Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MMP3 | P08254 | 1/20 | 0.52 |
| ▸ | BCL2L1 | Q07817 | 1/20 | 0.52 |
| ▸ | MGLL | Q99685 | 6/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.41 |
| ▸ | GLA | P06280 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Biphenyl SCHEMBL3958846 | 0.95 | TDP1 (0.50) | MMP3BCL2L1MGLLTDP1ALDH1A1 | |
| Biphenyl SCHEMBL27619347 | 0.95 | TDP1 (0.50) | MMP3BCL2L1MGLLTDP1ALDH1A1 | |
| SCHEMBL2898358 | 0.93 | ESR1 (0.44) | MGLLTDP1ALDH1A1 | |
| Methane SCHEMBL28842587 | 0.91 | ESR1 (0.42) | MGLLTDP1ALDH1A1 | |
| Tannin Pyrogallol SCHEMBL27708032 | 0.91 | TDP1 (0.57) | MGLLTDP1ALDH1A1GLA | |
| Phenol SCHEMBL33409 | 0.89 | TDP1 (0.55) | MGLLTDP1ALDH1A1GLA | |
| Phenol SCHEMBL28186829 | 0.89 | TDP1 (0.55) | MGLLTDP1ALDH1A1GLA | |
| Phenol SCHEMBL88310 | 0.89 | TDP1 (0.55) | MGLLTDP1ALDH1A1GLA | |
| Phenol SCHEMBL29031478 | 0.89 | TDP1 (0.55) | MGLLTDP1ALDH1A1GLA | |
| Phenol SCHEMBL27686847 | 0.89 | TDP1 (0.55) | MGLLTDP1ALDH1A1GLA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115210287-B | Epoxy amine adduct, curing catalyst, resin composition, sealing material, adhesive, and cured product | 纳美仕有限公司 | 2024-07-02 | — | — | CN | disclosed |
| WO-2024111333-A1 | INSULATIVE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2024-05-30 | — | — | WO | disclosed |
| CN-115003727-B | Curing catalyst, resin composition, sealing material, adhesive and cured product | 纳美仕有限公司 | 2024-04-02 | — | — | CN | disclosed |
| CN-117242112-A | Curable resin composition, sealing agent for display element, sealing agent for organic EL display element, optical adhesive, and optical member | 积水化学工业株式会社 | 2023-12-15 | — | — | CN | disclosed |
| WO-2023181831-A1 | RESIN COMPOSITION, ADHESIVE OR ENCAPSULATION MATERIAL, CURED OBJECT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023182358-A1 | THERMOSETTING RESIN COMPOSITION, SEALANT FOR DISPLAY DEVICES, AND DISPLAY DEVICE | 三井化学株式会社 | 2023-09-28 | — | — | WO | disclosed |
| CN-116745281-A | Curing catalyst, resin composition, sealing material, adhesive, and cured product | 纳美仕有限公司 | 2023-09-12 | — | — | CN | disclosed |
| CN-116615509-A | Epoxy resin composition, adhesive film, printed circuit board, semiconductor chip package, semiconductor device, and method for using adhesive film | 旭化成株式会社 | 2023-08-18 | — | — | CN | disclosed |
| US-20230203237-A1 | EPOXY AMINE ADDUCT, CURING CATALYST, RESIN COMPOSITION, SEALING MATERIAL, ADHESIVE AND CURED ARTICLE | NAMICS CORPORATION (JP) | 2023-06-29 | — | — | US | disclosed |
| US-20230097646-A1 | CURING CATALYST, RESIN COMPOSITION, SEALING MATERIAL, ADHESIVE AND CURED PRODUCT | NAMICS CORPORATION (JP) | 2023-03-30 | — | — | US | disclosed |
| CN-100455607-C | Photocurable composition and antireflection film using same | TOYO INK MFG CO (JP) | 2009-01-28 | — | — | CN | disclosed |
| CN-101223198-A | Curable composition, cured film, and laminate | TOYO INK MFG CO (JP) | 2008-07-16 | — | — | CN | disclosed |
| CN-1938344-A | Photocurable composition and antireflective film using same | TOYO INK MFG CO (JP) | 2007-03-28 | — | — | CN | disclosed |
| EP-0379058-B1 | Vinyl ester resins containing mesogenic/rigid rodlike moieties | DOW CHEMICAL CO (US) | 1999-09-29 | — | — | EP | disclosed |
| US-5164464-A | Liquid crystalline polymers, acrylated epoxy resins | THE DOW CHEMICAL COMPANY (US) | 1992-11-17 | — | — | US | disclosed |
| US-5066750-A | Addition polymers with pendant phenyl groups which can be oriented like liquid crystals | THE DOW CHEMICAL COMPANY (US) | 1991-11-19 | — | — | US | disclosed |
| US-4981836-A | Recording material | FUJI PHOTO FILM CO., LTD. (JP) | 1991-01-01 | — | — | US | disclosed |
| US-4962163-A | ADVANCED POLYEPOXIDES AND EPOXY RESINS MODIFIED BY AN UNSATURATED CARBOXYLIC ACID; CURED COATING AND FILMS HAVINGI IMPROVED TENSILE AND FLEXURAL STRENGTH AND MODULUS | THE DOW CHEMICAL COMPANY (US) | 1990-10-09 | — | — | US | disclosed |
| EP-0379058-A2 | Vinyl ester resins containing mesogenic/rigid rodlike moieties | THE DOW CHEMICAL COMPANY (US) | 1990-07-25 | — | — | EP | disclosed |
| US-4835133-A | Recording material | FUJI PHOTO FILM CO., LTD. (JP) | 1989-05-30 | — | — | US | disclosed |