⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3850791 | 1.00 | — | — | |
| SCHEMBL3853601 | 0.89 | — | — | |
| SCHEMBL29226857 | 0.89 | — | — | |
| Magnesium SCHEMBL31548696 | 0.89 | — | — | |
| SCHEMBL3853598 | 0.89 | — | — | |
| SCHEMBL31145834 | 0.87 | — | — | |
| SCHEMBL16583531 | 0.87 | — | — | |
| SCHEMBL2302193 | 0.87 | — | — | |
| SCHEMBL9344017 | 0.87 | — | — | |
| SCHEMBL4040170 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118497547-B | High-strength conductive copper-nickel-cobalt-silicon alloy established based on cluster method and preparation process and application thereof | 大连交通大学 | 2025-03-04 | — | — | CN | claimed |
| CN-118291809-B | High-conductivity high-heat-dissipation copper-cobalt-nickel-silicon alloy strip foil and preparation method thereof | 宁波兴业盛泰集团有限公司 | 2025-02-25 | — | — | CN | claimed |
| CN-118497547-A | High-strength conductive copper-nickel-cobalt-silicon alloy established based on cluster method and preparation process and application thereof | 大连交通大学 | 2024-08-16 | — | — | CN | claimed |
| CN-118291809-A | High-conductivity high-heat-dissipation copper-cobalt-nickel-silicon alloy strip foil and preparation method thereof | 宁波兴业盛泰集团有限公司 | 2024-07-05 | — | — | CN | claimed |
| CN-118166226-A | Preparation method of non-vacuum down-lead copper-nickel-cobalt-silicon alloy cast ingot | 陕西斯瑞扶风先进铜合金有限公司 | 2024-06-11 | — | — | CN | claimed |
| CN-121555848-A | Low-stress copper-cobalt-nickel-silicon alloy and preparation method and application thereof | 宁波金田铜业(集团)股份有限公司 | 2026-02-24 | — | — | CN | disclosed |
| CN-121555848-A | Low-stress copper-cobalt-nickel-silicon alloy and preparation method and application thereof | 宁波金田铜业(集团)股份有限公司 | 2026-02-24 | — | — | CN | disclosed |
| CN-120536776-B | Copper-nickel-cobalt-silicon alloy for CPU Socket and preparation method thereof | 宁波兴博浩广科技发展有限公司 | 2025-12-23 | — | — | CN | disclosed |
| CN-120536776-A | Copper-nickel-cobalt-silicon alloy for CPU Socket and preparation method thereof | 宁波兴博浩广科技发展有限公司 | 2025-08-26 | — | — | CN | disclosed |
| CN-120485590-A | Ultrathin high-strength middle-conductivity bending-resistant copper-nickel-cobalt-silicon alloy and preparation method thereof | 浙江惟精新材料股份有限公司 | 2025-08-15 | — | — | CN | disclosed |
| CN-120485590-A | Ultrathin high-strength middle-conductivity bending-resistant copper-nickel-cobalt-silicon alloy and preparation method thereof | 浙江惟精新材料股份有限公司 | 2025-08-15 | — | — | CN | disclosed |
| CN-118497547-B | High-strength conductive copper-nickel-cobalt-silicon alloy established based on cluster method and preparation process and application thereof | 大连交通大学 | 2025-03-04 | — | — | CN | disclosed |
| WO-2023096150-A1 | METHOD FOR PRODUCING COPPER ALLOY SHEET FOR VEHICLE OR ELECTRIC/ELECTRONIC COMPONENT HAVING EXCELLENT STRENGTH, ELECTRICAL CONDUCTIVITY, AND BENDABILITY, AND COPPER ALLOY SHEET PRODUCED THEREBY | 주식회사 풍산 | 2023-06-01 | — | — | WO | disclosed |
| CN-108239709-B | Elastic copper alloy, strip and strip thereof and composite heat treatment method | 有研工程技术研究院有限公司 | 2020-07-17 | — | — | CN | disclosed |
| EP-3158095-B1 | COPPER-NICKEL-SILICON ALLOYS | GBC METALS LLC (US) | 2018-05-02 | — | — | EP | disclosed |
| EP-3158095-A1 | COPPER-NICKEL-SILICON ALLOYS | GBC Metals, LLC (US) | 2017-04-26 | — | — | EP | disclosed |
| CN-101939452-A | Copper-nickel-silicon alloys | GBC METALS LLC | 2011-01-05 | — | — | CN | disclosed |
| WO-2009082695-A9 | COPPER-NICKEL-SILICON ALLOYS | GBC METALS LLC (US) | 2009-09-24 | — | — | WO | disclosed |
| US-20090183803-A1 | COPPER-NICKEL-SILICON ALLOYS | GBC METALS, LLC | 2009-07-23 | — | — | US | disclosed |
| WO-2009082695-A1 | COPPER-NICKEL-SILICON ALLOYS | GBC METALS LLC (US) | 2009-07-02 | — | — | WO | disclosed |