⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL165217 | 0.78 | — | — | |
| SCHEMBL19441925 | 0.77 | — | — | |
| Hydrochloric Acid SCHEMBL28509554 | 0.75 | — | — | |
| SCHEMBL27850368 | 0.71 | — | — | |
| SCHEMBL23419700 | 0.70 | — | — | |
| SCHEMBL15132109 | 0.70 | PLA2G1B (0.39) | — | |
| SCHEMBL16188753 | 0.67 | PRMT3 (0.39) | — | |
| SCHEMBL8470817 | 0.67 | — | — | |
| SCHEMBL14451447 | 0.66 | — | — | |
| SCHEMBL17866347 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11377624-B2 | Cleaning composition for post-etch or post ash residue removal from a semiconductor substrate and corresponding manufacturing process | BASF SE (DE) | 2022-07-05 | — | — | US | claimed |
| US-20210301221-A1 | CLEANING COMPOSITION FOR POST-ETCH OR POST ASH RESIDUE REMOVAL FROM A SEMICONDUCTOR SUBSTRATE AND CORRESPONDING MANUFACTURING PROCESS | BASF SE (DE) | 2021-09-30 | — | — | US | claimed |
| US-8003587-B2 | Semiconductor process residue removal composition and process | EKC TECHNOLOGY, INC. (US) | 2011-08-23 | — | — | US | claimed |
| US-20090203566-A1 | Semi Conductor Process Residue Removal Composition and Process | EKC TECHNOLOGY, INC. | 2009-08-13 | — | — | US | claimed |
| US-20050107467-A1 | Methods for producing and using a Cu(I)-based wood preservative | OSMOSE, INC | 2005-05-19 | — | — | US | claimed |
| WO-2025118149-A1 | PHOTORESIST STRIPPING COMPOSITIONS FOR ELECTRONIC APPLICATIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2025-06-12 | — | — | WO | disclosed |
| US-12242198-B2 | Photoresist stripping composition | DOW GLOBAL TECHNOLOGIES LLC (US) | 2025-03-04 | — | — | US | disclosed |
| US-20220365440-A1 | PHOTORESIST STRIPPING COMPOSITION | DOW GLOBAL TECHNOLOGIES LLC | 2022-11-17 | — | — | US | disclosed |
| EP-4022395-A1 | PHOTORESIST STRIPPING COMPOSITION | Dow Global Technologies LLC (US) | 2022-07-06 | — | — | EP | disclosed |
| US-11377624-B2 | Cleaning composition for post-etch or post ash residue removal from a semiconductor substrate and corresponding manufacturing process | BASF SE (DE) | 2022-07-05 | — | — | US | disclosed |
| US-20210301221-A1 | CLEANING COMPOSITION FOR POST-ETCH OR POST ASH RESIDUE REMOVAL FROM A SEMICONDUCTOR SUBSTRATE AND CORRESPONDING MANUFACTURING PROCESS | BASF SE (DE) | 2021-09-30 | — | — | US | disclosed |
| WO-2021035673-A1 | PHOTORESIST STRIPPING COMPOSITION | DOW GLOBAL TECHNOLOGIES LLC (US) | 2021-03-04 | — | — | WO | disclosed |
| US-20040258838-A1 | Method for preserving wood materials using precipitated copper compounds | OSMOSE, INC | 2004-12-23 | — | — | US | disclosed |
| US-6825156-B2 | USING AQUEOUS SOLUTION OF 2-ETHYLAMINOETHYL-2-ETHANOL | EKC TECHNOLOGY, INC. | 2004-11-30 | — | — | US | disclosed |
| WO-2004100245-A1 | REMOVAL OF POST-ETCH RESIDUES IN SEMICONDUCTOR PROCESSING | EKC TECHNOLOGY, INC. (US) | 2004-11-18 | — | — | WO | disclosed |
| US-20040147420-A1 | Cleaning compositions containing hydroxylamine derivatives and processes using same for residue removal | EKC TECHNOLOGY, INC. | 2004-07-29 | — | — | US | disclosed |
| US-20040134873-A1 | Abrasive-free chemical mechanical polishing composition and polishing process containing same | VERSUM MATERIALS US, LLC | 2004-07-15 | — | — | US | disclosed |
| US-20040018949-A1 | Semiconductor process residue removal composition and process | WAI MUN LEE | 2004-01-29 | — | — | US | disclosed |
| WO-2003104185-A1 | SEMICONDUCTOR PROCESS RESIDUE REMOVAL COMPOSITION AND PROCESS | EKC TECHNOLOGY, INC. (US) | 2003-12-18 | — | — | WO | disclosed |
| US-20030228990-A1 | Semiconductor process residue removal composition and process | EKC TECHNOLOGY, INC. | 2003-12-11 | — | — | US | disclosed |