SCHEMBL4021714

SCHEMBL4021714

CCOC(=O)NCCC(OCC)(OCC)OCC

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.41
GLA P06280 1/20 0.41
ACHE P22303 12/20 0.41
L3MBTL1 Q9Y468 1/20 0.39
HDAC3 O15379 1/20 0.37
HDAC4 P56524 1/20 0.37
HDAC1 Q13547 1/20 0.37
HDAC7 Q8WUI4 1/20 0.37
HDAC2 Q92769 1/20 0.37
HDAC10 Q969S8 1/20 0.37
HDAC11 Q96DB2 1/20 0.37
HDAC8 Q9BY41 1/20 0.37
HDAC6 Q9UBN7 1/20 0.37
HDAC9 Q9UKV0 1/20 0.37
HDAC5 Q9UQL6 1/20 0.37
NCOR2 Q9Y618 1/20 0.37
MGAM O43451 1/20 0.37
GAA P10253 1/20 0.37
SI P14410 1/20 0.37
MGAM2 Q2M2H8 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21905192 0.86 EPHX1 (0.47) KMT2AGLAACHE
SCHEMBL31348340 0.84 GAA (0.34) MGAMGAASIMGAM2
SCHEMBL17662495 0.83 KMT2A (0.41) KMT2AGLAACHEL3MBTL1HDAC3
SCHEMBL13617105 0.80 ACHE (0.44) KMT2AGLAACHEL3MBTL1HDAC3
SCHEMBL29834112 0.79 ACHE (0.54) KMT2AGLAACHEL3MBTL1HDAC3
SCHEMBL28982357 0.78 ALOX15 (0.33) TSHR
SCHEMBL12707784 0.77 KMT2A (0.41) KMT2AGLAACHEL3MBTL1HDAC3
SCHEMBL16481019 0.76 KMT2A (0.41) KMT2AGLAACHEL3MBTL1HDAC3
SCHEMBL15634663 0.76 KMT2A (0.41) KMT2AGLAACHEL3MBTL1HDAC3
SCHEMBL7570219 0.74 ACHE (0.61) KMT2AGLAACHEHDAC3HDAC4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9519216-B2 Positive photosensitive resin compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2016-12-13 US disclosed
WO-2009099954-A1 NOVEL POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2009-08-13 WO disclosed
US-20090197067-A1 Novel Positive Photosensitive Resin Compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2009-08-06 US disclosed