SCHEMBL3873065

SCHEMBL3873065

C=C(C)C(=O)OOCC(C)OC(C)COOC(=O)C(=C)C

nearest known ligand 0.48

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.48
ALDH1A1 P00352 2/20 0.38
THRB P10828 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9063791 0.83 TSHR (0.63) TSHRALDH1A1THRB
SCHEMBL4331907 0.79 TSHR (0.76) TSHRALDH1A1THRB
Methacrylic Acid SCHEMBL23466855 0.77 TSHR (0.46) TSHRALDH1A1THRB
SCHEMBL6248142 0.76 TSHR (0.44) TSHRALDH1A1THRB
SCHEMBL2927266 0.74 TSHR (0.42) TSHRALDH1A1THRB
SCHEMBL28516066 0.73 ALDH1A1 (0.48) TSHRALDH1A1THRB
SCHEMBL473649 0.73 TSHR (0.55) TSHRALDH1A1THRB
SCHEMBL27492764 0.73 TSHR (0.66) TSHRALDH1A1THRB
SCHEMBL27523975 0.72 TSHR (0.43) TSHRALDH1A1THRB
SCHEMBL15754169 0.72 TSHR (0.48) TSHRALDH1A1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7482111-B2 Negative radiation-sensitive resin composition JSR CORPORATION (JP) 2009-01-27 US disclosed
US-20070190450-A1 Negative radiation-sensitive resin composition JSR CORPORATION (JP) 2007-08-16 US disclosed
US-7214471-B2 Photosensitive resin film and cured film made therefrom JSR CORPORATION (JP) 2007-05-08 US disclosed
EP-1746461-A1 NEGATIVE RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2007-01-24 EP disclosed
US-20060210912-A1 Alkali-soluble copolymer of p-isopropenylphenol, unsaturated carboxy acid, acrylic ester, and unsaturated aliphatic polycyclic compound, especially isobornyl (meth)acrylate and tricyclo[5.2.1.02,6]decanyl (meth)acrylate; unsaturated compound; and radical polymerization initiator; used for forming bumps JSR CORPORATION (JP) 2006-09-21 US disclosed
EP-1610177-A1 PHOTOSENSITIVE RESIN FILM AND CURED FILM MADE THEREFROM JSR Corporation (JP) 2005-12-28 EP disclosed