SCHEMBL4020740

SCHEMBL4020740

O=C1C2C3C=CC(C3)C2C(=O)N1c1cccc(N2C(=O)C3C4C=CC(C4)C3C2=O)c1

nearest known ligand 0.79

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.66
CYP3A4 P08684 1/20 0.66
CYP2C19 P33261 1/20 0.66
NPSR1 Q6W5P4 1/20 0.66
ATM Q13315 1/20 0.64
L3MBTL1 Q9Y468 1/20 0.64
USP2 O75604 1/20 0.62
POLB P06746 1/20 0.61
KDM4E B2RXH2 1/20 0.60
ALDH1A1 P00352 1/20 0.60
MAPT P10636 1/20 0.60
MEN1 O00255 2/20 0.58
KMT2A Q03164 2/20 0.58
SMN1; SMN2 Q16637 1/20 0.58

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3189633 0.90 CA1 (0.60) TSHRCYP3A4CYP2C19NPSR1ATM
SCHEMBL3189623 0.90 CA1 (0.60) TSHRCYP3A4CYP2C19NPSR1ATM
SCHEMBL4592297 0.90 CA1 (0.60) TSHRCYP3A4CYP2C19NPSR1ATM
SCHEMBL18827743 0.89 KMT2A (0.60) TSHRCYP3A4CYP2C19NPSR1ATM
SCHEMBL3198224 0.89 TSHR (0.66) TSHRCYP3A4CYP2C19NPSR1ATM
SCHEMBL18827744 0.89 KMT2A (0.60) TSHRCYP3A4CYP2C19NPSR1ATM
SCHEMBL13841525 0.89 KMT2A (0.60) TSHRCYP3A4CYP2C19NPSR1ATM
SCHEMBL3202380 0.89 TSHR (0.66) TSHRCYP3A4CYP2C19NPSR1ATM
SCHEMBL5514868 0.87 KMT2A (0.62) TSHRCYP3A4CYP2C19NPSR1ATM
SCHEMBL10038046 0.87 POLB (0.79) TSHRCYP3A4CYP2C19NPSR1ATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4143029-A HEXAKIS/ALKOXYMETHYL/MELAMINE, A TRIHYDROCARBYLCARBONYL MELAMINE, AND A BIS/MALEIMIDE UNIROYAL, INC. (US) 1979-03-06 US claimed
US-9902695-B1 Resin compositions NOVOSET LLC (US) 2018-02-27 US disclosed
US-9646903-B2 Thermoset polymides for microelectronic applications INTEL CORPORATION (US) 2017-05-09 US disclosed
US-9646903-B2 Thermoset polymides for microelectronic applications INTEL CORPORATION (US) 2017-05-09 US disclosed
US-9646903-B2 Thermoset polymides for microelectronic applications INTEL CORPORATION (US) 2017-05-09 US disclosed
US-20140148557-A1 THERMOSET POLYMIDES FOR MICROELECTRONIC APPLICATIONS LEHMAN JR STEPHEN E (US) 2014-05-29 US disclosed
US-8643199-B2 Thermoset polyimides for microelectronic applications INTEL CORPORATION (US) 2014-02-04 US disclosed
US-20090146289-A1 THERMOSET POLYIMIDES FOR MICROELECTRONIC APPLICATIONS LEHMAN JR STEPHEN E 2009-06-11 US disclosed
US-7534649-B2 Thermoset polyimides for microelectronic applications INTEL CORPORATION (US) 2009-05-19 US disclosed
US-7534649-B2 Thermoset polyimides for microelectronic applications INTEL CORPORATION (US) 2009-05-19 US disclosed
US-20070262421-A1 Thermoset polyimides for microelectronic applications INTEL CORPORATION 2007-11-15 US disclosed
US-4143029-A HEXAKIS/ALKOXYMETHYL/MELAMINE, A TRIHYDROCARBYLCARBONYL MELAMINE, AND A BIS/MALEIMIDE UNIROYAL, INC. (US) 1979-03-06 US disclosed