SCHEMBL385146

SCHEMBL385146

CC1(COCc2ccc(COCC3(C)COC3)cc2)COC1

nearest known ligand 0.37

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.37
ACACB O00763 1/20 0.36
GPR84 Q9NQS5 2/20 0.36
KCNH2 Q12809 2/20 0.36
DHFR P00374 1/20 0.35
DCPS Q96C86 1/20 0.35
TACR1 P25103 2/20 0.33
TSHR P16473 1/20 0.33
FFAR1 O14842 1/20 0.31
SLC5A1 P13866 1/20 0.31
SLC5A2 P31639 1/20 0.31
CACNA1H O95180 2/20 0.30
TP53 P04637 1/20 0.30
MDM2 Q00987 1/20 0.30
CACNA1G O43497 1/20 0.30
CACNA1I Q9P0X4 1/20 0.30
MBOAT4 Q96T53 1/20 0.30
CNR2 P34972 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12540784 0.98 TSHR (0.37) EPHX1ACACBGPR84KCNH2DHFR
SCHEMBL9936046 0.94 ACACB (0.34) EPHX1ACACBGPR84KCNH2DHFR
SCHEMBL17857761 0.93 ACACB (0.34) EPHX1ACACBGPR84KCNH2DHFR
SCHEMBL20175949 0.91 IDO1 (0.40) ACACBGPR84KCNH2DHFRDCPS
SCHEMBL5423335 0.91 TSHR (0.48) DHFRDCPSTACR1TSHR
SCHEMBL13320413 0.88 TSHR (0.34) EPHX1ACACBGPR84KCNH2DHFR
SCHEMBL14207637 0.87 ALDH1A1 (0.33) ACACBGPR84KCNH2DHFRDCPS
SCHEMBL12101385 0.85 FFAR1 (0.38) GPR84DHFRDCPSTACR1TSHR
SCHEMBL9950467 0.84 TSHR (0.33) EPHX1ACACBGPR84TSHR
SCHEMBL24933884 0.84 TSHR (0.45) TACR1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 413 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120044753-B Photosensitive dry film, photosensitive resin composition, cured film and printed circuit board Hangzhou foster Electronic Materials Co.,Ltd. (CN) 2026-05-26 CN claimed
CN-120044753-A Photosensitive dry film, photosensitive resin composition, cured film and printed circuit board 杭州福斯特电子材料有限公司 2025-05-27 CN claimed
CN-105176003-B Epoxy resin composite of nano core shell rubber particle toughening and preparation method thereof 固德电材系统(苏州)股份有限公司 2018-05-18 CN claimed
CN-105176003-A Nanometer core-shell rubber particle toughening epoxy resin compound and preparation method of nanometer core-shell rubber particle toughening epoxy resin compound GOODS EIS SUZHOU CORP LTD 2015-12-23 CN claimed
CN-102056950-B Curable compositions DENKI KAGAKU KOGYO KK 2013-04-24 CN claimed
CN-102719071-A Buckling deformation-resistant glass fiber reinforced polycarbonate resin and preparation method thereof SHANGHAI KUMHO SUNNY PLASTICS 2012-10-10 CN claimed
US-7514502-B2 Thermoplastic resin composition having improved external appearance and excellent weatherability LG CHEM, LTD. (KR) 2009-04-07 US claimed
EP-1631621-A4 THERMOPLASTIC RESIN COMPOSITION HAVING IMPROVED EXTERNAL APPEARANCE AND EXCELLENT WEATHERABILITY LG CHEMICAL LTD (KR) 2007-04-11 EP claimed
US-20060148992-A1 Thermoplastic resin composition having improved external appearance and excellent weatherability LG CHEM, LTD. (KR) 2006-07-06 US claimed
EP-1631621-A1 THERMOPLASTIC RESIN COMPOSITION HAVING IMPROVED EXTERNAL APPEARANCE AND EXCELLENT WEATHERABILITY LG Chem, Ltd. (KR) 2006-03-08 EP claimed
WO-2004108823-A1 THERMOPLASTIC RESIN COMPOSITION HAVING IMPROVED EXTERNAL APPEARANCE AND EXCELLENT WEATHERABILITY LG CHEM, LTD. (KR) 2004-12-16 WO claimed
CN-1157439-C Curable resin composition adhesive composition, cured product and composite 电气化学工业株式会社 2004-07-14 CN claimed
CN-1203255-A Curable resin composition adhesive composition, cured product and composite DENKI KAGAKU KOGYO KK (JP) 1998-12-30 CN claimed
CN-1169742-A Molding material and molded motor MATSUSHITA ELECTRIC IND C LTD (JP) 1998-01-07 CN claimed
CN-120044753-B Photosensitive dry film, photosensitive resin composition, cured film and printed circuit board Hangzhou foster Electronic Materials Co.,Ltd. (CN) 2026-05-26 CN disclosed
US-12516211-B2 Ink composition and electronic device including film formed using the ink composition SAMSUNG DISPLAY CO., LTD. (KR) 2026-01-06 US disclosed
US-12443101-B2 Cured coating film TAIYO HOLDINGS CO., LTD. (JP) 2025-10-14 US disclosed
CN-1169742-A Molding material and molded motor MATSUSHITA ELECTRIC IND C LTD (JP) 1998-01-07 CN disclosed
CN-1167801-A Curable resin composition DENKI KAGAKU KOGYO KK (JP) 1997-12-17 CN disclosed
CN-1068126-A VINYL MONOMER COMPOSITIONS WITH ACCELERATED SURFACE CURE ROHM & HAAS (US) 1993-01-20 CN disclosed