SCHEMBL380591

SCHEMBL380591

COc1ccc(CP(C)c2ccccc2)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 2/20 0.55
CA4 P22748 1/20 0.46
SIGMAR1 Q99720 1/20 0.46
IDO1 P14902 2/20 0.44
HTT P42858 1/20 0.44
KDM1A O60341 1/20 0.42
USP2 O75604 1/20 0.41
TP53 P04637 1/20 0.41
AGXT P21549 1/20 0.41
TRPA1 O75762 1/20 0.41
TAAR1 Q96RJ0 1/20 0.41
KDM4E B2RXH2 1/20 0.41
CA12 O43570 1/20 0.41
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
CA7 P43166 1/20 0.41
CA9 Q16790 1/20 0.41
CA14 Q9ULX7 1/20 0.41
LDHA P00338 1/20 0.41
TDP1 Q9NUW8 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL381509 0.83 LTA4H (0.57) LTA4HCA4SIGMAR1IDO1HTT
SCHEMBL381566 0.83 LTA4H (0.57) LTA4HCA4SIGMAR1IDO1HTT
SCHEMBL374478 0.82 TP53 (0.42) IDO1TP53TRPA1KDM4ETDP1
SCHEMBL8156353 0.81 LTA4H (0.55) LTA4HCA4SIGMAR1IDO1HTT
SCHEMBL14604190 0.81 LTA4H (0.55) LTA4HCA4SIGMAR1IDO1HTT
SCHEMBL1144423 0.80 LTA4H (0.53) LTA4HCA4SIGMAR1IDO1HTT
Hydrochloric Acid SCHEMBL11575591 0.80 TP53 (0.40) IDO1TP53AGXTTRPA1KDM4E
Hydrochloric Acid SCHEMBL11575583 0.80 TP53 (0.40) IDO1TP53AGXTTRPA1KDM4E
Fluoride SCHEMBL27907089 0.80 TP53 (0.40) SIGMAR1IDO1TP53TRPA1TAAR1
SCHEMBL28200982 0.79 LTA4H (0.52) LTA4HCA4SIGMAR1IDO1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1666535-B1 RESIN COMPOSITION AND COMPOSITE USING THE COMPOSITION AND PRODUCTION PROCESS THEREOF DAICEL EVONIK LTD (JP) 2015-11-04 EP disclosed
US-8461248-B2 Resin composition and molded product thereof, and method for their production SONY CORPORATION (JP) 2013-06-11 US disclosed
EP-1674526-B9 POLYACETAL RESIN COMPOSITION POLYPLASTICS CO (JP) 2013-05-29 EP disclosed
EP-1674526-B1 POLYACETAL RESIN COMPOSITION POLYPLASTICS CO (JP) 2012-12-05 EP disclosed
EP-2230275-B1 Resin composition and molded product thereof, and method for their production SONY CORP (JP) 2012-11-21 EP disclosed
EP-1679346-B1 POLYACETAL RESIN COMPOSITION POLYPLASTICS CO (JP) 2012-11-14 EP disclosed
EP-2258761-B1 Polyester molding for use with a casing SONY CORP (JP) 2012-01-25 EP disclosed
US-8029910-B2 Resin composition and composite using the composition and production process thereof DAICEL-EVONIK LTD. (JP) 2011-10-04 US disclosed
US-7989540-B2 Resin composition and composite using the composition and production process thereof DAICEL-EVONIK LTD. (JP) 2011-08-02 US disclosed
EP-2258761-A1 Polyester molding for use with a casing Sony Corporation (JP) 2010-12-08 EP disclosed
EP-1502928-A1 MOLDED POLYESTER FOR HOUSING Sony Corporation (JP) 2005-02-02 EP disclosed
EP-1498460-A1 BIODEGRADABLE FLAME RETARDANT COMPOSITE COMPOSITION AND PROCESS FOR PRODUCING THE SAME Sony Corporation (JP) 2005-01-19 EP disclosed
US-6753363-B1 BASIC NITROGEN-CONTAINING COMPOUND, PHOSPHORUS COMPOUND FLAME RETARDANT, AND AROMATIC COMPOUND ACCELERATOR; MOLDABILITY POLYPLASTICS CO., LTD. (JP) 2004-06-22 US disclosed
US-6673405-B2 HINDERED PHENOL-SERIES COMPOUND, A WEATHER (LIGHT)-RESISTANT STABILIZER, AND A SPIRO-COMPOUND HAVING A TRIAZINE RING, PARTICULARLY A BIS(GUANAMINOHYDROCARBYL)-2,4,8,10-TETRAOXASPIRO(5.5)UNDECANE POLYPLASTICS CO., LTD. (JP) 2004-01-06 US disclosed
EP-1375597-A1 RADIATION-SENSITIVE COMPOSITION CHANGING IN REFRACTIVE INDEX AND UTILIZATION THEREOF JSR Corporation (JP) 2004-01-02 EP disclosed
US-20030171468-A1 Radiation-sensitive composition changing in refractive index and utilization thereof JSR CORPORATION (JP) 2003-09-11 US disclosed
US-20030036591-A1 Polyacetal resin composition and process for its production POLYPLASTICS CO., LTD. (JP) 2003-02-20 US disclosed
US-20030018099-A1 Polyester molding for use with a casing Lerner, David, Littenberg, Krumholz & Mentlik, LLP 2003-01-23 US disclosed
EP-1275690-A2 Polyester molding for use with a casing SONY CORPORATION (JP) 2003-01-15 EP disclosed
EP-1264858-A1 POLYACETAL RESIN COMPOSITION AND PROCESS FOR ITS PRODUCTION Polyplastics Co Ltd (JP) 2002-12-11 EP disclosed