⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30914759 | 0.87 | — | — | |
| SCHEMBL6860193 | 0.80 | — | — | |
| SCHEMBL18424874 | 0.80 | — | — | |
| SCHEMBL6552955 | 0.78 | — | — | |
| SCHEMBL15227901 | 0.73 | — | — | |
| SCHEMBL3676200 | 0.72 | — | — | |
| SCHEMBL27942521 | 0.71 | — | — | |
| SCHEMBL3684757 | 0.71 | — | — | |
| SCHEMBL15400686 | 0.70 | — | — | |
| SCHEMBL41518 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 144 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119978980-A | Resin aluminum cover plate for circuit board drilling and preparation method thereof | 广东合正科技有限公司 | 2025-05-13 | — | — | CN | claimed |
| CN-119340030-B | Anti-bending data connecting wire and preparation method thereof | 江西省圣盈科技有限公司 | 2025-04-15 | — | — | CN | claimed |
| CN-119775509-A | Environment-friendly cement grinding aid and preparation method thereof | 辛集市润基科技有限责任公司 | 2025-04-08 | — | — | CN | claimed |
| CN-119707358-A | Basalt fiber reinforced asphalt concrete material | 宁波东兴沥青制品有限公司 | 2025-03-28 | — | — | CN | claimed |
| CN-119661939-A | Low-creep PP composite material for buckle and preparation method thereof | 惠州市世旺五金塑胶科技有限公司 | 2025-03-21 | — | — | CN | claimed |
| CN-119340030-A | Anti-bending data connecting wire and preparation method thereof | 江西省圣盈科技有限公司 | 2025-01-21 | — | — | CN | claimed |
| CN-118325093-A | Method for preparing raw phenyl silicone rubber by one-pot method | 江西蓝星星火有机硅有限公司 | 2024-07-12 | — | — | CN | claimed |
| CN-116836368-A | Epoxy resin containing carbamate and preparation method thereof | 常州瓴萃新材料科技有限公司 | 2023-10-03 | — | — | CN | claimed |
| CN-116656313-A | Adhesive and preparation method thereof, composite board of silica gel and plastic and preparation method thereof | 广东省硅革科技有限公司 | 2023-08-29 | — | — | CN | claimed |
| EP-4177373-A1 | TRANSPARENT WEAR-RESISTANT FILM LAYER, PLASTIC SURFACE MODIFICATION METHOD, AND PRODUCT | Jiangsu Favored Nanotechnology Co., Ltd. (CN) | 2023-05-10 | — | — | EP | claimed |
| CN-112480688-A | Silicon rubber composition and preparation method and application thereof | 广东广山新材料股份有限公司 | 2021-03-12 | — | — | CN | claimed |
| CN-112480677-A | Silicon rubber composition and preparation method and application thereof | 广东广山新材料股份有限公司 | 2021-03-12 | — | — | CN | claimed |
| CN-110183854-A | A kind of putty type silicone rubber compound and its preparation method and application | 浙江新安化工集团股份有限公司 | 2019-08-30 | — | — | CN | claimed |
| US-20120308735-A1 | ULTRA LOW DIELECTRIC CONSTANT MATERIAL WITH ENHANCED MECHANICAL PROPERTIES | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-12-06 | — | — | US | claimed |
| US-20110241200-A1 | ULTRA LOW DIELECTRIC CONSTANT MATERIAL WITH ENHANCED MECHANICAL PROPERTIES | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-10-06 | — | — | US | claimed |
| CN-1204605-C | Method for forming low dielectric constant material and product thereof | TAIWAN SEMICONDUCTOR MFG (CN) | 2005-06-01 | — | — | CN | claimed |
| CN-1464536-A | Method for forming low dielectric constant material and product thereof | TAIWAN LARGE SCALE INTEGRATED (CN) | 2003-12-31 | — | — | CN | claimed |
| US-5939141-A | Waterproof silicone coatings of thermal insulation and vaporization method | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) | 1999-08-17 | — | — | US | claimed |
