Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.34 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3888232 | 0.88 | TSHR (0.38) | TSHRALDH1A1TP53CYP3A4MAPK1 | |
| SCHEMBL636117 | 0.86 | ALDH1A1 (0.39) | TSHRALDH1A1TP53CYP3A4SMN1; SMN2 | |
| SCHEMBL525459 | 0.85 | ALDH1A1 (0.42) | TSHRALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL11416391 | 0.85 | ALDH1A1 (0.42) | TSHRALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL21327777 | 0.83 | TSHR (0.40) | TSHRALDH1A1TP53CYP3A4MAPK1 | |
| SCHEMBL123895 | 0.82 | SMN1; SMN2 (0.42) | TSHRALDH1A1TP53CYP3A4MAPK1 | |
| SCHEMBL25236886 | 0.80 | TSHR (0.39) | TSHRALDH1A1TP53CYP3A4MAPK1 | |
| SCHEMBL1411899 | 0.80 | TSHR (0.38) | TSHRALDH1A1TP53CYP3A4MAPK1 | |
| SCHEMBL25211268 | 0.79 | TSHR (0.36) | TSHRALDH1A1TP53CYP3A4SMN1; SMN2 | |
| SCHEMBL3204024 | 0.79 | ALDH1A1 (0.51) | TSHRALDH1A1MAPK1SMN1; SMN2TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3660069-B1 | FAST CURING EPOXY SYSTEMS | EVONIK OPERATIONS GMBH (DE) | 2024-01-03 | — | — | EP | disclosed |
| EP-3569632-B1 | FAST CURING EPOXY SYSTEMS | EVONIK OPERATIONS GMBH (DE) | 2023-12-06 | — | — | EP | disclosed |
| EP-3904454-B1 | PREPARATION METHOD FOR EMULSIFIER, EMULSIFIER, AQUEOUS EPOXY RESIN DISPERSION AND FORMULATION METHOD | WANHUA CHEMICAL GROUP CO LTD (CN) | 2023-07-19 | — | — | EP | disclosed |
| WO-2023083782-A1 | EPOXY RESIN COMPOSITIONS FOR PRODUCING STORAGE-STABLE COMPOSITES | EVONIK OPERATIONS GMBH (DE) | 2023-05-19 | — | — | WO | disclosed |
| EP-4180477-A1 | EPOXY RESIN COMPOSITIONS FOR THE PREPARATION OF STORAGE-STABLE COMPOSITES | Evonik Operations GmbH (DE) | 2023-05-17 | — | — | EP | disclosed |
| US-11597796-B2 | Ionic aqueous epoxy curing agent, preparation method therefor and use thereof | WANHUA CHEMICAL GROUP CO., LTD. (CN) | 2023-03-07 | — | — | US | disclosed |
| US-11390769-B2 | Ink jet printing method, primer ink composition, and ink jet ink composition | SEIKO EPSON CORPORATION | 2022-07-19 | — | — | US | disclosed |
| EP-3569631-B1 | FAST CURING EPOXY SYSTEMS | EVONIK OPERATIONS GMBH (DE) | 2022-07-13 | — | — | EP | disclosed |
| EP-3569629-B1 | FAST CURING EPOXY SYSTEMS | EVONIK OPERATIONS GMBH (DE) | 2022-07-06 | — | — | EP | disclosed |
| US-20220055000-A1 | PREPARATION METHOD FOR EMULSIFIER, EMULSIFIER, AQUEOUS EPOXY RESIN DISPERSION AND FORMULATION METHOD | WANHUA CHEMICAL GROUP CO., LTD. (CN) | 2022-02-24 | — | — | US | disclosed |
| US-6329473-B1 | USED AS COATING FOR CRACK BRIDGING, AS AN ADHESIVE AND IN POWDER SURFACE COATINGS | SOLUTIA GERMANY GMBH & CO., KG (DE) | 2001-12-11 | — | — | US | disclosed |
| US-5977286-A | Amine-modified epoxy resin reacted with polyisocyanate | VIANOVA RESINS GMBH (DE) | 1999-11-02 | — | — | US | disclosed |
| US-5585446-A | EPOXY RESIN ADHESIVE COMPOSITION | HOECHST AKTIENGESELLSCHAFT (DE) | 1996-12-17 | — | — | US | disclosed |
| US-5567782-A | ELASTIC ADHESIVE | HOECHST AKTIENGESELLSCHAFT (DE) | 1996-10-22 | — | — | US | disclosed |
| US-5459208-A | Elasticity at low temperatures; automobile structural adhesive | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-10-17 | — | — | US | disclosed |
| US-5319004-A | Good water resistance | HOECHST AKTIENGESELLSCHAFT (DE) | 1994-06-07 | — | — | US | disclosed |
| EP-0253339-B1 | Preparation of a coating having a better adhesiveness as an intermediary interlining with the application of an epoxy resin/curing agent mixture | HOECHST AG (DE) | 1993-12-29 | — | — | EP | disclosed |
| EP-0559033-A1 | Curing agent for epoxy resins | HOECHST AKTIENGESELLSCHAFT (DE) | 1993-09-08 | — | — | EP | disclosed |
| EP-0379107-A2 | Use of polyamide amines as curing agents for epoxy resins, and curable mixtures containing them | HOECHST AKTIENGESELLSCHAFT (DE) | 1990-07-25 | — | — | EP | disclosed |
| EP-0253339-A2 | Preparation of a coating having a better adhesiveness as an intermediary interlining with the application of an epoxy resin/curing agent mixture | HOECHST AKTIENGESELLSCHAFT (DE) | 1988-01-20 | — | — | EP | disclosed |