SCHEMBL3948628

SCHEMBL3948628

C#C[Si](C#C)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3956167 0.77
SCHEMBL3946230 0.75
SCHEMBL1532592 0.75
SCHEMBL263760 0.73
SCHEMBL6563141 0.73
SCHEMBL1536174 0.73
SCHEMBL6564151 0.73 ADRB2 (0.36)
SCHEMBL6562417 0.71
SCHEMBL6562976 0.71
SCHEMBL1536165 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10818493-B2 Silicon-based hardmask ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2020-10-27 US disclosed
US-20190115209-A1 SILICON-BASED HARDMASK ROHM & HAAS ELECT MAT (US) 2019-04-18 US disclosed
US-10186424-B2 Silicon-based hardmask ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2019-01-22 US disclosed
US-20180366319-A1 SILICON-BASED HARDMASK ROHM & HAAS ELECT MAT (US) 2018-12-20 US disclosed
US-7556860-B2 Laminate and method of forming the same, insulating film, and semiconductor device JSR CORPORATION (JP) 2009-07-07 US disclosed
US-7439315-B2 Polymer film and method for producing the same NEC CORPORATION (JP) 2008-10-21 US disclosed
US-20060216531-A1 Laminate and method of forming the same, insulating film, and semiconductor device JSR CORPORATION (JP) 2006-09-28 US disclosed
EP-1679184-A1 LAMINATE AND METHOD FOR FORMATION THEREOF, INSULATING FILM, SEMICONDUCTOR DEVICE, AND COMPOSITION FOR FORMING FILM JSR Corporation (JP) 2006-07-12 EP disclosed
US-20060052560-A1 Polymer film and method for producing the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2006-03-09 US disclosed
US-20050059788-A1 Supplying raw material gas containing acetylenic compound in chamber under low pressure; activation of gas in plasma generated reaction chamber, depositing on surface of semiconductor; addition polymerization; high mechanical strength SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2005-03-17 US disclosed
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed