⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL93773 | 0.90 | — | — | |
| SCHEMBL28376418 | 0.87 | DNM1 (0.50) | — | |
| SCHEMBL5715968 | 0.87 | — | — | |
| SCHEMBL337041 | 0.87 | — | — | |
| SCHEMBL9823860 | 0.82 | — | — | |
| Butylamine SCHEMBL687064 | 0.80 | DNM1 (0.46) | — | |
| SCHEMBL3433082 | 0.78 | ODC1 (0.32) | — | |
| SCHEMBL10952967 | 0.78 | NFKB1 (0.35) | — | |
| SCHEMBL1408605 | 0.77 | — | — | |
| SCHEMBL27715224 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107683348-A | The method for being exclusively used in adjusting the electrical conductivity of conversion coating | 凯密特尔有限责任公司 | 2018-02-09 | — | — | CN | claimed |
| EP-1702215-B1 | NANOPARTICLES AS AGENTS FOR IMAGING FINGER PRINTS | UNIV SUNDERLAND (GB) | 2014-03-12 | — | — | EP | claimed |
| US-7923497-B2 | Antiferroelectric polymer composites, methods of manufacture thereof, and articles comprising the same | GENERAL ELECTRIC COMPANY (US) | 2011-04-12 | — | — | US | claimed |
| JP-1156060-A | — | — | None | — | — | JP | disclosed |
| JP-6304233-A | — | — | None | — | — | JP | disclosed |
| WO-2023066944-A1 | TAPE-SHAPED REACTIVE ADHESIVE SYSTEM | TESA SE (DE) | 2023-04-27 | — | — | WO | disclosed |
| CN-113376135-B | Fluorescence sensing system and preparation method and application thereof | 上海市农业科学院 | 2022-08-02 | — | — | CN | disclosed |
| CN-113376135-A | Fluorescence sensing system and preparation method and application thereof | 上海市农业科学院 | 2021-09-10 | — | — | CN | disclosed |
| CN-107406570-B | Silylated polyurethanes, their preparation and use | 汉高股份有限及两合公司 | 2021-02-19 | — | — | CN | disclosed |
| CN-106415796-B | Mixed abrasive tungsten chemical mechanical polishing composition | 嘉柏微电子材料股份公司 | 2019-06-25 | — | — | CN | disclosed |
| CN-106661430-B | tungsten chemical mechanical polishing composition | 嘉柏微电子材料股份公司 | 2019-03-19 | — | — | CN | disclosed |
| US-20070117898-A1 | Composites having tunable dielectric constants, methods of manufacture thereof, and articles comprising the same | GENERAL ELECTRIC COMPANY | 2007-05-24 | — | — | US | disclosed |
| US-20070117913-A1 | Antiferroelectric polymer composites, methods of manufacture thereof, and articles comprising the same | GENERAL ELECTRIC COMPANY | 2007-05-24 | — | — | US | disclosed |
| US-20070117911-A1 | Composite coatings for groundwall insulation, method of manufacture thereof and articles derived therefrom | GENERAL ELECTRIC COMPANY | 2007-05-24 | — | — | US | disclosed |
| US-20070117886-A1 | High dielectric constant nanocomposites, methods of manufacture thereof, and articles comprising the same | GENERAL ELECTRIC COMPANY | 2007-05-24 | — | — | US | disclosed |
| US-20070116976-A1 | Nanoparticle enhanced thermoplastic dielectrics, methods of manufacture thereof, and articles comprising the same | GENERAL ELECTRIC COMPANY | 2007-05-24 | — | — | US | disclosed |
| WO-2006056466-A2 | METHOD FOR SPECIFICALLY LOCATED SYNTHESIS OF BIOPOLYMERS ON SOLID CARRIERS | CLONDIAG CHIP TECHNOLOGIES GMBH (DE) | 2006-06-01 | — | — | WO | disclosed |
| US-20050142349-A1 | Composite coatings for groundwall insulation, method of manufacture thereof and articles derived therefrom | GENERAL ELECTRIC COMPANY | 2005-06-30 | — | — | US | disclosed |
| JP-H06304233-A | DEODORANT | NIPPONDENSO CO LTD | 1994-11-01 | — | — | JP | disclosed |
| JP-H01156060-A | VINYL CHLORIDE RESIN MOLDED PRODUCT | MITSUBISHI KASEI VINYL CO | 1989-06-19 | — | — | JP | disclosed |