| EP-0635219-B1 | Agent for keeping plant-product fresh | SHINETSU CHEMICAL CO (JP) | 1997-12-17 | — | — | EP | claimed |
| JP-5199836-A | — | — | None | — | — | JP | disclosed |
| CN-119978980-A | Resin aluminum cover plate for circuit board drilling and preparation method thereof | 广东合正科技有限公司 | 2025-05-13 | — | — | CN | disclosed |
| CN-119340030-B | Anti-bending data connecting wire and preparation method thereof | 江西省圣盈科技有限公司 | 2025-04-15 | — | — | CN | disclosed |
| CN-119775509-A | Environment-friendly cement grinding aid and preparation method thereof | 辛集市润基科技有限责任公司 | 2025-04-08 | — | — | CN | disclosed |
| CN-119707358-A | Basalt fiber reinforced asphalt concrete material | 宁波东兴沥青制品有限公司 | 2025-03-28 | — | — | CN | disclosed |
| CN-119661939-A | Low-creep PP composite material for buckle and preparation method thereof | 惠州市世旺五金塑胶科技有限公司 | 2025-03-21 | — | — | CN | disclosed |
| CN-119340030-A | Anti-bending data connecting wire and preparation method thereof | 江西省圣盈科技有限公司 | 2025-01-21 | — | — | CN | disclosed |
| CN-118430880-B | Photoelectric composite cable for underwater buoy and preparation process thereof | 上海起帆电缆股份有限公司 | 2024-10-18 | — | — | CN | disclosed |
| CN-118430880-A | Photoelectric composite cable for underwater buoy and preparation process thereof | 上海起帆电缆股份有限公司 | 2024-08-02 | — | — | CN | disclosed |
| CN-118344821-A | Pe automobile foam moisture-proof adhesive tape and preparation method thereof | 东莞市索高实业有限公司 | 2024-07-16 | — | — | CN | disclosed |
| CN-118339233-A | Compositions comprising polyarylene (ether) sulfones | 巴斯夫欧洲公司 | 2024-07-12 | — | — | CN | disclosed |
| CN-118255914-A | Copolymer having carbosiloxane dendrimer structure, and composition, cosmetic raw material, film-forming agent and cosmetic containing the copolymer | 陶氏东丽株式会社 | 2024-06-28 | — | — | CN | disclosed |
| CN-115175662-B | Cosmetic product | 信越化学工业株式会社 | 2024-05-03 | — | — | CN | disclosed |
| EP-3603954-B1 | POLYMER SUBSTRATE WITH HARD COAT LAYER | TEIJIN LTD (JP) | 2024-03-20 | — | — | EP | disclosed |
| CN-116836368-B | Epoxy resin containing carbamate and preparation method thereof | 常州瓴萃新材料科技有限公司 | 2024-02-09 | — | — | CN | disclosed |
| US-11866564-B2 | Polymer substrate with hard coat layer | TEIJIN LIMITED (JP) | 2024-01-09 | — | — | US | disclosed |
| CN-116751257-B | Rosa polypeptide and application thereof in skin whitening and moisturizing medicines or cosmetics | 江苏华肌生物科技有限公司 | 2023-10-20 | — | — | CN | disclosed |
| US-20230321686-A1 | TRANSPARENT WEAR-RESISTANT FILM LAYER, PLASTIC SURFACE MODIFICATION METHOD, AND PRODUCT | JIANGSU FAVORED NANOTECHNOLOGY CO., LTD. (CN) | 2023-10-12 | — | — | US | disclosed |
| CN-116836368-A | Epoxy resin containing carbamate and preparation method thereof | 常州瓴萃新材料科技有限公司 | 2023-10-03 | — | — | CN | disclosed |
| CN-116751257-A | Rosa polypeptide and application thereof in skin whitening and moisturizing medicines or cosmetics | 江苏华肌生物科技有限公司 | 2023-09-15 | — | — | CN | disclosed |
| CN-116656313-A | Adhesive and preparation method thereof, composite board of silica gel and plastic and preparation method thereof | 广东省硅革科技有限公司 | 2023-08-29 | — | — | CN | disclosed |
| WO-2023136259-A1 | PLATINUM-PHOSPHITE COMPLEX-CONTAINING HYDROSILYLATION CATALYST, METHOD FOR PRODUCING SAME, CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND ARTICLE | 信越化学工業株式会社 | 2023-07-20 | — | — | WO | disclosed |
