SCHEMBL779678

SCHEMBL779678

O[PH3]c1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7779011 0.69 ALDH1A1 (0.40)
SCHEMBL8367212 0.65
SCHEMBL3971238 0.64
SCHEMBL10571243 0.64
Hydrochloric Acid SCHEMBL8168843 0.62
Naphthalene SCHEMBL10438031 0.59 CYP2A6 (0.80)
Naphthalene SCHEMBL11145450 0.59 CYP2A6 (0.80)
Phenol SCHEMBL8825085 0.56 CA12 (1.00)
Catechol SCHEMBL22028465 0.56 CA2 (0.91)
Phenol SCHEMBL9470299 0.56 CA12 (1.00)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 224 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6177197-B1 INK RECEIVING LAYER IS A CROSSLINKED PRODUCT OF POLYVINYL ALCOHOL RESIN AND CARBODIIMIDE CROSSLINKING AGENT NIPPON INDUSTRIES, INC. (JP) 2001-01-23 US claimed
EP-0515161-B1 Curable composition NIPPON PAINT CO LTD (JP) 1997-10-29 EP claimed
EP-0515161-A1 Curable composition Nippon Paint Co., Ltd. (JP) 1992-11-25 EP claimed
JP-9048836-A None JP disclosed
JP-7118384-A None JP disclosed
JP-7118385-A None JP disclosed
JP-10259224-A None JP disclosed
JP-7053654-A None JP disclosed
JP-10251595-A None JP disclosed
JP-9217007-A None JP disclosed
JP-4279618-A None JP disclosed
US-5100994-A HYDROPHILIC POLYCARBODIIMIDE POLYMER, PULP-LIKE MATERIAL CONSISTING OF SAID HYDROPHILIC POLYCARBODIIMIDE POLYMER, AND PROCESS FOR PRODUCING SAID POLYMER OR SAID MATERIAL NISSHINBO INDUSTRIES, INC. (JP) 1992-03-31 US disclosed
EP-0461466-A1 Heat-resistant adhesive and adhesion method using said adhesive NISSHINBO INDUSTRIES, INC. (JP) 1991-12-18 EP disclosed
EP-0447816-A1 Thin carbon plate and process for producing the same NISSHINBO INDUSTRIES, INC. (JP) 1991-09-25 EP disclosed
EP-0443524-A1 High-density vitreous carbon material and process for producing the same NISSHINBO INDUSTRIES, INC. (JP) 1991-08-28 EP disclosed
EP-0416506-A1 Conductive material and process for producing the same NISSHINBO INDUSTRIES, INC. (JP) 1991-03-13 EP disclosed
EP-0411461-A2 Hydrophilic polycarbodiimide polymer,pulp-like material consisting of said hydrophilic polycarbodiimide polymer, and process for producing said polymer or said material NISSHINBO INDUSTRIES, INC. (JP) 1991-02-06 EP disclosed
EP-0398069-A2 High-molecular weight polycarbodiimide solution and methods for producing the same NISSHINBO INDUSTRIES, INC. (JP) 1990-11-22 EP disclosed
US-4816544-A HEAT RESISTANT ELASTOMERS KURARAY CO., LTD. (JP) 1989-03-28 US disclosed
EP-0291948-A2 Polyamideimide elastomer and production thereof KURARAY CO., LTD. (JP) 1988-11-23 EP disclosed