION WITH CONDUCTIVE ADDITIVE MERCK PATENT GMBH (DE) 2017-10-05 US claimed
EP-3216837-A1 ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM Furukawa Electric Co. Ltd. (JP) 2017-09-13 EP claimed
EP-2812413-B1 REACTIVE MESOGEN FORMULATION WITH CONDUCTIVE ADDITIVE MERCK PATENT GMBH (DE) 2016-03-16 EP claimed
US-20150008373-A1 REACTIVE MESOGEN FORMULATION WITH CONDUCTIVE ADDITIVE MERCK PATENT GMBH (DE) 2015-01-08 US claimed
EP-2812413-A1 REACTIVE MESOGEN FORMULATION WITH CONDUCTIVE ADDITIVE Merck Patent GmbH (DE) 2014-12-17 EP claimed
WO-2013117284-A1 REACTIVE MESOGEN FORMULATION WITH CONDUCTIVE ADDITIVE MERCK PATENT GMBH (DE) 2013-08-15 WO claimed
US-7501522-B2 Method for the production of purified 1,3-substituted imidazolium salts BASF AKTIENGESELLSCHAFT (DE) 2009-03-10 US claimed
EP-1786776-B1 METHOD FOR PRODUCING HIGH-PURITY QUATERNARY AMMONIUM COMPOUNDS BASF SE (DE) 2008-12-03 EP claimed
US-20080033209-A1 Method For High-Purity Quaternary Ammonium Compounds BASF AKTIENGSELLSCHAFT (DE) 2008-02-07 US claimed
US-20080009633-A1 Method for Producing High-Purity Quaternary Ammonium Compounds BASF AKTIENGESELLSCHAFT (DE) 2008-01-10 US claimed
EP-1651614-B1 METHOD FOR THE PRODUCTION OF PURIFIED 1,3-SUBSTITUTED IMIDAZOLIUM SALTS BASF AG (DE) 2007-07-11 EP claimed
US-20060149074-A1 Method for the production of purified 1,3-substituted imidazolium salts BASF AKTIENGESELLSCHAFT (DE) 2006-07-06 US claimed