SCHEMBL3854639

SCHEMBL3854639

O=C(O)c1ccc(Oc2ccccc2Sc2ccccc2)cc1C(=O)O

nearest known ligand 0.52

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
PYGL P06737 12/20 0.52
POLB P06746 2/20 0.51
PYGM P11217 13/20 0.50
HPSE Q9Y251 1/20 0.45
KDM4E B2RXH2 1/20 0.43
GALK1 P51570 1/20 0.43
CASP6 P55212 1/20 0.43
MCL1 Q07820 1/20 0.43
PLEC Q15149 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
ALDH1A1 P00352 1/20 0.43
SIRT1 Q96EB6 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10961180 0.89 POLB (0.47) PYGLPOLBPYGMHPSEKDM4E
SCHEMBL5086008 0.84 POLB (0.48) PYGLPOLBPYGMHPSEGALK1
SCHEMBL7969637 0.83 POLB (0.65) PYGLPOLBPYGMHPSEKDM4E
SCHEMBL29664286 0.83 POLB (0.65) PYGLPOLBPYGMHPSEKDM4E
SCHEMBL28650646 0.81 POLB (0.63) PYGLPOLBPYGMHPSEKDM4E
SCHEMBL8671716 0.80 HPSE (0.48) PYGLPOLBPYGMHPSEKDM4E
SCHEMBL6891584 0.80 POLB (0.66) PYGLPOLBPYGMHPSEKDM4E
SCHEMBL28634306 0.80 POLB (0.61) PYGLPOLBPYGMHPSEKDM4E
SCHEMBL7257602 0.79 POLB (0.59) PYGLPOLBPYGMHPSEKDM4E
SCHEMBL3073043 0.77 POLB (0.62) PYGLPOLBPYGMHPSEKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070066765-A1 Polyarlyl ether ketone polymer blends GENERAL ELECTRIC COMPANY (US) 2007-03-22 US claimed
EP-1639044-A2 POLYIMIDE RESIN WITH REDUCED MOLD DEPOSIT GENERAL ELECTRIC COMPANY (US) 2006-03-29 EP claimed
WO-2004113446-A2 POLYIMIDE RESIN WITH REDUCED MOLD DEPOSIT GENERAL ELECTRIC COMPANY (US) 2004-12-29 WO claimed
US-20230375750-A1 OPTICAL FILM WITH IMPROVED OPTICAL PROPERTIES, DISPLAY APPARATUS COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR KOLON INDUSTRIES, INC. (KR) 2023-11-23 US disclosed
EP-2961798-B1 IMPROVED WEAR AND FRICTION PROPERTIES OF ENGINEERING THERMOPLASTICS WITH ULTRA-HIGH MOLECULAR WEIGHT POLYETHYLENE SABIC GLOBAL TECHNOLOGIES BV (NL) 2020-07-15 EP disclosed
EP-3008127-B1 WEAR RESISTANT COMPOSITIONS WITH LOW PARTICULATE CONTAMINATION AND METHOD OF MAKING THOSE COMPOSITIONS SABIC GLOBAL TECHNOLOGIES BV (NL) 2018-05-30 EP disclosed
EP-3008127-A2 WEAR RESISTANT COMPOSITIONS WITH LOW PARTICULATE CONTAMINATION AND METHOD OF MAKING THOSE COMPOSITIONS SABIC Global Technologies B.V. (NL) 2016-04-20 EP disclosed
EP-2032634-B1 POLYIMIDE SOLVENT CAST FILMS HAVING LOW COEFFICIENT OF THERMAL EXPANSION AND METHOD OF MANUFACTURE THEREOF GEN ELECTRIC (US) 2015-05-13 EP disclosed
US-9011998-B2 Polyaryl ether ketone polymer blends SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2015-04-21 US disclosed
US-8945694-B2 Poly aryl ether ketone polymer blends SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2015-02-03 US disclosed
EP-2553011-B1 POLYMER COMPOSITIONS COMPRISING CORE/SHELL PARTICLES SOLVAY (BE) 2014-12-31 EP disclosed
US-20080006970-A1 Filtered polyetherimide polymer for use as a high heat fiber material GENERAL ELECTRIC COMPANY (US) 2008-01-10 US disclosed
US-20080004391-A1 METHODS OF PREPARING POLYMER-ORGANOCLAY COMPOSITES AND ARTICLES DERIVED THEREFROM SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2008-01-03 US disclosed
WO-2008002870-A2 METHODS OF PREPARING POLYMER-ORGANOCLAY COMPOSITES AND ARTICLES DERIVED THEREFROM SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2008-01-03 WO disclosed
US-20070299188-A1 COMPOSITIONS AND METHODS FOR POLYMER COMPOSITES CITIBANK, N.A., AS COLLATERAL AGENT 2007-12-27 US disclosed
US-20070197739-A1 POLY ARYL ETHER KETONE POLYMER BLENDS SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2007-08-23 US disclosed
US-20070066765-A1 Polyarlyl ether ketone polymer blends GENERAL ELECTRIC COMPANY (US) 2007-03-22 US disclosed
US-20060142542-A1 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2006-06-29 US disclosed
US-6500904-B1 FROM THE COUPLING OF LOWER MOLECULAR WEIGHT FUNCTIONALIZED PRECURSOR POLYIMIDES GENERAL ELECTRIC COMPANY 2002-12-31 US disclosed
US-5204399-A Rapidly and at low temperatures attaching to a lead frame paddle; wire bonding and molding; aromatic polyimidesiloxane copolymers NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) 1993-04-20 US disclosed