Biphenyl

Biphenyl

SCHEMBL3958846

C(OCC1CO1)C1CO1.Oc1ccccc1.Oc1ccccc1.c1ccc(-c2ccccc2)cc1

nearest known ligand 0.54

Full drug profile on Sugi Atlas →

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.50
MGLL Q99685 6/20 0.48
MMP3 P08254 1/20 0.43
BCL2L1 Q07817 1/20 0.43
ALDH1A1 P00352 2/20 0.42
GLA P06280 1/20 0.42
TP53 P04637 1/20 0.41
CYP3A4 P08684 1/20 0.41
TSHR P16473 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
HIF1A Q16665 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Biphenyl SCHEMBL27619347 1.00 TDP1 (0.50) TDP1MGLLMMP3BCL2L1ALDH1A1
SCHEMBL6522595 0.95 MMP3 (0.52) TDP1MGLLMMP3BCL2L1ALDH1A1
Phenol SCHEMBL28186829 0.94 TDP1 (0.55) TDP1MGLLALDH1A1GLATP53
Phenol SCHEMBL27686847 0.94 TDP1 (0.55) TDP1MGLLALDH1A1GLATP53
Phenol SCHEMBL88310 0.94 TDP1 (0.55) TDP1MGLLALDH1A1GLATP53
Phenol SCHEMBL29031478 0.94 TDP1 (0.55) TDP1MGLLALDH1A1GLATP53
Phenol SCHEMBL33409 0.94 TDP1 (0.55) TDP1MGLLALDH1A1GLATP53
Phenol SCHEMBL28410421 0.93 TDP1 (0.53) TDP1MGLLALDH1A1GLATP53
Phenol SCHEMBL28230994 0.93 TDP1 (0.53) TDP1MGLLALDH1A1GLATP53
Phenol SCHEMBL9472201 0.91 TDP1 (0.52) TDP1MGLLALDH1A1GLATP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117362596-A Intrinsic liquid crystal epoxy material for encapsulating high-voltage high-power IGBT and preparation method thereof 西安建筑科技大学 2024-01-09 CN claimed
CN-116874867-A Carbon dioxide adduct foaming agent of polyamine polymer with main chain containing ether bond 四川大学 2023-10-13 CN claimed
CN-109553766-B Modified polyester polyol and preparation method and application thereof 长兴材料工业(广东)有限公司 2021-11-02 CN claimed
CN-111187588-A Insulating die bond adhesive for coating back surface of wafer and preparation method thereof 汕头市骏码凯撒有限公司 2020-05-22 CN claimed
CN-109553766-A Modified polyester polyol and preparation method and application thereof 长兴材料工业(广东)有限公司 2019-04-02 CN claimed
CN-117362596-A Intrinsic liquid crystal epoxy material for encapsulating high-voltage high-power IGBT and preparation method thereof 西安建筑科技大学 2024-01-09 CN disclosed
CN-116874867-A Carbon dioxide adduct foaming agent of polyamine polymer with main chain containing ether bond 四川大学 2023-10-13 CN disclosed
CN-116376228-A Epoxy resin/boron nitride nano-sheet composite material and preparation method thereof 华中科技大学 2023-07-04 CN disclosed
CN-115491157-A Photocuring packaging composition, packaging structure and semiconductor device 浙江福斯特新材料研究院有限公司 2022-12-20 CN disclosed
CN-107107587-B Laminate component and touch-screen 东丽株式会社 2018-06-05 CN disclosed
CN-107107587-A Laminate component and touch-screen 东丽株式会社 2017-08-29 CN disclosed
EP-1393899-B1 On-press developable lithographic printing plate precursor FUJIFILM CORP (JP) 2009-07-08 EP disclosed
US-6969575-B2 On-press developable lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2005-11-29 US disclosed
US-20040048191-A1 On-press developable lithographic printing plate precursor FUJI PHOTO FILM CO., LTD 2004-03-11 US disclosed
EP-1393899-A2 On-press developable lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2004-03-03 EP disclosed