Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.50 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.50 |
| ▸ | PTPRC | P08575 | 1/20 | 0.38 |
| ▸ | MAOB | P27338 | 3/20 | 0.38 |
| ▸ | IDO1 | P14902 | 2/20 | 0.38 |
| ▸ | MAOA | P21397 | 2/20 | 0.38 |
| ▸ | CDC25B | P30305 | 2/20 | 0.38 |
| ▸ | PBRM1 | Q86U86 | 1/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | AKT1 | P31749 | 1/20 | 0.38 |
| ▸ | SNCA | P37840 | 1/20 | 0.38 |
| ▸ | MAP2K1 | Q02750 | 1/20 | 0.38 |
| ▸ | PIN1 | Q13526 | 1/20 | 0.38 |
| ▸ | EHMT2 | Q96KQ7 | 1/20 | 0.38 |
| ▸ | NSD1 | Q96L73 | 1/20 | 0.38 |
| ▸ | EHMT1 | Q9H9B1 | 1/20 | 0.38 |
| ▸ | MAPK14 | Q16539 | 1/20 | 0.37 |
| ▸ | GAA | P10253 | 2/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31295703 | 0.83 | ALDH1A1 (0.67) | ALDH1A1MAPK1MAOBIDO1MAOA | |
| SCHEMBL358976 | 0.83 | ALDH1A1 (0.67) | ALDH1A1MAPK1MAOBIDO1MAOA | |
| SCHEMBL1158510 | 0.80 | MEN1 (0.50) | ALDH1A1MAPK1PTPRCMAOBIDO1 | |
| SCHEMBL8946646 | 0.80 | MEN1 (0.50) | ALDH1A1MAPK1PTPRCMAOBIDO1 | |
| SCHEMBL7519287 | 0.80 | ALDH1A1 (0.63) | ALDH1A1MAPK1PTPRCMAOBIDO1 | |
| SCHEMBL31465796 | 0.80 | ALDH1A1 (0.63) | ALDH1A1MAPK1PTPRCMAOBIDO1 | |
| SCHEMBL30664840 | 0.80 | MEN1 (0.50) | ALDH1A1MAPK1PTPRCMAOBIDO1 | |
| Methane SCHEMBL8638123 | 0.77 | MEN1 (0.47) | ALDH1A1MAPK1PTPRCMAOBIDO1 | |
| Bromide SCHEMBL6343983 | 0.77 | ALDH1A1 (0.60) | ALDH1A1MAPK1MAOBIDO1MAOA | |
| Bicarbonate SCHEMBL4862453 | 0.76 | MAPK1 (0.59) | ALDH1A1MAPK1LMNAMAPK14GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1445269-B1 | Polycarbodiimide having high index of refraction and production method thereof | NITTO DENKO CORP (JP) | 2009-03-18 | — | — | EP | disclosed |
| EP-1460093-B1 | Polycarbodiimide copolymer and production method thereof | NITTO DENKO CORP (JP) | 2006-11-08 | — | — | EP | disclosed |
| US-20060089464-A1 | Resin composition for optical use | NITTO DENKO CORPORATION | 2006-04-27 | — | — | US | disclosed |
| EP-1650238-A2 | Polycarbodiimide compositions for optical use | NITTO DENKO CORPORATION (JP) | 2006-04-26 | — | — | EP | disclosed |
| US-7034101-B2 | Polycarbodiimide copolymer and production method thereof | NITTO DENKO CORPORATION (JP) | 2006-04-25 | — | — | US | disclosed |
| US-20060084766-A1 | Resin composition for optical use | NITTO DENKO CORPORATION | 2006-04-20 | — | — | US | disclosed |
| EP-1647561-A2 | Polycarbodiimide compositions for optical use | NITTO DENKO CORPORATION (JP) | 2006-04-19 | — | — | EP | disclosed |
| US-7018718-B2 | Adhesive film for underfill and semiconductor device using the same | NITTO DENKO CORPORATION (JP) | 2006-03-28 | — | — | US | disclosed |
| US-20060022356-A1 | Resin for optical-semiconductor element encapsulation | NITTO DENKO CORPORATION | 2006-02-02 | — | — | US | disclosed |
| EP-1621563-A1 | Resin for optical-semiconductor element encapsulation | NITTO DENKO CORPORATION (JP) | 2006-02-01 | — | — | EP | disclosed |
| US-20050249480-A1 | OPTICAL SEMICONDUCTOR DEVICE | NITTO DENKO CORPORATION | 2005-11-10 | — | — | US | disclosed |
| US-20050158911-A1 | Process for producing circuit board having built-in electronic part | NITTO DENKO CORPORATION | 2005-07-21 | — | — | US | disclosed |
| EP-1555862-A2 | Process for producing circuit board having built-in electronic part | NITTO DENKO CORPORATION (JP) | 2005-07-20 | — | — | EP | disclosed |
| EP-1512706-A2 | Thermosetting resin | NITTO DENKO CORPORATION (JP) | 2005-03-09 | — | — | EP | disclosed |
| US-20050049385-A1 | Thermosetting resin | NITTO DENKO CORPORATION | 2005-03-03 | — | — | US | disclosed |
| EP-1460093-A1 | Polycarbodiimide copolymer and production method thereof | NITTO DENKO CORPORATION (JP) | 2004-09-22 | — | — | EP | disclosed |
| US-20040178423-A1 | Adhesive film for underfill and semiconductor device using the same | NITTO DENKO CORPORATION | 2004-09-16 | — | — | US | disclosed |
| US-20040176547-A1 | Polycarbodiimide copolymer and production method thereof | NITTO DENKO CORPORATION | 2004-09-09 | — | — | US | disclosed |
| US-20040158021-A1 | Polycarbodiimide having high index of refraction and production method thereof | NITTO DENKO CORPORATION | 2004-08-12 | — | — | US | disclosed |
| EP-1445269-A1 | Polycarbodiimide having high index of refraction and production method thereof | NITTO DENKO CORPORATION (JP) | 2004-08-11 | — | — | EP | disclosed |