| CN-111225920-B | Ureido-containing organopolysiloxane, method for producing ureido-containing organopolysiloxane, and cosmetic | 信越化学工业株式会社 | 2023-06-06 | — | — | CN | disclosed |
| EP-4177373-A1 | TRANSPARENT WEAR-RESISTANT FILM LAYER, PLASTIC SURFACE MODIFICATION METHOD, AND PRODUCT | Jiangsu Favored Nanotechnology Co., Ltd. (CN) | 2023-05-10 | — | — | EP | disclosed |
| CN-116096815-A | Thermoplastic mixture | 巴斯夫欧洲公司 | 2023-05-09 | — | — | CN | disclosed |
| EP-3200931-B1 | COMPOSITE CONSISTING OF A SUBSTRATE, A PLASMA POLYMER LAYER, A MIXED LAYER AND A COVER LAYER | FRAUNHOFER GES FORSCHUNG (DE) | 2022-08-24 | — | — | EP | disclosed |
| EP-3892072-A1 | CONTACT POINT FOR AN ELECTRICAL CONTACT | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein (DE) | 2021-10-13 | — | — | EP | disclosed |
| US-11028284-B2 | Polymer substrate with hardcoat layer, and manufacturing method for same | TEIJIN LIMITED (JP) | 2021-06-08 | — | — | US | disclosed |
| CN-112480688-A | Silicon rubber composition and preparation method and application thereof | 广东广山新材料股份有限公司 | 2021-03-12 | — | — | CN | disclosed |
| CN-112480677-A | Silicon rubber composition and preparation method and application thereof | 广东广山新材料股份有限公司 | 2021-03-12 | — | — | CN | disclosed |
| US-20200377682-A1 | POLYMER SUBSTRATE WITH HARD COAT LAYER | TEIJIN LIMITED (JP) | 2020-12-03 | — | — | US | disclosed |
| EP-3124525-B1 | POLYMER SUBSTRATE WITH HARD COAT LAYER AND MANUFACTURING METHOD FOR SUCH POLYMER SUBSTRATE | TEIJIN LTD (JP) | 2020-11-04 | — | — | EP | disclosed |
| CN-110183854-B | Putty type silicone rubber composition and preparation method and application thereof | 浙江新安化工集团股份有限公司 | 2020-11-03 | — | — | CN | disclosed |
| EP-3543304-B1 | ORGANOFUNCTIONAL SILOXANES, METHOD FOR ITS PREPARATION AND USE FOR THE TREATMENT OF FILLERS AND SURFACES | ABCR LABORATORIOS S L (ES) | 2020-08-05 | — | — | EP | disclosed |
| WO-2020115287-A1 | CONTACT POINT FOR AN ELECTRICAL CONTACT | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein (DE) | 2020-06-11 | — | — | WO | disclosed |
| EP-3603954-A1 | POLYMER SUBSTRATE WITH HARD COAT LAYER | Teijin Limited (JP) | 2020-02-05 | — | — | EP | disclosed |
| CN-110183854-A | A kind of putty type silicone rubber compound and its preparation method and application | 浙江新安化工集团股份有限公司 | 2019-08-30 | — | — | CN | disclosed |
| CN-110099975-A | It can the cured silicone rubber compound of addition- | 莫门蒂夫性能材料股份有限公司 | 2019-08-06 | — | — | CN | disclosed |
| CN-109689780-A | Polyester for profile extrusion and/or pipe extrusion | 巴斯夫欧洲公司 | 2019-04-26 | — | — | CN | disclosed |
| US-20180265731-A1 | POLYMER SUBSTRATE WITH HARDCOAT LAYER, AND MANUFACTURING METHOD FOR SAME | TEIJIN LIMITED (JP) | 2018-09-20 | — | — | US | disclosed |
| EP-3354455-A1 | POLYMER SUBSTRATE WITH HARDCOAT LAYER, AND MANUFACTURING METHOD FOR SAME | Teijin Limited (JP) | 2018-08-01 | — | — | EP | disclosed |
| US-9758630-B2 | Polymer substrate with hard coat layer and manufacturing method for such polymer substrate | TEIJIN LIMITED (JP) | 2017-09-12 | — | — | US | disclosed |
| CN-107074785-A | Polybasic carboxylic acid and polycarboxylic acid compositions, composition epoxy resin, hot curing resin composition, their solidfied material and optical semiconductor device containing it | 日本化药株式会社 | 2017-08-18 | — | — | CN | disclosed |
