SCHEMBL3835518

SCHEMBL3835518

C=C(C)C(=O)OCCOc1ccc(-c2nc(-c3ccc(C)cc3)nc(-c3ccc(C)cc3)n2)c(O)c1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 5/20 0.43
POLB P06746 3/20 0.43
APEX1 P27695 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
GSTP1 P09211 3/20 0.40
MAPT P10636 8/20 0.39
ALDH1A1 P00352 4/20 0.39
SMN1; SMN2 Q16637 3/20 0.38
HPGD P15428 3/20 0.38
KMT2A Q03164 6/20 0.38
NPSR1 Q6W5P4 6/20 0.38
MEN1 O00255 4/20 0.38
LMNA P02545 4/20 0.38
CYP1A2 P05177 1/20 0.38
CYP3A4 P08684 1/20 0.38
GAA P10253 1/20 0.38
CYP2C9 P11712 1/20 0.38
CYP2C19 P33261 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
NPC1 O15118 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14274498 0.90 POLB (0.45) HTTPOLBAPEX1TDP1GSTP1
SCHEMBL8518667 0.90 POLB (0.46) HTTPOLBAPEX1TDP1GSTP1
SCHEMBL2237946 0.90 POLB (0.46) HTTPOLBAPEX1TDP1GSTP1
SCHEMBL29512556 0.90 POLB (0.46) HTTPOLBAPEX1TDP1GSTP1
SCHEMBL30887231 0.89 HTT (0.43) HTTPOLBAPEX1TDP1GSTP1
SCHEMBL8383168 0.89 HTT (0.43) HTTPOLBAPEX1TDP1GSTP1
SCHEMBL12652439 0.89 PDE3B (0.45) HTTPOLBTDP1MAPTALDH1A1
SCHEMBL16676012 0.85 POLB (0.51) HTTPOLBAPEX1TDP1GSTP1
SCHEMBL29664981 0.85 THRB (0.45) HTTPOLBTDP1MAPTALDH1A1
SCHEMBL3839927 0.85 POLB (0.43) HTTPOLBAPEX1TDP1GSTP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1752508-B1 Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board NITTO DENKO CORP (JP) 2009-10-14 EP disclosed
US-20070036953-A1 Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board NITTO DENKO CORPORATION 2007-02-15 US disclosed
EP-1752508-A1 Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board. NITTO DENKO CORPORATION (JP) 2007-02-14 EP disclosed