⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7779011 | 0.69 | ALDH1A1 (0.40) | — | |
| SCHEMBL8367212 | 0.65 | — | — | |
| SCHEMBL10571243 | 0.64 | — | — | |
| SCHEMBL779678 | 0.64 | — | — | |
| Hydrochloric Acid SCHEMBL8168843 | 0.62 | — | — | |
| Biphenyl SCHEMBL28794039 | 0.59 | ALDH1A1 (0.90) | — | |
| Benzene SCHEMBL795031 | 0.56 | MAPT (0.50) | — | |
| Benzenethiol SCHEMBL490106 | 0.56 | ALDH1A1 (0.43) | — | |
| SCHEMBL22047568 | 0.56 | ALDH1A1 (0.43) | — | |
| Benzenethiol SCHEMBL67 | 0.56 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-7118384-A | — | — | None | — | — | JP | disclosed |
| EP-3584266-B1 | POLYCARBODIIMIDE COMPOSITION, METHOD FOR PRODUCING POLYCARBODIIMIDE COMPOSITION, WATER-DISPERSED COMPOSITION, SOLUTION COMPOSITION, RESIN COMPOSITION, AND RESIN CURED ARTICLE | MITSUI CHEMICALS INC (JP) | 2023-11-29 | — | — | EP | disclosed |
| US-11390751-B2 | Polycarbodiimide composition, method for producing a polycarbodiimide composition, water-dispersed composition, solution composition, resin composition, and cured resin | MITSUI CHEMICALS, INC. (JP) | 2022-07-19 | — | — | US | disclosed |
| EP-3296338-B1 | POLYCARBODIIMIDE COMPOSITION, METHOD FOR PRODUCING POLYCARBODIIMIDE COMPOSITION, AQUEOUS DISPERSION COMPOSITION, SOLUTION COMPOSITION, RESIN COMPOSITION, AND CURED RESIN | MITSUI CHEMICALS INC (JP) | 2020-04-01 | — | — | EP | disclosed |
| US-20200048467-A1 | POLYCARBODIIMIDE COMPOSITION, METHOD FOR PRODUCING A POLYCARBODIIMIDE COMPOSITION, WATER-DISPERSED COMPOSITION, SOLUTION COMPOSITION, RESIN COMPOSITION, AND CURED RESIN | MITSUI CHEMICALS, INC. (JP) | 2020-02-13 | — | — | US | disclosed |
| US-10011677-B2 | Polycarbodiimide composition, method for producing polycarbodiimide composition, aqueous dispersion composition, solution composition, resin composition, and cured resin | MITSUI CHEMICALS, INC. (JP) | 2018-07-03 | — | — | US | disclosed |
| US-20180148533-A1 | POLYCARBODIIMIDE COMPOSITION, METHOD FOR PRODUCING POLYCARBODIIMIDE COMPOSITION, AQUEOUS DISPERSION COMPOSITION, SOLUTION COMPOSITION, RESIN COMPOSITION, AND CURED RESIN | MITSUI CHEMICALS, INC. (JP) | 2018-05-31 | — | — | US | disclosed |
| EP-3296338-A1 | POLYCARBODIIMIDE COMPOSITION, METHOD FOR PRODUCING POLYCARBODIIMIDE COMPOSITION, AQUEOUS DISPERSION COMPOSITION, SOLUTION COMPOSITION, RESIN COMPOSITION, AND RESIN CURED PRODUCT | Mitsui Chemicals, Inc. (JP) | 2018-03-21 | — | — | EP | disclosed |
| EP-1445269-B1 | Polycarbodiimide having high index of refraction and production method thereof | NITTO DENKO CORP (JP) | 2009-03-18 | — | — | EP | disclosed |
| US-7034101-B2 | Polycarbodiimide copolymer and production method thereof | NITTO DENKO CORPORATION (JP) | 2006-04-25 | — | — | US | disclosed |
| US-20040096633-A1 | Heat resistant sealing resin between wire circuit and semiconductor | NITTO DENKO CORPORATION | 2004-05-20 | — | — | US | disclosed |
| US-6669869-B2 | Capable of firmly adhering to an electronic component and a circuit board and achieving good electrical continuity by thermal compression bonding at low temperature at which the circuit board is not eteriorated | NITTO DENKO CORPORATION (JP) | 2003-12-30 | — | — | US | disclosed |
| US-20020130302-A1 | Anisotropic conductive film | NITTO DENKO CORPORATION (JP) | 2002-09-19 | — | — | US | disclosed |
| EP-0490389-B1 | Stampable sheet shaped-product, process for producing the same, and use of the same as sound-absorbing and heat-insulating material | NISSHIN SPINNING (JP) | 1996-06-12 | — | — | EP | disclosed |
| JP-H07118384-A | PRODUCTION OF RESINOUS COATING FILM | MITSUI TOATSU CHEM INC | 1995-05-09 | — | — | JP | disclosed |
| EP-0291948-B1 | Polyamideimide elastomer and production thereof | KURARAY CO (JP) | 1993-11-18 | — | — | EP | disclosed |
| US-5219648-A | Core of open cell plastic foam; skin layer of foamable thermosetting polycarbodiimide resin on one or both surfaces | NISSHINBO INDUSTRIES, INC. (JP) | 1993-06-15 | — | — | US | disclosed |
| EP-0490389-A1 | Stampable sheet shaped-product, process for producing the same, and use of the same as sound-absorbing and heat-insulating material | NISSHINBO INDUSTRIES, INC. (JP) | 1992-06-17 | — | — | EP | disclosed |
| US-4816544-A | HEAT RESISTANT ELASTOMERS | KURARAY CO., LTD. (JP) | 1989-03-28 | — | — | US | disclosed |
| EP-0291948-A2 | Polyamideimide elastomer and production thereof | KURARAY CO., LTD. (JP) | 1988-11-23 | — | — | EP | disclosed |