| EP-3200931-A1 | COMPOSITE CONSISTING OF A SUBSTRATE, A PLASMA POLYMER LAYER, A MIXED LAYER AND A COVER LAYER | Fraunhofer Gesellschaft zur Förderung der angewandten Forschung E.V. (DE) | 2017-08-09 | — | — | EP | disclosed |
| CN-106795125-A | Polybasic carboxylic acid and the polycarboxylic acid compositions containing it, composition epoxy resin, hot curing resin composition, their solidfied material and optical semiconductor device | 日本化药株式会社 | 2017-05-31 | — | — | CN | disclosed |
| US-20170107345-A1 | POLYMER SUBSTRATE WITH HARD COAT LAYER AND MANUFACTURING METHOD FOR SUCH POLYMER SUBSTRATE | TEIJIN LIMITED (JP) | 2017-04-20 | — | — | US | disclosed |
| EP-3124525-A1 | POLYMER SUBSTRATE WITH HARD COAT LAYER AND MANUFACTURING METHOD FOR SUCH POLYMER SUBSTRATE | Teijin Limited (JP) | 2017-02-01 | — | — | EP | disclosed |
| US-9484248-B2 | Patternable dielectric film structure with improved lithography and method of fabricating same | GLOBALFOUNDRIES INC. (KY) | 2016-11-01 | — | — | US | disclosed |
| CN-104162292-B | A kind of organic silicon monomer is effectively separated separator and the method for siloxanes in producing | ZHEJIANG ZHONGTIAN FLUORINE SILICON MATERIALS CO., LTD. (CN) | 2015-11-11 | — | — | CN | disclosed |
| US-9035462-B2 | Airgap-containing interconnect structure with patternable low-k material and method of fabricating | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2015-05-19 | — | — | US | disclosed |
| US-8946369-B2 | Branched polysiloxanes and use of these | EVONIK DEGUSSA GMBH (DE) | 2015-02-03 | — | — | US | disclosed |
| CN-204058314-U | A kind of organosilane monomer is effectively separated the tripping device of siloxanes in producing | ZHEJIANG TRANSIT FLUORINE SILICON MATERIAL CO LTD | 2014-12-31 | — | — | CN | disclosed |
| CN-104162292-A | Separation device and method for effectively separating oxosilane during organic silicon monomer preparation | ZHEJIANG ZHONGTIAN FLUORINE SILICON MATERIALS CO LTD | 2014-11-26 | — | — | CN | disclosed |
| CN-102422389-B | Additive etch and deposition profile control using plasma sheath engineering | VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. (US) | 2014-10-22 | — | — | CN | disclosed |
| US-8858816-B2 | Enhanced etch and deposition profile control using plasma sheath engineering | VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. (US) | 2014-10-14 | — | — | US | disclosed |
| US-8659115-B2 | Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-02-25 | — | — | US | disclosed |
| US-20140034611-A1 | ENHANCED ETCH AND DEPOSITION PROFILE CONTROL USING PLASMA SHEATH ENGINEERING | VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. (US) | 2014-02-06 | — | — | US | disclosed |
| US-8618663-B2 | Patternable dielectric film structure with improved lithography and method of fabricating same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-12-31 | — | — | US | disclosed |
| US-8603591-B2 | Enhanced etch and deposition profile control using plasma sheath engineering | Varian Semiconductor Ewuipment Associates, Inc. (US) | 2013-12-10 | — | — | US | disclosed |
| US-20130217907-A1 | BRANCHED POLYSILOXANES AND USE OF THESE | EVONIK GOLDSCHMIDT GMBH (DE) | 2013-08-22 | — | — | US | disclosed |
| EP-2628763-A1 | Branched polysiloxanes and their use | Evonik Goldschmidt GmbH (DE) | 2013-08-21 | — | — | EP | disclosed |
