Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 2/20 | 0.62 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.62 |
| ▸ | MGLL | Q99685 | 7/20 | 0.55 |
| ▸ | HSP90AA1 | P07900 | 5/20 | 0.48 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.48 |
| ▸ | PKM | P14618 | 3/20 | 0.48 |
| ▸ | NPSR1 | Q6W5P4 | 3/20 | 0.48 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.48 |
| ▸ | TLR9 | Q9NR96 | 2/20 | 0.43 |
| ▸ | HPGD | P15428 | 3/20 | 0.42 |
| ▸ | CCR6 | P51684 | 3/20 | 0.42 |
| ▸ | G6PD | P11413 | 2/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.42 |
| ▸ | HTT | P42858 | 2/20 | 0.42 |
| ▸ | MAPT | P10636 | 1/20 | 0.42 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.42 |
| ▸ | POLB | P06746 | 1/20 | 0.42 |
| ▸ | TP53 | P04637 | 1/20 | 0.42 |
| ▸ | ANPEP | P15144 | 1/20 | 0.40 |
| ▸ | DPP4 | P27487 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30474623 | 1.00 | ESR1 (0.62) | ESR1ESR2MGLLHSP90AA1TDP1 | |
| SCHEMBL3183796 | 0.80 | HPGD (0.63) | ESR1ESR2MGLLHSP90AA1TDP1 | |
| SCHEMBL30104193 | 0.80 | HPGD (0.63) | ESR1ESR2MGLLHSP90AA1TDP1 | |
| SCHEMBL29485049 | 0.80 | MGLL (0.59) | MGLLHSP90AA1TDP1PKMNPSR1 | |
| SCHEMBL717739 | 0.80 | MGLL (0.59) | MGLLHSP90AA1TDP1PKMNPSR1 | |
| SCHEMBL1741609 | 0.78 | TLR9 (0.61) | MGLLHSP90AA1TDP1PKMNPSR1 | |
| SCHEMBL29898506 | 0.78 | TLR9 (0.61) | MGLLHSP90AA1TDP1PKMNPSR1 | |
| SCHEMBL30474621 | 0.78 | MGLL (0.59) | ESR1ESR2MGLLHSP90AA1TDP1 | |
| SCHEMBL9838914 | 0.78 | MGLL (0.59) | ESR1ESR2MGLLHSP90AA1TDP1 | |
| SCHEMBL19371511 | 0.77 | MGLL (0.55) | ESR1ESR2MGLLHSP90AA1TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116217788-A | Anti-solvent vinyl polymer and synthetic method and application thereof | 乐凯华光印刷科技有限公司 | 2023-06-06 | — | — | CN | disclosed |
| US-10106683-B2 | Resin composite, semiconductor device, and method of manufacturing the semiconductor device | FUJI ELECTRIC CO., LTD. (JP) | 2018-10-23 | — | — | US | disclosed |
| US-9870972-B2 | Thermosetting resin molded article | FUJI ELECTRIC CO., LTD. (JP) | 2018-01-16 | — | — | US | disclosed |
| US-20170240744-A1 | RESIN COMPOSITE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. (JP) | 2017-08-24 | — | — | US | disclosed |
| US-20170047263-A1 | THERMOSETTING RESIN MOLDED ARTICLE | FUJI ELECTRIC CO., LTD. (JP) | 2017-02-16 | — | — | US | disclosed |
| CN-103717634-B | For semiconductor packages composition epoxy resin, use its semiconductor device and the method being used for producing the semiconductor devices | 纳美仕有限公司 | 2016-11-23 | — | — | CN | disclosed |
| CN-104010815-A | Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate | TAIYO INK MFG CO LTD | 2014-08-27 | — | — | CN | disclosed |
| CN-103717634-A | Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and method for producing semiconductor device | NAMICS CORP | 2014-04-09 | — | — | CN | disclosed |
| CN-102369482-B | Curable resin composition and printed wiring board | TAIYO INK MFG CO LTD | 2013-07-17 | — | — | CN | disclosed |
| WO-2013018847-A1 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | NAMICS CORPORATION (JP) | 2013-02-07 | — | — | WO | disclosed |
| US-20060216436-A1 | WIDE-VIEWING ANGLE COMPENSATION FILM AND TRANSMISSION TYPE LIQUID-CRYSTAL DISPLAY EMPLOYING THE SAME | TOSOH CORPORATION (JP) | 2006-09-28 | — | — | US | disclosed |
| US-7001967-B2 | Resin with excellent heat resistance and dynamic characteristics, having negative birefringence and exhibiting a high refractive index and a high Abbe number, especially optical compensating members such as films, sheets and | TOSOH CORPORATION (JP) | 2006-02-21 | — | — | US | disclosed |
| US-20040063887-A1 | Transparent heat-resistant resin optical material and film | TOSOH CORPORATION (JP) | 2004-04-01 | — | — | US | disclosed |
| EP-1403297-A1 | Transparent heat-resistant resin optical material and film | Tosoh Corporation (JP) | 2004-03-31 | — | — | EP | disclosed |
| US-5075453-A | Process for producing aryloxy-substituted phosphazene derivatives | NIPPON SODA CO., LTD. (JP) | 1991-12-24 | — | — | US | disclosed |
| US-4855389-A | Process for producing phosphonitrile oligomers containing maleimidophenoxy group | SHIN NISSO KAKO CO., LTD. (JP) | 1989-08-08 | — | — | US | disclosed |
| US-4816523-A | LIGHT SENSITIVE ELEMENTS | UBE INDUSTRIES, LTD. (JP) | 1989-03-28 | — | — | US | disclosed |
| US-4740561-A | MALEIC ANHYDRIDE UNSATURATED HYDROCARBON COPOLYMER REACTED WITH AMINOPHENOL | UBE INDUSTRIES, LTD. (JP) | 1988-04-26 | — | — | US | disclosed |
| US-4289699-A | DISSOLVING CORRESPONSING ESTER IN OXYACID, HYDROLYSIS, PRECIPITATION | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1981-09-15 | — | — | US | disclosed |
| US-4231934-A | TREATING A N-(HYDROXYPHENYL)MALEAMIC ACID WITH A DEHYDRATING AGENT | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1980-11-04 | — | — | US | disclosed |