SCHEMBL3881485

SCHEMBL3881485

CC(C)(C)OOC(=O)CCC(=O)OO

nearest known ligand 0.35

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.35
TDP1 Q9NUW8 2/20 0.35
ALDH1A1 P00352 1/20 0.35
HSD17B10 Q99714 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7646063 0.91 TSHR (0.34) TSHRTDP1ALDH1A1HSD17B10
SCHEMBL11126370 0.91 TSHR (0.41) TSHRTDP1ALDH1A1HSD17B10
SCHEMBL28187732 0.90 DGKA (0.35) TSHRTDP1ALDH1A1HSD17B10
SCHEMBL3497531 0.88 TSHR (0.39) TSHRTDP1ALDH1A1HSD17B10
SCHEMBL9836221 0.82 EGLN1 (0.45) TSHRTDP1ALDH1A1HSD17B10
SCHEMBL29079246 0.82 DGKA (0.31)
SCHEMBL1326440 0.81 TSHR (0.40) TSHRTDP1ALDH1A1HSD17B10
SCHEMBL11413523 0.81 TSHR (0.46) TSHRTDP1ALDH1A1HSD17B10
SCHEMBL7195841 0.81 TSHR (0.32) TSHRTDP1ALDH1A1
SCHEMBL9015649 0.80 TSHR (0.37) TSHRTDP1ALDH1A1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6552130-B1 Used as a covering material for civil engineering and construction applications MITSUBISHI RAYON CO., LTD. (JP) 2003-04-22 US claimed
US-11518866-B2 Peroxy ester cure of liquid prepolymer compositions ARKEMA INC. (US) 2022-12-06 US disclosed
US-20180355133-A1 PEROXY ESTER CURE OF LIQUID PREPOLYMER COMPOSITIONS ARKEMA INC. 2018-12-13 US disclosed
EP-3383940-A1 PEROXY ESTER CURE OF LIQUID PREPOLYMER COMPOSITIONS Arkema Inc. (US) 2018-10-10 EP disclosed
WO-2017095893-A1 PEROXY ESTER CURE OF LIQUID PREPOLYMER COMPOSITIONS ARKEMA INC. (US) 2017-06-08 WO disclosed
EP-1152014-B1 RESIN COMPOSITION MITSUBISHI RAYON CO (JP) 2009-01-14 EP disclosed
US-6552130-B1 Used as a covering material for civil engineering and construction applications MITSUBISHI RAYON CO., LTD. (JP) 2003-04-22 US disclosed
EP-1152014-A1 RESIN COMPOSITION Mitsubishi Rayon Co., Ltd. (JP) 2001-11-07 EP disclosed