| US-20130207272-A1 | AIRGAP-CONTAINING INTERCONNECT STRUCTURE WITH PATTERNABLE LOW-K MATERIAL AND METHOD OF FABRICATING | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-08-15 | — | — | US | disclosed |
| US-8487411-B2 | Multiple patterning using improved patternable low-κ dielectric materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-07-16 | — | — | US | disclosed |
| US-8476758-B2 | Airgap-containing interconnect structure with patternable low-k material and method of fabricating | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-07-02 | — | — | US | disclosed |
| US-20120228775-A1 | AIRGAP-CONTAINING INTERCONNECT STRUCTURE WITH PATTERNABLE LOW-K MATERIAL AND METHOD OF FABRICATING | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-09-13 | — | — | US | disclosed |
| US-20120161296-A1 | MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MATERIALS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-06-28 | — | — | US | disclosed |
| US-8163658-B2 | Multiple patterning using improved patternable low-k dielectric materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-04-24 | — | — | US | disclosed |
| CN-102422389-A | Additive etch and deposition profile control using plasma sheath engineering | VARIAN SEMICONDUCTOR EQUIPMENT | 2012-04-18 | — | — | CN | disclosed |
| US-8101236-B2 | Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bonding | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-01-24 | — | — | US | disclosed |
| US-20110101489-A1 | SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C BONDING, SEMICONDUCTOR DEVICE CONTAINING THE SAME, AND METHOD TO MAKE THE SAME | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-05-05 | — | — | US | disclosed |
| CN-101483171-B | Airgap-containing interconnect structure with patternable low-K material and method of fabricating | IBM | 2011-04-06 | — | — | CN | disclosed |
| US-20110042790-A1 | MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MATERIALS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-02-24 | — | — | US | disclosed |
| US-7892648-B2 | SiCOH dielectric material with improved toughness and improved Si-C bonding | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-02-22 | — | — | US | disclosed |
| US-20100319971-A1 | AIRGAP-CONTAINING INTERCONNECT STRUCTURE WITH IMPROVED PATTERNABLE LOW-K MATERIAL AND METHOD OF FABRICATING | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-12-23 | — | — | US | disclosed |
| US-20100252531-A1 | Enhanced Etch and Deposition Profile Control Using Plasma Sheath Engineering | VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. | 2010-10-07 | — | — | US | disclosed |
| WO-2010115114-A2 | ENHANCED ETCH DEPOSITION PROFILE CONTROL USING PLASMA SHEATH ENGINEERING | VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES (US) | 2010-10-07 | — | — | WO | disclosed |
| US-7666794-B2 | Multiple patterning using patternable low-k dielectric materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-02-23 | — | — | US | disclosed |
| US-7655377-B2 | Antireflection film and exposure method | SONY CORPORATION (JP) | 2010-02-02 | — | — | US | disclosed |
| CN-100552890-C | The method of electronic structure and formation deielectric-coating | IBM (US) | 2009-10-21 | — | — | CN | disclosed |
| CN-100539118-C | Dielectric material and manufacture method thereof | IBM (US) | 2009-09-09 | — | — | CN | disclosed |
