⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL66393 | 0.85 | — | — | |
| SCHEMBL391495 | 0.83 | TSHR (0.36) | — | |
| SCHEMBL9486472 | 0.81 | — | — | |
| SCHEMBL6295074 | 0.80 | THRB (0.36) | — | |
| SCHEMBL390205 | 0.77 | — | — | |
| SCHEMBL6290861 | 0.76 | — | — | |
| SCHEMBL3805310 | 0.73 | — | — | |
| SCHEMBL65415 | 0.72 | THRB (0.36) | — | |
| SCHEMBL3151031 | 0.70 | ALDH1A1 (0.32) | — | |
| SCHEMBL4448164 | 0.69 | THRB (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2284611-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD | HITACHI CHEMICAL CO LTD (JP) | 2013-11-20 | — | — | EP | disclosed |
| US-8501392-B2 | Photosensitive element, method for formation of resist pattern, and method for production of print circuit board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-08-06 | — | — | US | disclosed |
| US-8460853-B2 | Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-06-11 | — | — | US | disclosed |
| US-8460852-B2 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-06-11 | — | — | US | disclosed |
| US-8389204-B2 | Method for producing comb-shaped electrode | TOKYO OHKA KOGYO CO., LTD. (JP) | 2013-03-05 | — | — | US | disclosed |
| US-20120040290-A1 | PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-02-16 | — | — | US | disclosed |
| US-8101339-B2 | Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-01-24 | — | — | US | disclosed |
| US-20110256484-A1 | METHOD FOR PRODUCING COMB-SHAPED ELECTRODE | TOKYO METROPOLITAN UNIVERSITY (JP) | 2011-10-20 | — | — | US | disclosed |
| US-8007983-B2 | Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-08-30 | — | — | US | disclosed |
| US-20110111344-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-05-12 | — | — | US | disclosed |
| EP-1569213-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2005-08-31 | — | — | EP | disclosed |
| WO-2005078776-A1 | PATTERN FORMING PROCESS | FUJI PHOTO FILM CO., LTD. (JP) | 2005-08-25 | — | — | WO | disclosed |
| US-20050037281-A1 | Light-sensitive sheet comprising support, first and second light-sensitive layers and barrier layer | FUJI PHOTO FILM CO., LTD. | 2005-02-17 | — | — | US | disclosed |
| EP-1507171-A2 | Light-Sensitive sheet comprising support, first and second light-sensitive layers and barrier layer | FUJI PHOTO FILM CO., LTD. (JP) | 2005-02-16 | — | — | EP | disclosed |
| US-20050025946-A1 | Light-sensitive sheet comprising support, first light-sensitive layer and second light-sensitive layer | FUJI PHOTO FILM CO., LTD. | 2005-02-03 | — | — | US | disclosed |
| EP-1489460-A2 | Light-sensitive sheet comprising support, first light-sensitive layer and second light-sensitive layer | Fuji Photo Film Co., Ltd. (JP) | 2004-12-22 | — | — | EP | disclosed |
| US-20040112859-A1 | Photosensitive film for circuit formation and process for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2004-06-17 | — | — | US | disclosed |
| EP-0321618-B1 | PHOTOSENSITIVE HARDENABLE COMPOSITIONS | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1993-02-17 | — | — | EP | disclosed |
| US-4885229-A | CONTAINING ACRYLATED ESTERS | 501 DAICEL CHEMICAL INDUSTRIES LTD. (JP) | 1989-12-05 | — | — | US | disclosed |
| EP-0321618-A1 | Photosensitive hardenable compositions | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1989-06-28 | — | — | EP | disclosed |