⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL407670 | 0.94 | — | — | |
| SCHEMBL1042457 | 0.94 | — | — | |
| SCHEMBL7872406 | 0.88 | — | — | |
| SCHEMBL1368899 | 0.88 | — | — | |
| SCHEMBL404488 | 0.88 | — | — | |
| SCHEMBL4344882 | 0.88 | — | — | |
| SCHEMBL1367740 | 0.88 | — | — | |
| SCHEMBL409529 | 0.88 | — | — | |
| SCHEMBL1370263 | 0.88 | — | — | |
| SCHEMBL1899231 | 0.88 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 74 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6943398-B2 | Semiconductor device and method for fabricating the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2005-09-13 | — | — | US | claimed |
| US-6891231-B2 | Complementary metal oxide semiconductor (CMOS) gate stack with high dielectric constant gate dielectric and integrated diffusion barrier | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2005-05-10 | — | — | US | claimed |
| US-20040094791-A1 | Semiconductor device and method for fabricating the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2004-05-20 | — | — | US | claimed |
| EP-1420451-A2 | Semiconductor non-volatile memory device and method for fabricating the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2004-05-19 | — | — | EP | claimed |
| WO-2026100165-A1 | ELECTRICAL CIRCUIT CONNECTION, CONDUCTIVE SHEET, ELECTROSTATIC CHUCK, AND HEATER | 株式会社巴川コーポレーション | 2026-05-15 | — | — | WO | disclosed |
| US-20260108941-A1 | POWDERED MATERIAL FOR ADDITIVE MANUFACTURING AND METHOD OF PRODUCING SAID POWDERED MATERIAL | FUJIMI INCORPORATED (JP) | 2026-04-23 | — | — | US | disclosed |
| EP-4708332-A1 | ELECTRIC WIRE/CABLE COATING MATERIAL, ELECTRIC WIRE/CABLE, VACUUM DEVICE FOR SEMICONDUCTOR MANUFACTURING APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD FOR MANUFACTURING ELECTRIC WIRE/CABLE COATING MATERIAL | DAIKIN INDUSTRIES, LTD. (JP) | 2026-03-11 | — | — | EP | disclosed |
| US-12521789-B2 | Additive manufacturing powders with improved physical characteristics, method of manufacture and use thereof | TEKNA PLASMA SYSTEMS INC. (CA) | 2026-01-13 | — | — | US | disclosed |
| US-12447533-B2 | Powder material for use in additive layer manufacturing, additive layer manufacturing method using same, and molded article | FUJIMI INCORPORATED (JP) | 2025-10-21 | — | — | US | disclosed |
| US-12420428-B2 | Baked object taking-out apparatus | NORITAKE CO., LIMITED (JP) | 2025-09-23 | — | — | US | disclosed |
| EP-4596734-A1 | POWDER MATERIAL FOR ADDITIVE MANUFACTURING AND METHOD FOR PRODUCING SAID POWDER MATERIAL | Fujimi Incorporated (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-3159141-B1 | POWDER MATERIAL | FUJIMI INC (JP) | 2025-04-30 | — | — | EP | disclosed |
| CN-106457668-A | Powder material for powder laminate molding and powder laminate molding method using same | 福吉米株式会社 | 2017-02-22 | — | — | CN | disclosed |
| US-7550344-B2 | Semiconductor device and method for fabricating the same | PANASONIC CORPORATION (JP) | 2009-06-23 | — | — | US | disclosed |
| US-20070293007-A1 | Semiconductor device and method for fabricating the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| US-7288456-B2 | Semiconductor device and method for fabricating the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2007-10-30 | — | — | US | disclosed |
| US-20050239251-A1 | Semiconductor device and method for fabricating the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2005-10-27 | — | — | US | disclosed |
| US-6943398-B2 | Semiconductor device and method for fabricating the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2005-09-13 | — | — | US | disclosed |
| US-20040094791-A1 | Semiconductor device and method for fabricating the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2004-05-20 | — | — | US | disclosed |
| EP-1420451-A2 | Semiconductor non-volatile memory device and method for fabricating the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2004-05-19 | — | — | EP | disclosed |