| US-7582411-B2 | formed between a resist layer and a silicon oxide layer formed on a surface of a silicon semiconductor substrate, for reducing reflectance at the interface | SONY CORPORATION (JP) | 2009-09-01 | — | — | US | disclosed |
| CN-100524022-C | Antireflection film and exposure method | SONY CORP (JP) | 2009-08-05 | — | — | CN | disclosed |
| US-20090181178-A1 | SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C BONDING, SEMICONDUCTOR DEVICE CONTAINING THE SAME, AND METHOD TO MAKE THE SAME | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-07-16 | — | — | US | disclosed |
| CN-101483171-A | Airgap-containing interconnect structure with patternable low-K material and method of fabricating | IBM (US) | 2009-07-15 | — | — | CN | disclosed |
| US-20090174067-A1 | AIRGAP-CONTAINING INTERCONNECT STRUCTURE WITH PATTERNABLE LOW-K MATERIAL AND METHOD OF FABRICATING | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-07-09 | — | — | US | disclosed |
| CN-100485532-C | Antireflective film and exposure method | SONY CORP (JP) | 2009-05-06 | — | — | CN | disclosed |
| WO-2009037119-A1 | PATTERNABLE DIELECTRIC FILM STRUCTURE WITH IMPROVED LITHOGRAPHY AND METHOD OF FABRICATING SAME | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-03-26 | — | — | WO | disclosed |
| US-20090079076-A1 | PATTERNABLE DIELECTRIC FILM STRUCTURE WITH IMPROVED LITHOGRAPHY AND METHOD OF FABRICATING SAME | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-03-26 | — | — | US | disclosed |
| US-7479306-B2 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-01-20 | — | — | US | disclosed |
| WO-2008075293-A1 | ADDITIVES TO STABILIZE CYCLOTETRASILOXANE AND ITS DERIVATIVES | L'AIR LIQUIDE-SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE (FR) | 2008-06-26 | — | — | WO | disclosed |
| US-20080150091-A1 | MULTIPLE PATTERNING USING PATTERNABLE LOW-k DIELECTRIC MATERIALS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-06-26 | — | — | US | disclosed |
| US-20080141901-A1 | ADDITIVES TO STABILIZE CYCLOTETRASILOXANE AND ITS DERIVATIVES | AMERICAN AIR LIQUIDE, INC. (US) | 2008-06-19 | — | — | US | disclosed |
| US-7381659-B2 | Method for reducing film stress for SiCOH low-k dielectric materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-06-03 | — | — | US | disclosed |
| US-20080009141-A1 | Methods to form SiCOH or SiCNH dielectrics and structures including the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-01-10 | — | — | US | disclosed |
| CN-101101875-A | Electronic structure and method for forming medium film | IBM (US) | 2008-01-09 | — | — | CN | disclosed |
| US-20070117408-A1 | METHOD FOR REDUCING FILM STRESS FOR SICOH LOW-K DIELECTRIC MATERIALS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-05-24 | — | — | US | disclosed |
| US-20070097514-A1 | ANTIREFLECTIVE FILM AND EXPOSURE METHOD | SONY CORPORATION (JP) | 2007-05-03 | — | — | US | disclosed |
| CN-1952788-A | Antireflective film and exposure method | SONY CORP (JP) | 2007-04-25 | — | — | CN | disclosed |
| EP-1760766-A2 | Antireflective film and exposure method | Sony Corporation (JP) | 2007-03-07 | — | — | EP | disclosed |
| CN-1828419-A | Antireflection film and exposure method | SONY CORP (JP) | 2006-09-06 | — | — | CN | disclosed |
| US-20060194125-A1 | Antireflection film and exposure method | SONY CORPORATION (JP) | 2006-08-31 | — | — | US | disclosed |
