SCHEMBL3888232

SCHEMBL3888232

OC(CCCC1CO1)OCC1CO1

nearest known ligand 0.38

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.38
ALDH1A1 P00352 6/20 0.36
SMN1; SMN2 Q16637 1/20 0.33
TDP1 Q9NUW8 1/20 0.32
TP53 P04637 1/20 0.31
CYP3A4 P08684 1/20 0.31
MAPK1 P28482 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL636117 0.94 ALDH1A1 (0.39) TSHRALDH1A1SMN1; SMN2TDP1TP53
SCHEMBL11416391 0.93 ALDH1A1 (0.42) TSHRALDH1A1SMN1; SMN2TDP1
SCHEMBL525459 0.93 ALDH1A1 (0.42) TSHRALDH1A1SMN1; SMN2TDP1
SCHEMBL3898286 0.88 TSHR (0.35) TSHRALDH1A1SMN1; SMN2TDP1TP53
SCHEMBL21327777 0.88 TSHR (0.40) TSHRALDH1A1SMN1; SMN2TDP1TP53
SCHEMBL1411899 0.85 TSHR (0.38) TSHRALDH1A1SMN1; SMN2TDP1TP53
SCHEMBL25211268 0.83 TSHR (0.36) TSHRALDH1A1SMN1; SMN2TDP1TP53
SCHEMBL3204024 0.83 ALDH1A1 (0.51) TSHRALDH1A1SMN1; SMN2TDP1MAPK1
SCHEMBL1970400 0.81 TSHR (0.35) TSHRALDH1A1SMN1; SMN2TDP1
SCHEMBL122129 0.81 ALDH1A1 (0.49) TSHRALDH1A1SMN1; SMN2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3660069-B1 FAST CURING EPOXY SYSTEMS EVONIK OPERATIONS GMBH (DE) 2024-01-03 EP disclosed
EP-3569632-B1 FAST CURING EPOXY SYSTEMS EVONIK OPERATIONS GMBH (DE) 2023-12-06 EP disclosed
WO-2023083782-A1 EPOXY RESIN COMPOSITIONS FOR PRODUCING STORAGE-STABLE COMPOSITES EVONIK OPERATIONS GMBH (DE) 2023-05-19 WO disclosed
EP-4180477-A1 EPOXY RESIN COMPOSITIONS FOR THE PREPARATION OF STORAGE-STABLE COMPOSITES Evonik Operations GmbH (DE) 2023-05-17 EP disclosed
US-11390769-B2 Ink jet printing method, primer ink composition, and ink jet ink composition SEIKO EPSON CORPORATION 2022-07-19 US disclosed
EP-3569631-B1 FAST CURING EPOXY SYSTEMS EVONIK OPERATIONS GMBH (DE) 2022-07-13 EP disclosed
EP-3569629-B1 FAST CURING EPOXY SYSTEMS EVONIK OPERATIONS GMBH (DE) 2022-07-06 EP disclosed
US-20200377750-A1 Ink Jet Printing Method, Primer Ink Composition, And Ink Jet Ink Composition SEIKO EPSON CORPORATION (JP) 2020-12-03 US disclosed
EP-3660069-A1 FAST CURING EPOXY SYSTEMS Evonik Operations GmbH (DE) 2020-06-03 EP disclosed
EP-3569632-A1 FAST CURING EPOXY SYSTEMS Evonik Degussa GmbH (DE) 2019-11-20 EP disclosed
EP-2931821-A1 USE OF SUBSTITUTED BENZYL ALCOHOLS IN REACTIVE EPOXY SYSTEMS Evonik Degussa GmbH (DE) 2015-10-21 EP disclosed
WO-2014095139-A1 USE OF SUBSTITUTED BENZYL ALCOHOLS IN REACTIVE EPOXY SYSTEMS EVONIK INDUSTRIES AG (DE) 2014-06-26 WO disclosed
US-7560143-B2 Aqueous non-ionically stabilized epoxy resins SURFACE SPECIALTIES AUSTRIA GMBH (AT) 2009-07-14 US disclosed
US-20050287302-A1 Aqueous non-ionically stabilized epoxy resins SURFACE SPECIALTIES AUSTRIA GMBH (AT) 2005-12-29 US disclosed
EP-1437182-A2 Conductive floor coating SGL Acotec GmbH (DE) 2004-07-14 EP disclosed
US-6329473-B1 USED AS COATING FOR CRACK BRIDGING, AS AN ADHESIVE AND IN POWDER SURFACE COATINGS SOLUTIA GERMANY GMBH & CO., KG (DE) 2001-12-11 US disclosed
US-5977286-A Amine-modified epoxy resin reacted with polyisocyanate VIANOVA RESINS GMBH (DE) 1999-11-02 US disclosed
US-5585446-A EPOXY RESIN ADHESIVE COMPOSITION HOECHST AKTIENGESELLSCHAFT (DE) 1996-12-17 US disclosed
US-5567782-A ELASTIC ADHESIVE HOECHST AKTIENGESELLSCHAFT (DE) 1996-10-22 US disclosed
US-5459208-A Elasticity at low temperatures; automobile structural adhesive HOECHST AKTIENGESELLSCHAFT (DE) 1995-10-17 US disclosed