SCHEMBL3941966

SCHEMBL3941966

Cc1cc(C(=O)c2cc(C)c(N)c(C)c2)cc(C)c1N

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.50
TDP1 Q9NUW8 3/20 0.50
CYP3A4 P08684 2/20 0.50
TP53 P04637 1/20 0.50
TSHR P16473 1/20 0.50
LMNA P02545 3/20 0.47
POLB P06746 2/20 0.47
NPC1 O15118 2/20 0.47
MITF O75030 1/20 0.47
KDM4E B2RXH2 2/20 0.45
HTT P42858 3/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
MAPT P10636 5/20 0.41
MAPK1 P28482 2/20 0.38
GAA P10253 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
PARP1 P09874 1/20 0.37
MEN1 O00255 1/20 0.36
CYP1A2 P05177 1/20 0.36
CYP2D6 P10635 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2812669 0.88 TDP1 (0.47) ALDH1A1TDP1CYP3A4TP53TSHR
SCHEMBL6390145 0.87 ALDH1A1 (0.56) ALDH1A1TDP1LMNAPOLBNPC1
SCHEMBL901041 0.82 TPMT (0.54) ALDH1A1TDP1CYP3A4TP53TSHR
SCHEMBL12311026 0.82 CA5A (0.48) ALDH1A1TDP1CYP3A4TP53TSHR
SCHEMBL1004660 0.82 PARP1 (0.50) ALDH1A1TDP1CYP3A4TP53TSHR
SCHEMBL12399061 0.78 SMN1; SMN2 (0.46) ALDH1A1TDP1LMNAPOLBNPC1
SCHEMBL1005961 0.77 HDAC6 (0.43) ALDH1A1TDP1CYP3A4TP53TSHR
SCHEMBL5787161 0.77 CA12 (0.54) ALDH1A1TDP1TSHRLMNAPOLB
SCHEMBL10146785 0.77 KDM4E (0.44) ALDH1A1TDP1CYP3A4TP53TSHR
SCHEMBL2807784 0.77 MAPT (0.56) ALDH1A1TDP1CYP3A4LMNAPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130165603-A1 Adhesive Composition And Adhesive Film Comprising The Same CHEIL INDUSTRIES, INC. (KR) 2013-06-27 US claimed
US-9957425-B2 Adhesive composition for semiconductor and adhesive film including the same CHEIL INDUSTRIES, INC. (KR) 2018-05-01 US disclosed
CN-103160220-B For semi-conductor binder film and use its semiconductor device CHEIL INDUSTRIES INC. (KR) 2016-03-02 CN disclosed
US-9169425-B2 Adhesive film and electronic device including the same CHEIL INDUSTRIES, INC. (KR) 2015-10-27 US disclosed
US-9109147-B2 Adhesive composition for semiconductor and adhesive film comprising the same CHEIL INDUSTRIES, INC. (KR) 2015-08-18 US disclosed
US-8946343-B2 Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film CHEIL INDUSTRIES, INC. (KR) 2015-02-03 US disclosed
CN-104125994-A Adhesive composition for semiconductor and adhesive film comprising same CHEIL IND INC 2014-10-29 CN disclosed
US-20140194555-A1 ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING THE SAME CHEIL INDUSTRIES, INC. (KR) 2014-07-10 US disclosed
US-20140186607-A1 ADHESIVE COMPOSITION FOR A SEMICONDUCTOR, ADHESIVE FILM PREPARED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE CONNECTED BY THE FILM CHEIL INDUSTRIES, INC. (KR) 2014-07-03 US disclosed
US-20130281559-A1 ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME CHEIL INDUSTRIES, INC. (KR) 2013-10-24 US disclosed
US-5401878-A Fluorinated unsaturated alkyl ether aryldiamines for polyimide polymers with heat resistance and waterproofing HITACHI CHEMICAL COMPANY, LTD. (JP) 1995-03-28 US disclosed
EP-0618614-A2 Heat-resistant adhesive for the fabrication of a semiconductor package Hitachi Chemical Co., Ltd. (JP) 1994-10-05 EP disclosed
US-5270438-A Fluorine-containing polyimides and precursors thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 1993-12-14 US disclosed
EP-0553612-A2 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO., LTD. (JP) 1993-08-04 EP disclosed
US-5112942-A Copolymers, aromatic diamine with alkyl substituents and phenoxy substituted aromatic diamine, resistance to stess cracking ETHYL CORPORATION (US) 1992-05-12 US disclosed
EP-0274354-B1 PHOTOSTRUCTURABLE POLYIMIDE COMPOSITIONS, POLYIMIDES ON THE BASIS OF BENZHYDROL TETRACARBOXYLIC ACID AND THEIR FABRICATION CIBA-GEIGY AG (CH) 1992-01-08 EP disclosed
EP-0450926-A2 Fluorine-containing polyimides and precursors thereof Hitachi Chemical Co., Ltd. (JP) 1991-10-09 EP disclosed
EP-0141781-B1 LIGHT-SENSITIVE COATING COMPOSITION AND USE THEREOF CIBA-GEIGY AG (CH) 1991-09-04 EP disclosed
US-4851506-A Photostructurable polyimide mixtures CIBA-GEIGY CORPORATION (US) 1989-07-25 US disclosed
US-4656116-A CROSSLINKABLE SOLUTIONS OF SOLVENT, POLYIMIDE AND POLYAZIDE CHROMOGEN; PHOTORESISTS; PHOTOLITHOGRAPHY CIBA-GEIGY CORPORATION (US) 1987-04-07 US disclosed