| CN-1819180-A | Dielectric materialand method to make the same | IBM (US) | 2006-08-16 | — | — | CN | disclosed |
| US-20060165891-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-07-27 | — | — | US | disclosed |
| US-20050194619-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2005-09-08 | — | — | US | disclosed |
| CN-1204605-C | Method for forming low dielectric constant material and product thereof | TAIWAN SEMICONDUCTOR MFG (CN) | 2005-06-01 | — | — | CN | disclosed |
| US-6699956-B2 | ORGANOPOLYSILOXANE CONTAINING A CYANOALKYL GROUP AND A MONOVALENT HYDROCARBON GROUP HAVING AN ALIPHATIC UNSATURATED BOND, ORGANOHYDROGENPOLYSILOXANE CONTAINING A CYANOALKYL GROUP, PLATINUM GROUP METAL CATALYST | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-03-02 | — | — | US | disclosed |
| CN-1464536-A | Method for forming low dielectric constant material and product thereof | TAIWAN LARGE SCALE INTEGRATED (CN) | 2003-12-31 | — | — | CN | disclosed |
| EP-0850893-B1 | Photocurable low refractive index fibre coatings | LUCENT TECHNOLOGIES INC (US) | 2003-04-16 | — | — | EP | disclosed |
| EP-1299450-A1 | CONTINUOUS METHOD FOR PRODUCING POLYAMIDES FROM AMINONITRILES | BASF AKTIENGESELLSCHAFT (DE) | 2003-04-09 | — | — | EP | disclosed |
| US-6514667-B2 | Tunable vapor deposited materials as antireflective coatings, hardmasks and as combined antireflective coating/hardmasks and methods of fabrication thereof and applications thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2003-02-04 | — | — | US | disclosed |
| US-20020198319-A1 | Highly dielectric addition type curable compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-12-26 | — | — | US | disclosed |
| EP-1198491-A1 | METHOD FOR PRODUCING POLYAMIDES FROM DINITRILES AND DIAMINES | BASF AKTIENGESELLSCHAFT (DE) | 2002-04-24 | — | — | EP | disclosed |
| WO-2002008313-A1 | CONTINUOUS METHOD FOR PRODUCING POLYAMIDES FROM AMINONITRILES | BASF AKTIENGESELLSCHAFT (DE) | 2002-01-31 | — | — | WO | disclosed |
| US-20020012876-A1 | Lithography structure | GLOBALFOUNDRIES U.S. INC. | 2002-01-31 | — | — | US | disclosed |
| US-6316167-B1 | LITHOGRAPHY STRUCTURE WITH MULTILAYER ELEMENT | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-11-13 | — | — | US | disclosed |
| US-6249638-B1 | Photocurable low refractive index coatings | LUCENT TECHNOLOGIES, INC. | 2001-06-19 | — | — | US | disclosed |
| WO-2001009224-A1 | METHOD FOR PRODUCING POLYAMIDES FROM DINITRILES AND DIAMINES | BASF AKTIENGESELLSCHAFT (DE) | 2001-02-08 | — | — | WO | disclosed |
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| EP-0850893-A1 | Photocurable low refractive index fibre coatings | LUCENT TECHNOLOGIES INC. (US) | 1998-07-01 | — | — | EP | disclosed |
| US-5756209-A | Photocurable low refractive index coatings | LUCENT TECHNOLOGIES INC. (US) | 1998-05-26 | — | — | US | disclosed |
| EP-0635219-B1 | Agent for keeping plant-product fresh | SHINETSU CHEMICAL CO (JP) | 1997-12-17 | — | — | EP | disclosed |
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| EP-0635219-A1 | Agent for keeping plant-product fresh | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1995-01-25 | — | — | EP | disclosed |
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| JP-H05199836-A | FRESHNESS KEEPING AGENT | SHIN ETSU CHEM CO LTD | 1993-08-10 | — | — | JP | disclosed |