SCHEMBL39044

SCHEMBL39044

CC(O)N1CCCC1=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27689543 1.00
SCHEMBL7198087 0.93 LMNA (0.46)
Acetic Acid SCHEMBL29881172 0.92 LMNA (0.50)
Urea SCHEMBL14776158 0.92 LMNA (0.59)
SCHEMBL8558383 0.91 LMNA (0.44)
Methylpyrrolidone SCHEMBL5063791 0.90 BRD4 (0.63)
SCHEMBL8609237 0.87 LMNA (0.54)
SCHEMBL9366055 0.86
SCHEMBL8745431 0.86
Methacrylic Acid SCHEMBL1817343 0.86 LMNA (0.45)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 7692 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6391994-B1 None US claimed
US-20260109872-A1 Ink Jet Ink Composition And Ink Jet Recording Method SEIKO EPSON CORP (JP) 2026-04-23 US claimed
US-20260103610-A1 METHOD OF PREPARING A POLYMER CAPACITOR, A CONDUCTIVE POLYMER COMPOSITION, AND ITS USE AS A CONDUCTIVE LAYER IN AN ELECTRONIC DEVICE AGFA-GEVAERT NV (BE) 2026-04-16 US claimed
US-12486415-B2 Ink jet textile-printing ink composition, recording method, and recorded material SEIKO EPSON CORPORATION (JP) 2025-12-02 US claimed
US-20250354092-A1 CLEANING COMPOSITION AND METHOD FOR REMOVING POLYMER FILM BONDING MATERIALS USING THE SAME HONGYUE ADVANCED TECH CO LTD (TW) 2025-11-20 US claimed
US-12447158-B2 Liquid polymer delivery system for extended administration of drugs TOLMAR INTERNATIONAL LIMITED (IE) 2025-10-21 US claimed
EP-4581654-A1 METHOD OF PREPARING A POLYMER CAPACITOR, A CONDUCTIVE POLYMER COMPOSITION, AND IT'S USE AS A CONDUCTIVE LAYER IN AN ELECTRONIC DEVICE AGFA-GEVAERT NV (BE) 2025-07-09 EP claimed
CN-115312230-B Conductive silver paste, preparation method and application thereof 无锡帝科电子材料股份有限公司 2025-06-24 CN claimed
CN-120193424-A High-definition chinlon digital printing process 绍兴乾雍纺织有限公司 2025-06-24 CN claimed
US-20250128470-A1 3D PRINTING METHODS PERIDOT PRINT LLC 2025-04-24 US claimed
EP-0145191-A2 A process for selective preparation of secondary and tertiary aralkyl amines TEXACO DEVELOPMENT CORPORATION (US) 1985-06-19 EP claimed
EP-0126652-A1 Electron beam sensitive mixture resist GAF CORPORATION (US) 1984-11-28 EP claimed
EP-0124274-A2 Electron beam sensitive mixture resist GAF CORPORATION (US) 1984-11-07 EP claimed
US-4448875-A HALF-ESTER OR -AMIDE OF ALKYL VINYL ETHER-MALEIC ANHYDRIDE COPOLYMER GAF CORPORATION (US) 1984-05-15 US claimed
EP-0088977-A2 Electron beam sensitive resist GAF CORPORATION (US) 1983-09-21 EP claimed
EP-0084714-A1 Ink composition for ink jet printing KONICA CORPORATION (JP) 1983-08-03 EP claimed
US-4375398-A CROSSLINKING, VINYL ETHER GAF CORPORATION (US) 1983-03-01 US claimed
US-4218248-A Process for the manufacture of metal joining paste SCM CORPORATION (US) 1980-08-19 US claimed
WO-1979000960-A1 PROCESS FOR THE MANUFACTURE OF METAL JOINING PASTE SCM CORP (US) 1979-11-15 WO claimed
EP-0005068-A1 Process for manufacturing joining paste; metal joining paste SCM CORPORATION (US) 1979-10-31 EP claimed