SCHEMBL3780912

SCHEMBL3780912

C1=CC2CCC1C2.CCC(=O)O[Si](C)(C)C

nearest known ligand 0.31

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CHRM2 P08172 2/20 0.31
CHRM4 P08173 2/20 0.31
CHRM1 P11229 2/20 0.31
CHRM3 P20309 2/20 0.31
CYP19A1 P11511 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4090493 0.79
SCHEMBL1291088 0.78
SCHEMBL741428 0.76 ALDH1A1 (0.38)
SCHEMBL29834082 0.76 ALDH1A1 (0.38)
SCHEMBL30825208 0.76 ALDH1A1 (0.38)
SCHEMBL949196 0.74
SCHEMBL21433605 0.70 ALDH1A1 (0.48)
Alcohol SCHEMBL15105323 0.69 ALDH1A1 (0.35)
SCHEMBL7885704 0.69 ALDH1A1 (0.39)
Propane SCHEMBL27920210 0.68 KDM4E (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7524594-B2 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films PROMERUS LLC (US) 2009-04-28 US claimed
EP-1778759-A1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES Promerus, LLC (US) 2007-05-02 EP claimed
WO-2006017035-A1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES PROMERUS LLC (US) 2006-02-16 WO claimed
US-20060008734-A1 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films SUMITOMO BAKELITE CO., LTD. (JP) 2006-01-12 US claimed
US-7858721-B2 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films PROMERUS LLC (US) 2010-12-28 US disclosed
US-20090215976-A1 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films PROMERUS LLC 2009-08-27 US disclosed
US-7524594-B2 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films PROMERUS LLC (US) 2009-04-28 US disclosed
EP-1778759-B1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES PROMERUS LLC (US) 2008-11-12 EP disclosed
EP-1778759-A1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES Promerus, LLC (US) 2007-05-02 EP disclosed
WO-2006017035-A1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES PROMERUS LLC (US) 2006-02-16 WO disclosed
US-20060008734-A1 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films SUMITOMO BAKELITE CO., LTD. (JP) 2006-01-12 US disclosed